IC-Hersteller AnDAPT Inc

IC-Hersteller (99)

AnDAPT Inc AmP8DB6QF65 | Demoboard AmP8XEB1 (ARD_X_ZUM_C1_IC2)

Xilinx Zynq UltraScale+ MPSoC Performance Optimized Reference Design PMIC

Details

TopologieAbwärtswandler
Eingangsspannung12 V
Ausgang 10.9 V / 2.3 A

Beschreibung

The ARD_X_ZUM_C1 is a scalable power supply designed to provide power to Xilinx Zynq UltraScale+ (ZU+) MPSoC Performance optimized FPGAs.The design is scalable to support the most basic ZU2CG device with a dual-core Arm Cortex-53 application processor and dual-core Arm Cortex-R5F real-time processor to ZU19EG products that have graphics processing capabilities (GPUs) to ZU5EV devices with quad-core Arm Cortex-A53 application processor and dual-core Arm Cortex-R5 real-time processor with video processing abilities.

Eigenschaften

  • Design supplies all 31 voltage rails (Figure 1) to Xilinx ZU+ MPSoC device using two AnDAPT PMIC (Figure 3) containing-
  • Seven sync buck switchers (C200) of 6 A capacity each
  • One DrMOS controller (C860) and DrMOS IC of 40 A capacity
  • Two LDOs (C710) of 2 A capacity
  • Inbuilt sequencer (C420) meeting Xilinx turn-on and turnoff timing requirements
  • Soft start/shut-down
  • Only one input 12 V (±10%) required
  • Adjustable output voltage with down to 2.4 mV resolution
  • 1% voltage accuracy
  • Efficiency up to 90%
  • QFN 5x5 sq. mm package
  • Protections:Input Undervoltage Lockout (ViUVLO), Output Under voltage Lockout (VoUVLO),Overcurrent Protection(OCP), Output Overvoltage Protection (OVP), Over temperature Protection (OTP), Short-circuit Protection (SCP)
  • Easy to change any voltage, currents or sequencing (if required) including enable/disable rails using web-basedWebAmp R.D software
  • Power-good flag output and Enable input
  • IC junction temperature range –40°C to +125°C
  • Integrated design lending small PCB footprint
  • Reference design rails meet or exceed Xilinx power performance requirements

Typische Anwendungen

  • Signal processing/Motor control, Low-cost ultrasound, Machine vision/Smart vision, Surveillance/Reconnaissance
  • Cloud computing/Data center, Video processing, Human machine interface
  • Traffic engineering/Flight navigation, Secure solutions
  • Networking

Weiterführende Informationen

Artikeldaten

Artikel Nr. Daten­blatt Simu­lation Downloads Status ProduktserieCTol. CVR
(V (DC))
BauformBetriebstemperaturDF
(%)
RISOKeramiktypL
(mm)
W
(mm)
H
(mm)
Fl
(mm)
VerpackungL
(µH)
IRP,40K
(A)
ISAT,30%
(A)
RDC typ.
(mΩ)
fres
(MHz)
VOP
(V)
Montageart Muster
885012105018SPEC
8 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WCAP-CSGP MLCCs 25 V(DC)100 nF ±20% 25 0402 -55 °C up to +85 °C 105 GΩ X5R Klasse II 1 0.5 0.5 0.25 7" Tape & Reel
885012108021SPEC
8 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WCAP-CSGP MLCCs 25 V(DC)10 µF ±20% 25 1206 -55 °C up to +85 °C 100.01 GΩ X5R Klasse II 3.2 1.6 1.6 0.6 7" Tape & Reel
885012107006SPEC
8 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WCAP-CSGP MLCCs 6.3 V(DC)47 µF ±20% 6.3 0805 -55 °C up to +85 °C 100.002 GΩ X5R Klasse II 2 1.25 1.25 0.5 7" Tape & Reel
74438357015SPEC
10 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WE-MAPI SMT-Speicherdrossel 4030 -40 °C up to +125 °C 4.3 4.3 3.1 1.5 8.2 11 17.1 48 80 SMT
Muster
Artikel Nr. Daten­blatt Simu­lation Downloads Status ProduktserieCTol. CVR
(V (DC))
BauformBetriebstemperaturDF
(%)
RISOKeramiktypL
(mm)
W
(mm)
H
(mm)
Fl
(mm)
VerpackungL
(µH)
IRP,40K
(A)
ISAT,30%
(A)
RDC typ.
(mΩ)
fres
(MHz)
VOP
(V)
Montageart Muster