WE SYSTEMS - Bonding & Systems

We provide you with a combination of wire bonding services, PCB and processing of customized systems

Advantages of Würth Elektronik wire bonding technology

Flexibility in terms of chip, housing and substrate geometry
Unique solutions, especially for sensors
Guarantee of bond quality through standardized procedures (e.g. pull-off test)
Processing of different metallizations for the pads on the substrate
Reduction in manufacturing costs
High reliability

Wire bonding is the basic technology in which micro-welding is used to create an electrical connection between the chip contact surfaces (pads) and the chip carrier or substrate via micro-wires. This process is also known as chip-on-board (COB). A complete COB process includes die bonding, wire bonding and the protection of the bare chip with a suitable encapsulant. We have experience with all common surfaces and numerous tests have proven the high reliability of our assembly and bonding techniques.

We provide you with the right combination of wire bonding service and PCB - from a single source. We would be happy to provide you with a customized offer.

Advantages of Würth Elektronik systems

Are you looking for a partner for services “outside the PCB”?
Would you like to concentrate on your core business and need a professional service provider to take care of production from prototype to small and large series?
Then you've come to the right place as a system provider!

Case study 1: Customer-specific assembly of electronic components, soldering work and final testing
Case study 2: Customer-specific planning, assembly of different (electronic and other) materials and

materials and assembly of the end product

Please feel free to contact us.

Wire Bonding

Ball-wedge bonding

Thermosonic (TS) bonding is usually carried out at 120°-150°C. Bonding at room temperature is possible with a narrow process window.
Processable wires: Au, Cu, Cu/Pd, Cu/Pd/Au.
Very high flexibility with loop geometries.
Advantage: high speed - depending on layout, substrate, loop geometry, etc.
Standard bonding process for high-pole optical sensors, ASICs, controllers, photodiodes, etc.

Wedge-wedge bonding

Usually ultrasonic (US) bonding process at room temperature.
TS bonding when using non Al wires.
Preferred for flat loop geometry and extreme fine pitch with parallel wires.
Advantage: Al bonding at room temperature.
Standard bonding process for chip-on-board applications on printed circuit boards, sensor groups, etc.

Overview wire bonding

Die bonding

Fully automatic precision loading

Fully automatic chip setting incl. dosing
High repeat accuracy leads to consistently high quality
Recording of dies (chips) from wafer, wafer pack,...
Wafer mapping enables digital assignment of components and traceability

Die bonding

Precision chip setting

Positioning of components with an accuracy of +/- 1 µm
Motorized Z-axis with adjustable setting parameters and force monitoring for highly sensitive components

Gold wire bonding

Ball-wedge bonding
- Fully automatic
- Manual
Application examples
- LED applications
- Sensor technology
- Camera applications
- ...
Other wire types
- after consultation with our specialists
Design Rules

Aluminium wire bonding

Wedge-wedge bonding
- fully automatic
- manual
Application examples
- LED applications
- sensor technology
- Camera applications
- ...
Other wire types
- after consultation with our specialists

Further bonding materials

In wire bonding, we use a variety of bonding materials to meet the different requirements. These include

Gold (Au),
copper (Cu),
copper/palladium (Cu/Pd),
copper/palladium/gold (Cu/Pd/Au) and
aluminum (Al).

These materials ensure high reliability and optimum performance of your connections.

Pull-off & shear tests

We use pull-off and shear tests to ensure that the connection between the chip and substrate meets the specified values. Our documentation contains the exact test results.

Quality for our customers
- Bond tests (DVS 2811)
- Shear test (DVS 2811)
- Peel test (DVS 2811)
- Grindings

A close-up of a metal testing machine in a laboratory, featuring a metallic specimen held by a red clamp. The setup appears to be for pull-off or shear tests.

Fully automatic dispensing

Our automatic dispensing system guarantees consistently high quality for small batches.

Highest quality
- Uniform dispensing pattern for the highest demands
- Customer-specific programming
- Dispensing compound according to customer specifications

A detailed image of a mechanical process where a nozzle dispenses blue substance onto a metal sheet in evenly spaced lines.

Manual dispensing

A protective potting compound is manually applied to the bonding wires and connections.

To the point

Customized dispensing processes, e.g.
- dam-and-fill
- underfill
- Globetop
- ...
Dispensing tests

Manual assembly

Customized special solutions
Manual placement of SMD components
Application of solder paste via screen printing or dispensing

Systems

We are your partner for various joining techniques:

bonding
soldering
pressing
screwing
assembly work
...

We assemble different materials, housing parts and printed circuit boards into complete modules according to your specifications. On request, we can also take care of the complete assembly right through to the final product ready for delivery.

Our know-how and modern machinery guarantee the best results. This also includes special machines for customer-specific requirements.

Get in touch with us directly!

Overview Systems

Customized assembly & solutions

We are your partner for

individual assembly and joining work, e.g.
- gluing
- filling
- soldering
- welding
- etc.
Development of the production process
Realization of the production
Small, medium and series production