Speaker: Antonio Agapito - Duration: ca. 45 min incl. Q&A

This presentation delves into the crucial aspects of thermal design processes in electronic devices. We will unravel the intricacies of managing heat in modern devices, crucial for enhancing performance and longevity. Covering methodologies, materials, and simulations we will consider a real-world application, providing insights into effective thermal design strategies. Attendees will gain a concise yet comprehensive understanding of the importance of considering thermal management from the beginning in electronic design.

Speaker: Mohamed AlAlami - Duration: ca. 45 min incl. Q&A

In this presentation we aim provide an overview of design options including integrated IC and discrete IC options as well as a fully integrated module . A study of a practical discrete PoE power stage design will be conducted. We will look at how to go from a reference design to a fully working prototype. This will involve transformer design and selection, switching devices optimization, loop stability as well as EMC challenges. 

Speaker: Samuel Lamprecht - Duration: ca. 45 min incl. Q&A

With the trend towards larger batteries for energy storage, higher system voltages need to be managed. While battery voltages of up to 800 V are used in electric driven vehicles, battery storage systems with the highest capacity operate at voltages up to 1500 V. These high operating voltages pose various challenges for the components, especially for the transformers. 
In this training, you will learn more about the need for battery management systems, transformer solutions for insulation up to 1500 V and essential safety norms that need to be considered.

Speaker: Alessandro Maggioni, onsemi - Duration: ca. 45 min incl. Q&A

In this seminar, you will discover how to implement a compact, efficient, high-performance PFC-LLC power supply in this seminar. Our focus: a 1 kW, Universal Input, 50 V Output Power Supply. Leveraging onsemi’s NCP1681 Totem pole PFC controller and NCL30159 LLC controller, it delivers high PF and low THD. Through the integration of innovative topologies and the utilization of GaN switches, it ensure superior efficiency in both CC and CV load modes, with a deep SKIP function, making it ideal also for high-power, low profile LED drivers.

Speaker: Sarah Moschüz - Duration: ca. 45 min incl. Q&A

The most common reason why a quartz crystal oscillates outside its frequency is incorrect selection of the capacitors in the oscillation circuit. For this reason, this webinar will take a closer look at the load capacitance of quartz crystals and the correct design of the pierce oscillation circuit. We will look at how to select the right capacitors, the impact of incorrect selection on frequency and what you can do to prevent problems from occurring in the first place. So that the heartbeat of your circuit doesn't get out of sync!

Speaker: Niall Rice - Duration: ca. 45 min incl. Q&A

Finding suitable components can be time consuming and overwhelming. Würth Elektronik’s REDEXPERT is the shortcut for finding the best part for your application.
This introduction video shows how easy and automatic filtering quickly reduces the amount of parts for your requirements. 
It also shows its simulation tools that help selecting part by recommendation and showing the performance at your application conditions.

Speaker: Götz Schattmann - Duration: ca. 45 min incl. Q&A

Traditional Spacers are commonly used in electronic assemblies – but they require a lot to manual effort. 
WE show a proven technology to make your pcb-designs smarter, with less manual effort, a wide variety
of constructive possibilities, highly reliable and intended for automated processing

Speaker: Carlos Roberto Hernandez Gómez - Duration: ca. 45 min incl. Q&A

This session delves into the essentials, applications, and challenges of the cutting-edge world of “Smart LED technology”, with highlights from Würth Elektronik eiSos' innovative portfolio. Special attention is given to a groundbreaking application: a mini WL-ICLED display that packs 105 LEDs into the tiny Feather format of 0.9" x 2.0". This example underscores the programmability, energy efficiency, and dynamic color and brightness control that ICLEDs offer, demonstrating their potential to revolutionize digital displays and visual communication in compact devices.

