WE-TTT Thermal Transfer Tape | Thermal Management | Würth Elektronik Product Catalog

OverviewAll product units Product unitThermal Management Product familyGap Filling Solutions Product seriesWE-TTT Thermal Transfer Tape

WE-TTT Thermal Transfer Tape

Characteristics

Customizable in size and shape
No MOQ or tooling costs
No need for additional mechanical fixing of cooling assemblies
Double-sided adhesive surface
High mechanical strength
Ideal if a thin bond is required
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Applications

Power semiconductors
Graphic processing units
Microprocessors
Chipsets
Memory modules
Cooling assemblies

Products

Order Code	Datasheet	Downloads	L (m)	W (mm)	H (mm)	κ (W/(m*K))	Dielectric Strength (kV/mm)	Adhesive Strength (N/ cm)	Samples
403012008	SPEC	3 files EDA models: Components ZIP ANS ANSYS_WE-TTT_Thermal_Transfer_Tape (rev22a).a3dcomp \| 262.2 KB CAD files ZIP IGS Download_IGS_403012008 (rev1).igs \| 3.8 MB STP Download_STP_403012008 (rev1).stp \| 1.2 MB Download all 3 files as zip archive ZIP	25	8	0.2	1	4	5.79
403012050	SPEC	4 files EDA models: Components ZIP ANS ANSYS_WE-TTT_Thermal_Transfer_Tape (rev22a).a3dcomp \| 262.2 KB CAD files ZIP 3D 403012050_3d (rev1).pdf \| 11.4 MB IGS Downloads_IGS_403012050 (rev1).igs \| 3.8 MB STP Downloads_STP_403012050 (rev1).stp \| 1.2 MB Download all 4 files as zip archive ZIP	25	50	0.2	1	4	5.79

Order Code	Datasheet
403012008	SPEC
403012050	SPEC

Samples

Order Code	Datasheet	Downloads	L (m)	W (mm)	H (mm)	κ (W/(m*K))	Dielectric Strength (kV/mm)	Adhesive Strength (N/ cm)	Samples

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