Topologie | Sonstige Topologie |
Eingangsspannung | 15 V |
IC-Revision | 1.0 |
Evaluation board EB1200-3161 features Broadcom® dual output isolated gate drive optocouplers, ACFL-3161, that drive SiC MOSFETs in a discrete TO-247 package. The board features an integrated capacitor DC Bus with optimized layout that minimizes the commutation loop inductance and shunt-based source current measurement. The EB1200-3161, shown in Figure 1, is developed to support Broadcom customers during their first steps in designing power converter applications with ACFL-3161 drivers. Properties of the board are described in the following sections.
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q | DF (%) | RISO | Keramiktyp | L (mm) | Fl (mm) | Verpackung | W (mm) | H (mm) | IR 1 (A) | Ti | Tl (mm) | Pins (Value) (pcs) | Muster | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
885012008043 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | 100 pF | ±5% | 50 | 1206 | -55 °C up to +125 °C | 1000 | – | 10 GΩ | NP0 Klasse I | 3.2 | 0.6 | 7" Tape & Reel | 1.6 | 0.8 | – | – | – | – | |||
885012208058 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | 100 nF | ±10% | 25 | 1206 | -55 °C up to +125 °C | – | 3.5 | 5 GΩ | X7R Klasse II | 3.2 | 0.6 | 7" Tape & Reel | 1.6 | 0.8 | – | – | – | – | |||
7461057 | SPEC | – | 4 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WP-BUTR REDCUBE PRESS-FIT with internal thread, two-rows | – | – | – | – | -55 °C up to +150 °C | – | – | – | – | – | – | Lose | 7 | 6 | 100 | M3 | 5 | 6 |
Artikel Nr. | Datenblatt | Simulation | |
---|---|---|---|
885012008043 | SPEC | ||
885012208058 | SPEC | ||
7461057 | SPEC | – |
Muster |
---|
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q | DF (%) | RISO | Keramiktyp | L (mm) | Fl (mm) | Verpackung | W (mm) | H (mm) | IR 1 (A) | Ti | Tl (mm) | Pins (Value) (pcs) | Muster |
---|