Speaker: Vamsi Krishman Gajula - Duration: ca. 45 min incl. Q&A

THR is a reflow soldering technology that emerged in the 1990s to fill the gap between traditional reflow soldering and through hole plug-in components. THR overcomes many shortcomings of wave soldering, simplifies the process flow, and improves the production efficiency. 
Through-Hole Reflow (THR) technology is a process in which through-hole components are soldered to a printed circuit board (PCB) by using reflow technology. It allows soldering the through-hole components and surface-mount components at the same time and with the same reflow profile. This makes the process more cost effective and saves time, as no wave soldering is needed anymore.
THR is more suitable for welding plug-in components in high-density circuit boards and it is becoming more and more popular, not only for EMS (Electronic Manufacturing Services) companies, but also for customers with smaller production lines.
In this presentation we will discuss we will discuss Requirements for the product, layout and stencil suggestion and quality requirement.

Speaker: Diensh Kithany, WAWT - Duration: ca. 45 min incl. Q&A

Dinesh Kithany, the lead industry analyst focusing on the wireless power industry will provide an overview of the wireless power technology including:

•   How the wireless power technology landscape has evolved in the past few years and its current state, with a focus on low-frequency inductive wireless power solutions (100kHz – 330kHz)
• Industry standard-based and proprietary solutions
•  How the adoption of wireless power is growing beyond mobiles, across a wide range of applications and industry sectors such as mobiles, consumers, computing, wearables, medical, industrial, retail, robotics, and infrastructure.
• Highlighting the current challenges faced by the industry.

Speaker: Klaus Schill-Mulack  - Duration: ca. 45 min incl. Q&A

Rigid-flex PCBs are an advanced type of circuit boards and a reliable technology, well established in the market. With this solution, the different technologies and materials available in the PCB market can be combined. This enables innovative designs that can push the boundaries of electronic devices.

You will learn:

• opportunities by rigid-flex-pcbs for different applications
• combination with HDI to optimize layouts

Speaker: Victor Martinez - Duration: ca. 45 min incl. Q&A

Explore modern EMI shielding techniques and learn how to prevent electromagnetic interferences (EMI) from impacting sensitive electronics. This webinar will dig into practical strategies in housing and PCB for mitigating EMI challenges, never losing sight of solutions for emerging technologies like 5G, IoT, Industry IoT,... and the challenge they bring to Electromagnetic Compatibility. 
If you’re keen on improving your device EMC design and performance, this technical session awaits you!

Speaker: Alexander Lang  - Duration: ca. 45 min incl. Q&A

Currently there is no uniformly test method used to define the self-heating of passive components. By introducing, the Performance Rated Current Würth Elektronik eiSos is the first manufacturer of passive components, which are using an IEC standard for defining the self-heating of the components and provides by doing this, the best possible transparence for this value to our customers. 

Speaker: Jens Kehl - Duration: ca. 45 min incl. Q&A

The increase of power handling of Molded Power Inductors has let to a decrease of distances between individual material grains. As an effect, the applied voltages within a DC-to-DC converter have to be considered when selecting an inductor. In this webinar WE will show influencing factors on material level and dangerous effects to a DC-to-DC converter application example.

Speaker: Arnaud Wendling - Duration: ca. 45 min incl. Q&A

PCB-based power distribution units in vehicles already replace a lot of wiring when it comes to power distribution, but did you know that they could do even more for you? For example, reporting their status to your system?
In this presentation, we will highlight different solutions for reporting current flow, fuse status or temperature to your system via CAN bus and dedicated controllers. These solutions can provide useful information to detect or locate problems in the field and during repair activities. 
We will share our experience in implementing many types of sensors, monitoring devices and providing diagnostics via CAN bus. 

Speaker: Jason Chang - Duration: ca. 45 min incl. Q&A

This presentation is about sharing impedance variations and comparative analyses of transmission line structures and connector configurations. In first segment, there is comparative analysis of PCB transmission line structures: straight, changed shape, and angle lines. In second segment, we investigate the impedance variation of connector contacts to PCB, including different mounting type. Strategies for optimizing impedance across transmission lines, connectors, and PCB transmission line contact areas will be the last segment.

