The future of electronics is tending towards higher reliability, more functions and increasing miniaturization. Efficient use of shrinking package volumes and tiny surfaces is becoming increasingly important. The spectrum of applications ranges from the automotive industry and industrial electronics to medical technology and sensor technology.

Embedding technology serves as a solution for reduced installation space. Active or passive components are brought into the printed circuit board using an embedding process so that they are completely integrated into the structure. We distinguish between four manufacturing processes:

• SOLDER.embedding: Massive SMD components are soldered onto structured inner layers and embedded by a multilayer press process. Both passive and active components can be used for this variant.
• MICROVIA.embedding: This variant is based on direct contacting of the components by microvias. For this purpose, the chips of active or passive components are bonded to a copper foil with special pad metalization and embedded by a multilayer pressing process.
• FLIP-CHIP.embedding: Unpackaged chips of active components are provided with bumps and bonded to structured inner layers. The anisotropic conductive adhesive establishes the electrical connection. The flip chip is embedded in a multilayer press process.
• COPPER.embedding: High currents and logic require smart High-Current Multilayer PCBs. The solution is to combine multilayer circuits with locally embedded copper profiles. This enables the best possible "1 PCB solution" in terms of system costs and system size, signal integrity, wiring density, local current carrying capacity and thermal efficiency. Error-prone and expensive connections between modules of different technologies can be eliminated.