Topologie | Abwärtswandler |
Eingangsspannung | 12 V |
Ausgang 1 | 0.6 V / 1.5 A |
IC-Revision | 1 |
The ARD_X_KUP_A is a scalable power supply designed to provide power to Xilinx Kintex UltraScale+ devices. The design is scalable and flexible to support the FPGA family SKUs from the most basic XCKU3P to the most feature-rich and power hungry XQKU15P. The programmable system integration, upward scalability, high performance/watt numbers and reduced time-to-market features of the AnDAPT’s AmP PMIC makes it an ideal match for handling power management responsibilities of Kintex UltraScale+ FPGA solutions.
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | L (µH) | IRP,40K (A) | ISAT,30% (A) | RDC typ. (mΩ) | fres (MHz) | VOP (V) | Montageart | Muster | |
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885012105018 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | 100 nF | ±20% | 25 | 0402 | -55 °C up to +85 °C | 10 | 5 GΩ | X5R Klasse II | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | |||
885012108018 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 16 V(DC) | 22 µF | ±20% | 16 | 1206 | -55 °C up to +85 °C | 10 | 0.005 GΩ | X5R Klasse II | 3.2 | 1.6 | 1.6 | 0.5 | 7" Tape & Reel | – | – | – | – | – | – | – | |||
74438366010 | SPEC | 10 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-MAPI SMT-Speicherdrossel | – | – | – | 5020 | -40 °C up to +125 °C | – | – | – | 5.6 | 5.6 | 2.1 | – | – | 1 | 11.1 | 14 | 11.4 | 50 | 80 | SMT |
Artikel Nr. | Datenblatt | Simulation | |
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885012105018 | SPEC | ||
885012108018 | SPEC | ||
74438366010 | SPEC |
Muster |
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Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | L (µH) | IRP,40K (A) | ISAT,30% (A) | RDC typ. (mΩ) | fres (MHz) | VOP (V) | Montageart | Muster |
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