Speaker: Carlos Farnos, Jose Rocamora - Duration: ca. 45 min incl. Q&A

The presentation examines the market trends pushing the limits of electronic components, focusing on the critical phenomenon of thermal aging in molded inductors. As current density increases and miniaturization drives components to operate at higher temperatures, the risk of thermal aging issues rises.  In todays presentation we will discuss about reasons and consequences of thermal aging in molded inductors, thermal aging detection, effects of thermal aging in applications and finally Wurth Elektronik's product line up designed for the challenges associated with thermal aging.

Speaker: Carlos Toyos Bada, Cambridge GaN Devices - Duration: ca. 45 min incl. Q&A

ICeGaN™ devices in a Critical Conduction Mode (CrCM) Totem-Pole Power Factor Correction (TPPFC) converter, bring two key benefits; higher efficiency and power density than Si MOSFETs, and simplicity of driving compared to discrete e-GaN devices.
ICeGaN transistors are single chip e-GaN HEMT that can be driven like a Si MOSFET and require only 2 external SMD components, eliminating the need for special gate drivers, complex operating circuits, negative voltage supply, or additional clamping components.

Speakers: Lee Hill, Silent Solutions - Duration: ca. 45 min incl. Q&A

This presentation will discuss and demonstrate the impact of DC bias on the resistance, reactance, and impedance of
SMT EMI suppression ferrites. A vector network analyzer, custom-built test fixture, and DC power supply will
be used to create a live demonstration of the effects of DC bias from 1 to 501 MHz.

Speakers: Ninad Mehta & Kevin Jose - Duration: ca. 45 min incl. Q&A

Micro-Electro-Mechanical-Systems (MEMS) based Inertial Measurement Units (IMUs) are small sensor systems that combine accelerometers, gyroscopes, and sometimes magnetometers to measure and monitor the movement and orientation of objects in three-dimensional space. These sensors work together to provide precise measurements of object motion, including linear acceleration, angular velocity, and magnetic field orientation. The compact size and high accuracy of IMUs make them ideal for a wide range of applications like; Sensor Fusion and Data Processing, Industrial Internet of Things (IIoT), Virtual and Augmented Reality (VR/AR), Aerospace and Navigation, Healthcare and Wearable Devices, Sports and Biomechanics and other emerging applications. As technology continues to advance, IMUs are expected to find even more applications, driving innovation and enhancing human-machine interactions. With their versatility and potential for integration into various devices, IMUs are poised to play a crucial role in shaping the future of digital transformation and improving our daily lives.

Speaker: Pascal Baranger, Adithya Madanahalli - Duration: ca. 45 min incl. Q&A

Secure connection from the field to the cloud always creates a major challenge in any modern IIoT solution. In the wake of new upcoming legislations with respect to data security and privacy, this challenge becomes more pressing.  
The European Commission (EC) has announced the adoption of a Delegated Act to the Radio Equipment Directive (RED), which establishes different cybersecurity requirements that manufacturers, importers and distributors must meet to market their wireless devices and products in the European Union. This act, referred to in the Article 3(3) of the RED aims to ensure a higher level of cybersecurity in such devices, and to strengthen consumers' confidence in them. It takes effect Feb. 1, 2022, and becomes mandatory Aug. 1, 2025, giving device manufacturers a 42-month transition period.
In this presentation, a practical approach to the development of IIoT security will be presented.  The complexity of norms and regulations will be broken down to simple requirements in hardware, software and cloud. Going by the “Security-by-design” approach, solutions will be presented to overcome the same. Finally, a unique solution to secure IoT connectivity will be presented which with a zero-touch approach not only ensures secure provisioning of devices in the field but also the entire device lifecycle management at scale.

