IC-Hersteller Infineon Technologies
IC-Hersteller (99)
- Alle Hersteller
Analog Devices
Infineon Technologies
Microchip
Onsemi
Renesas
ROHM
STMicroelectronics
Texas Instruments
- 3peak incorporated (27)
- Ablic (23)
- Advanced Power (4)
- Allegro Microsystems (84)
- Alpha & Omega Semiconductor (37)
- AnalogySemi (3)
- AnDAPT Inc (163)
- Anpec (13)
- AXElite (2)
- Backward (6)
- Bright Power Semiconductor (1)
- Broadcom (47)
- Cambridge GaN Devices (18)
- Chipanalog Micro (10)
- Cologne Chips (1)
- Convenient Power (1)
- Dialog Semiconductor (12)
- Diodes Incorporated (238)
- Divimath (8)
- Elmos AG (1)
- EPC (99)
- e-Peas Semiconductors (1)
- Eta Solutions Co. Ltd. (9)
- GaN Systems (7)
- GaNPower (3)
- Giantec (1)
- Gstek Wuxi (1)
- Helix Semiconductor (7)
- Ikanos (3)
- IKON (1)
- Indie Semiconductor (5)
- Innovision Semiconductor Inc (2)
- Intel (80)
- Inventchip Technology (3)
- ISSI (51)
- JoulWatt (20)
- KDPOF (2)
- Kinetic Technology (10)
- Lattice semiconductor Corporation (19)
- Littelfuse (1)
- M3 Technology (M3Tek) (7)
- Macnica (16)
- MaxLinear (175)
- MikroE (8)
- MindCet (2)
- Monolithic Power Systems (931)
- Navitas Semiconductor Inc (6)
- NewEdge Technologies, Inc. (1)
- Nexperia (32)
- Nisshinbo Micro Device Inc. (10)
- Nordic Semiconductor (1)
- Novosense Micro (1)
- NXP (314)
- O2 Micro International Ltd (10)
- On Bright (7)
- Panasonic (2)
- PN Junction Semiconductor (2)
- Power Integrations (102)
- Pulsiv (19)
- Qorvo (87)
- Realsil SuRealsil(tek) Microelectronics (1)
- Richtek (296)
- Sanken Electric Co., Ltd. (16)
- Sckipio (6)
- Semtech (90)
- SG-Micro (33)
- Silanna Semiconductor (8)
- Silergy Corporation (29)
- Silicon Laboratory Inc. (104)
- Silicontent Technology (57)
- Silvertel (56)
- Skycore Semiconductors (1)
- Skyworks (31)
- Southchip (8)
- Summit Wireless (1)
- Tagore Tech (7)
- Taiwan Semiconductor (1)
- TDK Corporation (1)
- Tempo Semiconductor (1)
- Torex (37)
- Toshiba (25)
- Transphorm (21)
- TransSIP (2)
- Union (21)
- uPI Semiconductor (2)
- Valens Semiconductor (18)
- Wise Integration (1)
- Wolfspeed (8)
- Xilinx (22)
- XL Semiconductor (3)
- XYSemi (62)
Infineon Technologies IRSM515-084D | Demoboard EVAL-M1-05-84D
EVAL-M1-05-84D User Manual iMOTION™ Modular Application Design Kit
Details
| Topologie | Sonstige Topologie |
| IC-Revision | 2.1 |
Beschreibung
The EVAL-M1-05-84D evaluation board is a part of the iMOTION™ Modular Application Design Kit for drives (iMOTION™ MADK). The MADK-platform is intended to use various power stages with different control boards. These boards can easily be interfaced through the 20 pin iMOTION™ MADK-M1 interface connector. This evaluation board is designed to give comprehensible solutions of a power stage featuring CIPOS™ Micro. The board is equipped with all assembly groups for sensor less field oriented control (FOC). It provides a single phase AC-connector, rectifier, DC-link and 3-phase output for power. It contains emitter-shunts for current sensing and a voltage divider for DC-link voltage measurement. The EVAL-M1-05-84D evaluation board is available from Infineon. The features of this board are described in the design feature chapter of this document, whereas the remaining paragraphs provide information to enable the customers to copy, modify and qualify the design for production according to their own specific requirements. Environmental conditions were considered in the design of the EVAL-M1-05-84D. The design was tested as described in this document but not qualified regarding safety requirements or manufacturing and operation over the whole operating temperature range or lifetime. The boards provided by Infineon are subject to functional testing only. Evaluation boards are not subject to the same procedures as regular products regarding Returned Material Analysis (RMA), Process Change Notification (PCN) and Product Discontinuation (PD). Evaluation boards are intended to be used under laboratory conditions by specialists only.
