- Shielding & Grounding, Thermal Management
- 07. May 2019
Combined solutions for thermal management and electromagnetic shielding
Latest Technical Papers
Nowadays, electronics are getting smaller and smaller, which means that heat and electromagnetic interference are ever-increasing problems. Our technical paper „Combined solutions for thermal management and electromagnetic shielding” describes solutions that cover both thermal management and EMI shielding.
This paper was first published at the PCIM Europe2019 conference.
To the technical paper.
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