Speaker: Marcus Sonst, Rohde & Schwarz - Duration: ca. 45 min incl. Q&A

This presentation is intended for engineers who work on AC/DC power converter designs.

Aluminum electrolytic capacitors are the key components in power supplies. Size, cost, and applicability to higher voltages make them the first choice for capacitors. By reference to various power supply circuits you will be learning the significance of Aluminum electrolytic capacitors for power converters.

We will be simulating capacitor aging, and discussing results from the equivalent series resistor (ESR) model. Needless to say, real measurements support and improve the simulation models. We will be demonstrating the characterization of capacitance and ESR with an LCR meter. In addition, making in-circuit measurements with an oscilloscope increases our knowledge of the circuit properties including valuable application insights.

Speaker: Lukas Hölscher - Duration: ca. 45 min incl. Q&A

Capacitors make up two thirds of all electronic components and there is a huge diversity of technologies which can overwhelm young engineers. 

All capacitors store electrical energy in the electrical field created in a dielectric material and they are used for very diverse applications like voltage stability and filtering. 

How that works differs between tiny MLCCs and huge electrolytic cells, from pF ratings up to the hundreds of Farads in supercapacitors. In this presentation, 

we introduce different capacitor solutions taking into account the advantages and disadvantages and with a focus on the final application.

Speaker: Jens Medler - Duration: ca. 45 min incl. Q&A

Latest developments in CISPR Automotive EMI standards
The presentation will address the applicability of FFT-based receivers for EMI compliance measurements against international standards, gives an inside view on the technology of such receivers and will conclude with practical use cases.

Speaker: Ronald Stärz, Infineon - Duration: ca. 45 min incl. Q&A

Decarbonization is one of the main drivers for highly efficient electronic system solutions in various areas of applications. Robotics defines such an area where numerous Level1 systems are combined. The talk gives insights into the realization of a versatile platform solution to cover all aspects of mobile robots, especially focusing on motor control, battery management and sensing. A wired communication backbone defines the foundation for the individual functional blocks that will be explained in detail, as well as the access to the open source design data to enable collaborational projects.

Speakers: Timur Uludag- Duration: ca. 45 min incl. Q&A

Digital Isolators are a great invention that offer many advantages. They enable the transmission of signals between different voltage levels without a galvanic connection. For example, sensors record temperature values that have to be transmitted to a control center for further processing. The path of the signal can be several tens of meters, which are susceptible to interference. The webinar gives an overview of the requirements to digital isolators in terms of safety, interference free data transmission and common mode interference. The inner structure will be discussed to explain how the isolation is maintained within the device. A discussion about the necessary industry standard digital isolators have to fulfil and which applications they can best serve will complete the big picture.

Speaker: Aldo De Michiel- Duration: ca. 45 min incl. Q&A

Design For Manufacturing (DFM) is the practice of considering the manufacturability of a new product during the design phase. DFM plays a critical part in the whole lifecycle of the component. It is important to consider how the part is going to be manufactured from the early stage of the development. The later we look into it, the more difficult and expensive to optimize the design. In this presentation, we will highlight the key points that need to be considered to optimize reliability, cost and leadtime. The intention is not to give a golden set of rules for best manufacturability, but rather rise some questions to ask ourselves when we are designing a transformer. Although it is good to follow some basic principles, it is better to analyze case by case and chose the optimal tradeoff. We encourage our customers to involve us as early as possible into the development of new components.

Speaker: Kristen Mogensen, Texas Instruments - Duration: ca. 45 min incl. Q&A

Industrial Ethernet has to be robust, reliable and with deterministic timings. This brings requirements to the system that are not visible at the first view. Namely EMC and EMI play an important role to make a system robust in a rugged industrial environment. New technology Single-Pair-Ethernet (SPE) brings much higher challenges into the hardware design than legacy interfaces. This requires careful measures during the design of schematic and layout, and brings interesting challenges during EMC/EMI testing. This session shows real life examples and measurements based on our learnings.