Topologie | Sonstige Topologie |
CN0401 is an Arduino Uno compatible isolated controller area network with flexible data rate (CAN FD) communications port. The circuit interfaces to the local development platform via Serial Peripheral Interface (SPI) providing a simple method to add field bus communication to new and existing designs. CN0401 enables both the higher bandwidth CAN FD data rates (up to 8Mbps) demanded by modern multi-node CAN FD networks and the rugged electromagnetic compatibility (EMC) performance required by industrial environments.The circuit uses the integrated auxiliary isolated digital channel of the ADM3055E transceiver for runtime configuration of the bus termination. The switchable termination circuitry connects a 120 Ω split termination with common-mode filtering capacitor between the CAN FD bus lines. Switchable termination allows on-the-fly software configuration of termination locations when the CAN FD bus is physically altered. Using switchable termination, each node can be used at any physical location without mechanical changes to the nodes and software can track the position of terminations in the network.Additionally, the circuit can be set by the development platform to a reduced power standby state. While in the standby state, the isolated CAN FD communications port will notify the development platform of a remote wake-up request being transmitted by a remote CAN FD node to the CAN FD bus.With the ADM3055E CAN FD transceiver, the circuit provides reinforced signal and power isolation between the node and CAN FD bus. Electrical connection to the CAN FD bus may be made either by screw terminal or the CAN CiA 303-1 male 9-pin sub-D port. Because the ADM3055E transceiver has an integrated isolated dc-to-dc converter, it does not require external power to be present on the CAN FD bus. The examples focus on CAN FD networks however this circuit is backwards compatible with classical CAN networks.
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Anwendung | PCB/Kabel/Panel | Modularity | Wire Section | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Pins (Value) (pcs) | Reihen | H (mm) | Gender | Typ | IR (A) | Verpackung | Montageart | Betriebstemperatur | Arbeitsspannung (V (AC)) | Muster | |
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691213710003 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-TBL Series 213 - 5.00 mm Horiz.l Entry Modular | Rising Cage Clamp | PCB | Ja | 26 to 16 (AWG) 0.5 to 1.5 (mm²) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 15 | – | – | 3 | – | – | – | Horizontal | 10 | Karton | THT | -40 °C up to +105 °C | 250 | ||
150060GS75000 | SPEC | 25 Dateien Strahldaten
| Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMCW SMT Mono-color Chip LED Waterclear | – | – | – | – | 525 | Grün | 515 | 430 | 3.2 | InGaN | 140 | – | – | – | 0603 | – | – | – | 1.6 | 0.8 | – | – | – | 0.7 | – | – | – | Tape and Reel | SMT | -40 °C up to +85 °C | – | |||
885012206014 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 10 V(DC) | – | – | – | – | – | – | – | – | – | – | – | 10 nF | ±10% | 10 | 0603 | 5 | 10 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.4 | – | – | 0.8 | – | – | – | 7" Tape & Reel | – | -55 °C up to +125 °C | – | |||
885012206046 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 16 V(DC) | – | – | – | – | – | – | – | – | – | – | – | 100 nF | ±10% | 16 | 0603 | 3.5 | 5 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.4 | – | – | 0.8 | – | – | – | 7" Tape & Reel | – | -55 °C up to +125 °C | – | |||
885012206073 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | – | – | – | – | 220 nF | ±10% | 25 | 0603 | 3.5 | 2.3 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.4 | – | – | 0.8 | – | – | – | 7" Tape & Reel | – | -55 °C up to +125 °C | – | |||
885012207026 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 10 V(DC) | – | – | – | – | – | – | – | – | – | – | – | 10 µF | ±10% | 10 | 0805 | 10 | 0.01 GΩ | X7R Klasse II | 2 | 1.25 | 0.5 | – | – | 1.25 | – | – | – | 7" Tape & Reel | – | -55 °C up to +125 °C | – | |||
885012207090 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | – | 4.7 nF | ±10% | 50 | 0805 | 2.5 | 10 GΩ | X7R Klasse II | 2 | 1.25 | 0.5 | – | – | 0.8 | – | – | – | 7" Tape & Reel | – | -55 °C up to +125 °C | – | |||
618009231221 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-DSUB 8.08 mm Male Angled PCB Connector w. Hex Screw | – | PCB | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 5000 MΩ | – | 30.8 | – | – | 9 | – | – | Männlich | Angled | 3 | Tray | – | -55 °C up to +105 °C | 125 | ||
61300211121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 1000 MΩ | – | 5.08 | – | – | 2 | Single | – | Pin Header | Gerade | 3 | Beutel | THT | -40 °C up to +105 °C | 250 | ||
61300311121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 1000 MΩ | – | 7.62 | – | – | 3 | Single | – | Pin Header | Gerade | 3 | Beutel | THT | -40 °C up to +105 °C | 250 | ||
61300821121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Dual Pin Header | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 1000 MΩ | – | 10.16 | – | – | 8 | Dual | – | Pin Header | Gerade | 3 | Beutel | THT | -40 °C up to +105 °C | 250 |
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Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Anwendung | PCB/Kabel/Panel | Modularity | Wire Section | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Pins (Value) (pcs) | Reihen | H (mm) | Gender | Typ | IR (A) | Verpackung | Montageart | Betriebstemperatur | Arbeitsspannung (V (AC)) | Muster |
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