Two applications that describe which products are used for thermal management

Thermal Management

Control Made Easy Over Heat Energy

Applications are getting more and more compact and powerful and switching speeds keep increasing, making thermal management an increasingly important part of electronic design. Thermal management describes the deduction and spreading of heat in electronic devices to ensure their durability and safety. 

There are different solutions to manage heat in the application, such as gap filling solutions, products for heat spreading and hybrid solutions, which can help transfer the heat energy in different directions. With the right heat management, nothing is in the way of a long-lasting and safe application.
 
We would like to support you with customized solutions, personalized advice and our product guidelines, which you will find in the individual products sites!

Our Solutions

  • Thermal Transfer Tape WE-TTT - one wide and one narrow roll with blue transfer ribbon

    Gap Filling

    Gap filling solutions provide the possibility to close gaps between components and cooling assemblies. This way the lowest thermal resistance path is provided for heat to flow through

  • Two rectangular and one round graphite sheet side by side

    Heat Spreading

    Heat spreaders spread heat energy over a surface. This enables the use of larger surfaces to enhance heat transfer as well as the use of cooling assemblies larger that the hot component.

  • Three rectangular foam profiles in different sizes

    Hybrid Solutions

    Hybrid solutions bring into one the best characteristics from gap filling and heat spreading. They provide a silicon-free alternative to traditional elastomer gap fillers as well as other benefits.

Employee on the phone

Customized Solutions

Customized Solutions

No Article That Suits Your Needs? No Problem!
We Offer Customized Solutions

Support und Service

We Are Happy To Offer Technical Support and Our Various Other Services