Partial vias play a decisive role in the miniaturization of printed circuit boards.
These are buried vias and microvias, which can be combined in different ways. We call microvias placed directly in solder pads "microvia-in-pad".
This saves valuable space, and since microvias are very small blind holes, they can also be integrated into very small solder pads. This is crucial for unbundling miniaturized or complex components such as micro BGAs.
