Characteristics
- Customizable in size and shape
- No MOQ or tooling costs
- No need for additional mechanical fixing of cooling assemblies
- Double-sided adhesive surface
- High mechanical strength
- Ideal if a thin bond is required
- Do you wish an individual offer for WE-TTT? Request now! Request for customized components WE-TTT
Applications
- Power semiconductors
- Graphic processing units
- Microprocessors
- Chipsets
- Memory modules
- Cooling assemblies
Products
| Order Code | Datasheet | Downloads | Status | L (m) | W (mm) | H (mm) | κ (W/(m*K)) | Dielectric Strength (kV/mm) | Adhesive Strength (N/ cm) | Samples |
|---|---|---|---|---|---|---|---|---|---|---|
| 403012008 | SPEC | 3 files | Active i| Production is active. Expected lifetime: >10 years. | 25 | 8 | 0.2 | 1 | 4 | 5.79 | |
| 403012050 | SPEC | 4 files | Active i| Production is active. Expected lifetime: >10 years. | 25 | 50 | 0.2 | 1 | 4 | 5.79 |
| Samples |
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| Order Code | Datasheet | Downloads | Status | L (m) | W (mm) | H (mm) | κ (W/(m*K)) | Dielectric Strength (kV/mm) | Adhesive Strength (N/ cm) | Samples |
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