IC-Hersteller AnDAPT Inc
IC-Hersteller (99)
- Alle Hersteller
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Details
| Topologie | Abwärtswandler |
| IC-Revision | 1.0 |
Beschreibung
The AmP™ device is an FPGA based platform for creating a custom Power Management Integrated Circuit (PMIC). The AmP device is customized by adding available Power Components designs based on system requirements. AmP device customization is as easy as using WebAmp™ application software to produce a customized PMIC in a very short period of time. AmP devices can be used to power FPGAs, Processors, Microcontrollers, and ASICs by integrating multiple power rails into single chip designs. The AmP device input voltage range is 4.5V to 20V. The AmP device is targeted for wall-powered applications or 2S-4S Li-Ion battery packs. AmP devices have up to 4 additional integrated LDOs of which two are fixed output voltages (3.3V and 1.2V) and two are user programmable.
Eigenschaften
- Enables On-Demand power management
- Integrate application targeted Power Components
- Power Blocks for a variety of topologies
- Scalable Integrated N-channel MOSFETs (SIM)
- Current sense for protection, telemetry, regulation
- Build Switching topologies - Buck, Boost, Buck-Boost
- Build Linear topologies - LDO, Load Switch
- Build Mixed topologies - Battery Charger
- Build BLDC (Motor Control) topologies – H-Bridge
- Sensor Blocks, sensing voltages and currents
- Regulation, protection and telemetry
- Adaptive Digitizer (ADi)
- Threshold Comparators (ThC)
- Summation Amplifier (SuM)
- Noise-Immune Reference (Nref) Array
- Analog fabric connectivity for sensor signals
- Digital μLogic fabric connectivity: Analog/Digital Blocks
- Analog and Digital GPIOs, LUTs for logic & Interface
- Integrated Compensator RAM (CRAM)
- On-demand POL control loops and interfaces
- Precision Modulation Timer Array
- Industry first: Analog Proficiency – Digital Flexibility
Typische Anwendungen
- Power Component Integrator / Digital power management IC / Battery Charger
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | Montageart | IR 1 (A) | Arbeitsspannung (V (DC)) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | L (µH) | IRP,40K (A) | ISAT1 (A) | ISAT,30% (A) | RDC (mΩ) | fres (MHz) | Material | Endurance (h) | Betriebstemperatur | IRIPPLE (mA) | Z (mΩ) | ILeak (µA) | Ø D (mm) | Pins (Value) (pcs) | Reihen | H (mm) | Gender | Typ | IR (A) | Verpackung | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 150060GS75000 | SPEC | 25 Dateien Strahldaten
| Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMCW SMT Mono-color Chip LED Waterclear | 525 | Grün | 515 | 430 | 3.2 | InGaN | 140 | SMT | – | – | – | – | – | 0603 | -40 °C up to +85 °C | – | – | – | 1.6 | 0.8 | – | – | – | – | – | – | – | – | – | -40 °C up to +85 °C | – | – | – | – | – | – | 0.7 | – | – | – | Tape and Reel | ||
| 150060RS75000 | SPEC | 25 Dateien Strahldaten
| Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMCW SMT Mono-color Chip LED Waterclear | 625 | Rot | 630 | 250 | 2 | AlInGaP | 140 | SMT | – | – | – | – | – | 0603 | -40 °C up to +85 °C | – | – | – | 1.6 | 0.8 | – | – | – | – | – | – | – | – | – | -40 °C up to +85 °C | – | – | – | – | – | – | 0.7 | – | – | – | Tape and Reel | ||
 | 744316100 | SPEC Anstehende PCNAufgrund einer anstehenden PCN wird sich in Kürze das Datenblatt des ausgewählten Produktes ändern. Anbei finden Sie das neue Datenblatt, sowie das noch gültige Datenblatt. Bei weiteren Fragen wenden Sie sich bitte an Ihren Vertriebsmitarbeiter. | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-HCI SMT-Hochstrominduktivität | – | – | – | – | – | – | – | SMT | 11.5 | – | – | – | – | 5040 | -40 °C up to +150 °C | – | – | – | 5.5 | 5.3 | – | 1 | 14.8 | 5.5 | 11.5 | 4.75 | 158 | Superflux | – | -40 °C bis zu +150 °C | – | – | – | – | 2 | – | 4 | – | – | 11.5 | – | ||
 | 865080553014 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-ASLI Aluminium-Elektrolytkondensatoren | – | – | – | – | – | – | – | V-Chip SMT | – | – | 220 µF | ±20% | 35 | 8.0 x 10.5 | -55 °C up to +105 °C | 14 | 0.454545 MΩ | – | 10.5 | 8.3 | – | – | – | – | – | – | – | – | 2000 | -55 °C bis zu +105 °C | 570 | 210 | 77 | 8 | – | – | – | – | – | – | 15" Tape & Reel | ||
 | 885012206095 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | 100 nF | ±10% | 50 | 0603 | -55 °C up to +125 °C | 3 | 5 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.4 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.8 | – | – | – | 7" Tape & Reel | ||
| 885012207098 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | 100 nF | ±10% | 50 | 0805 | -55 °C up to +125 °C | 2.5 | 5 GΩ | X7R Klasse II | 2 | 1.25 | 0.5 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.8 | – | – | – | 7" Tape & Reel | ||
 | 694108106102 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-DC DC Power Jack Right Angled SMT Ø 6.4 with 4 soldering pads & pegs | – | – | – | – | – | – | – | SMT | 5 | 24 | – | – | – | – | -40 °C up to +85 °C | – | 100 MΩ | – | – | – | – | – | – | – | – | – | – | – | – | -40 °C bis zu +85 °C | – | – | – | – | – | – | – | – | Right Angled | 5 | Tape and Reel | |
 | 61300311121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | – | – | – | THT | – | 250 | – | – | – | – | -40 °C up to +105 °C | – | 1000 MΩ | – | 7.62 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 3 | Single | – | Pin Header | Gerade | 3 | Beutel | |
 | 61300421121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Dual Pin Header | – | – | – | – | – | – | – | THT | – | 250 | – | – | – | – | -40 °C up to +105 °C | – | 1000 MΩ | – | 5.08 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 4 | Dual | – | Pin Header | Gerade | 3 | Beutel |
| Artikel Nr. | Datenblatt | Simulation | |
|---|---|---|---|
| 150060GS75000 | SPEC | |
| 150060RS75000 | SPEC | |
| 744316100 | SPEC Anstehende PCNAufgrund einer anstehenden PCN wird sich in Kürze das Datenblatt des ausgewählten Produktes ändern. Anbei finden Sie das neue Datenblatt, sowie das noch gültige Datenblatt. Bei weiteren Fragen wenden Sie sich bitte an Ihren Vertriebsmitarbeiter. | |
| 865080553014 | SPEC | |
| 885012206095 | SPEC | |
| 885012207098 | SPEC | |
| 694108106102 | SPEC | – |
| 61300311121 | SPEC | – |
| 61300421121 | SPEC | – |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | Montageart | IR 1 (A) | Arbeitsspannung (V (DC)) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | L (µH) | IRP,40K (A) | ISAT1 (A) | ISAT,30% (A) | RDC (mΩ) | fres (MHz) | Material | Endurance (h) | Betriebstemperatur | IRIPPLE (mA) | Z (mΩ) | ILeak (µA) | Ø D (mm) | Pins (Value) (pcs) | Reihen | H (mm) | Gender | Typ | IR (A) | Verpackung | Muster |
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