Eigenschaften
- 3-phase inverter including high voltage gate drivers
- Integrated bootstrap functionality
- Trench FREDFET with RDS(on) of 0.45 Ω @ 25°C
- Under voltage lockout for all channels
- Matched propagation delay for all channels
- Temperature feedback via NTC applicable for IRSM505-084
- Optimized dV/dt for loss and EMI trade off
- 3.3 V logic compatible and advanced input filter
- Possibility to choose single shunt or leg shunt current sensing
- Driver tolerant to negative transient voltage
- Isolation 1900 Vrms, 1min
- Certified by UL file number E252584
Typische Anwendungen
- energy efficient fans and pumps
- Housing Appliance
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Anwendung | PCB/Kabel/Panel | Modularity | Wire Section | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | VR (V (AC)) | Sicherheitsklasse | dV/dt (V/µs) | DF @ 1 kHz (%) | RISO | Betriebstemperatur | Raster (mm) | L (mm) | W (mm) | Tol. C | Bauform | Betriebstemperatur | Q | DF (%) | Keramiktyp | Fl (mm) | Endurance (h) | IRIPPLE (mA) | ILeak (µA) | Ø D (mm) | Pins (Value) (pcs) | Reihen | H (mm) | G (mm) | Gender | Typ | IR (A) | Verpackung | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 890324025017CS | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-FTX2 Folienkondensatoren | Across the mains | – | – | – | – | – | – | – | – | – | – | 100 nF | 275 | X2 | 300 | 0.1 | 30 GΩ | -40 °C bis zu +105 °C | 15 | 18 | 6 | ±10% | Pitch 15 mm | -40 °C up to +105 °C | – | – | – | – | – | – | – | – | – | – | 12 | 4 | – | – | – | Karton | ||
 | 691216510003S | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-TBL Serie 2165S - 5.08 mm Horizontal Entry Modular w. Rising Cage Clamp | Rising Cage Clamp | PCB | Ja | 12 to 30 (AWG) 3.31 to 0.0509 (mm²) | – | – | – | – | – | – | – | – | – | – | – | – | – | -30 °C bis zu +120 °C | 5.08 | 15.24 | – | – | – | -30 °C up to +120 °C | – | – | – | – | – | – | – | – | 3 | – | – | – | – | Horizontal | 24 | Karton | |
 | 691216910003 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-TBL Serie 2169 - 7.50 mm Horizontal Entry Modular w. Rising Cage Clamp | Rising Cage Clamp | PCB | Ja | 12 to 30 (AWG) 3.31 to 0.0509 (mm²) | – | – | – | – | – | – | – | – | – | – | – | – | – | -30 °C bis zu +120 °C | 7.5 | 22.5 | – | – | – | -30 °C up to +120 °C | – | – | – | – | – | – | – | – | 3 | – | – | – | – | Horizontal | 24 | Karton | |
 | 151034RS03000 | SPEC | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-TMRW THT Mono-color Round Waterclear | – | – | – | – | 621 | Rot | 628 | 2600 | 2 | AlInGaP | 30 | – | – | – | – | – | – | – | – | 3 | 3 | – | 3 mm | -40 °C up to +85 °C | – | – | – | – | – | – | – | – | – | – | 5.3 | – | – | – | – | Lose | ||
 | 860020574012 | SPEC | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-ATG5 Aluminium-Elektrolytkondensatoren | – | – | – | – | – | – | – | – | – | – | – | 220 µF | 35 | – | – | – | – | -40 °C bis zu +105 °C | 3.5 | 11.5 | – | ±20% | – | – | – | 12 | – | – | 2000 | 255 | 77 | 8 | – | – | – | – | – | – | – | Ammopack | ||
| 860021380020 | SPEC | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-ATG5 Aluminium-Elektrolytkondensatoren | – | – | – | – | – | – | – | – | – | – | – | 100 µF | 400 | – | – | – | – | -25 °C bis zu +105 °C | 7.5 | 31.5 | – | ±20% | – | – | – | 15 | – | – | 2000 | 520 | 1200 | 16 | – | – | – | – | – | – | – | Ammopack | ||
 | 885012007063 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | – | 1 nF | 50 | – | – | – | 10 GΩ | – | – | 2 | 1.25 | ±5% | 0805 | -55 °C up to +125 °C | 1000 | – | NP0 Klasse I | 0.5 | – | – | – | – | – | – | 0.8 | – | – | – | – | 7" Tape & Reel | ||
| 885012007065 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | – | 2.2 nF | 50 | – | – | – | 10 GΩ | – | – | 2 | 1.25 | ±5% | 0805 | -55 °C up to +125 °C | 1000 | – | NP0 Klasse I | 0.5 | – | – | – | – | – | – | 0.8 | – | – | – | – | 7" Tape & Reel | ||
| 885012207078 | SPEC | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | – | – | – | – | 1 µF | 25 | – | – | – | 0.5 GΩ | – | – | 2 | 1.25 | ±10% | 0805 | -55 °C up to +125 °C | – | 5 | X7R Klasse II | 0.5 | – | – | – | – | – | – | 1.25 | – | – | – | – | 7" Tape & Reel | ||
| 885012207098 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | – | 100 nF | 50 | – | – | – | 5 GΩ | – | – | 2 | 1.25 | ±10% | 0805 | -55 °C up to +125 °C | – | 2.5 | X7R Klasse II | 0.5 | – | – | – | – | – | – | 0.8 | – | – | – | – | 7" Tape & Reel | ||
| 885012107004 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 6.3 V(DC) | – | – | – | – | – | – | – | – | – | – | – | 10 µF | 6.3 | – | – | – | 0.01 GΩ | – | – | 2 | 1.25 | ±20% | 0805 | -55 °C up to +85 °C | – | 15 | X5R Klasse II | 0.5 | – | – | – | – | – | – | 1.25 | – | – | – | – | 7" Tape & Reel | ||
 | 613020243121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm Angled Dual Socket Header | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 1000 MΩ | – | 2.54 | 25.9 | – | – | – | -40 °C up to +105 °C | – | – | – | – | – | – | – | – | 20 | Dual | – | – | Socket Header | Angled | 3 | Tray |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Anwendung | PCB/Kabel/Panel | Modularity | Wire Section | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | VR (V (AC)) | Sicherheitsklasse | dV/dt (V/µs) | DF @ 1 kHz (%) | RISO | Betriebstemperatur | Raster (mm) | L (mm) | W (mm) | Tol. C | Bauform | Betriebstemperatur | Q | DF (%) | Keramiktyp | Fl (mm) | Endurance (h) | IRIPPLE (mA) | ILeak (µA) | Ø D (mm) | Pins (Value) (pcs) | Reihen | H (mm) | G (mm) | Gender | Typ | IR (A) | Verpackung | Muster |
|---|