Topologie | Sonstige Topologie |
The ADM3055E/ADM3057E are 5 kV rms and 3 kV rms isolated controller area network (CAN) physical layer transceivers with integrated isolated dc-to-dc converters. The ADM3055E/ ADM3057E meet flexible data rate (CAN FD) requirements for operation to 5 Mbps and higher and comply with the ISO 11898-2: 2016 standard. The ADM3055E/ADM3057E are capable of supporting data rates as high as 12 Mbps. The devices employ Analog Devices, Inc., iCoupler® technology to combine a 3-channel isolator, a CAN transceiver, and an Analog Devices isoPower® dc-to-dc converter into a single, surfacemount, small outline integrated circuit (SOIC) package. The devices are powered by a single 5 V supply, realizing a fully isolated solution for CAN and CAN FD. Radiated emissions from the high frequency switching of the dc-to-dc convertors are kept below EN 55022 Class B limits by continuous adjustments to the switching frequency. The ADM3055E/ADM3057E provide complete isolation between the CAN controller and physical layer bus. Safety and regulatory approvals (pending) for 5 kV rms isolation voltage, 10 kV surge test, and 8.3 mm creepage and clearance ensure the ADM3055E meets application reinforced isolation requirements. The ADM3057E has an isolation voltage of 3 kV rms and 7.8 mm creepage in a 20-lead, wide body SOIC. Low propagation delays through the isolation support longer bus cables. Slope control mode is available for standard CAN at low data rates. Standby mode minimizes power consumption when the bus is idle or if the node goes offline. Silent mode allows the TXD input to be ignored for listen only mode. Dominant timeout functionality protects against bus lock up in a fault condition. The current limiting and thermal shutdown features protect against output short circuits. The devices are fully specified over an industrial temperature range of −40°C to +105°C.
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | PCB/Kabel/Panel | Modularity | Wire Section | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Pins (Value) (pcs) | Reihen | H (mm) | Gender | Typ | IR (A) | Verpackung | Anwendung | Montageart | Betriebstemperatur | Arbeitsspannung (V (AC)) | Muster | |
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618009231221 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-DSUB 8.08 mm Male Angled PCB Connector w. Hex Screw | PCB | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 5000 MΩ | – | 30.8 | – | – | 9 | – | – | Männlich | Angled | 3 | Tray | – | – | -55 °C up to +105 °C | 125 | ||
691213710003 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-TBL Series 213 - 5.00 mm Horiz.l Entry Modular | PCB | Ja | 26 to 16 (AWG) 0.5 to 1.5 (mm²) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 15 | – | – | 3 | – | – | – | Horizontal | 10 | Karton | Rising Cage Clamp | THT | -40 °C up to +105 °C | 250 | ||
150060GS75000 | SPEC | 25 Dateien Strahldaten
| Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMCW SMT Mono-color Chip LED Waterclear | – | – | – | 525 | Grün | 515 | 430 | 3.2 | InGaN | 140 | – | – | – | 0603 | – | – | – | 1.6 | 0.8 | – | – | – | 0.7 | – | – | – | Tape and Reel | – | SMT | -40 °C up to +85 °C | – | |||
885012206014 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 10 V(DC) | – | – | – | – | – | – | – | – | – | – | 10 nF | ±10% | 10 | 0603 | 5 | 10 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.4 | – | – | 0.8 | – | – | – | 7" Tape & Reel | – | – | -55 °C up to +125 °C | – | |||
885012206046 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 16 V(DC) | – | – | – | – | – | – | – | – | – | – | 100 nF | ±10% | 16 | 0603 | 3.5 | 5 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.4 | – | – | 0.8 | – | – | – | 7" Tape & Reel | – | – | -55 °C up to +125 °C | – | |||
885012206073 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | – | – | – | 220 nF | ±10% | 25 | 0603 | 3.5 | 2.3 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.4 | – | – | 0.8 | – | – | – | 7" Tape & Reel | – | – | -55 °C up to +125 °C | – | |||
885012207026 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 10 V(DC) | – | – | – | – | – | – | – | – | – | – | 10 µF | ±10% | 10 | 0805 | 10 | 0.01 GΩ | X7R Klasse II | 2 | 1.25 | 0.5 | – | – | 1.25 | – | – | – | 7" Tape & Reel | – | – | -55 °C up to +125 °C | – | |||
885012207090 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | 4.7 nF | ±10% | 50 | 0805 | 2.5 | 10 GΩ | X7R Klasse II | 2 | 1.25 | 0.5 | – | – | 0.8 | – | – | – | 7" Tape & Reel | – | – | -55 °C up to +125 °C | – | |||
61300211121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 1000 MΩ | – | 5.08 | – | – | 2 | Single | – | Pin Header | Gerade | 3 | Beutel | – | THT | -40 °C up to +105 °C | 250 | ||
61300311121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 1000 MΩ | – | 7.62 | – | – | 3 | Single | – | Pin Header | Gerade | 3 | Beutel | – | THT | -40 °C up to +105 °C | 250 | ||
61300821121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Dual Pin Header | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 1000 MΩ | – | 10.16 | – | – | 8 | Dual | – | Pin Header | Gerade | 3 | Beutel | – | THT | -40 °C up to +105 °C | 250 |
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Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | PCB/Kabel/Panel | Modularity | Wire Section | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Pins (Value) (pcs) | Reihen | H (mm) | Gender | Typ | IR (A) | Verpackung | Anwendung | Montageart | Betriebstemperatur | Arbeitsspannung (V (AC)) | Muster |
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