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NXP LX2160A-RDB-B
Fully qualified to meet NXP quality and reliability requirements. Available for production quantity orders.
Details
| Topologie | Sonstige Topologie |
| IC-Revision | 00 |
Beschreibung
The LX2160A reference design board provides a comprehensive platform that enables design and evaluation of the LX2160A or LX2162A processors. It comes preloaded with a board support package (BSP) based on a standard Linux kernel.Enables network intelligence with the next generation Datapath (DPPA2) which provides differentiated offload and a rich set of IO, including 10GE, 25GE, 40GE, and PCIe Gen3Delivers unprecedented efficiency and new virtualized networksSupports designs in 5G packet processing, network function virtualization, storage controller, white box switching, network interface cards, and mobile edge computingSupports all six LX2 family members (16-core LX2160A and LX2161A; 12-core LX2120A and LX2122A; and 8-core LX2080A and LX2082A)
Eigenschaften
- Processor:
- LX2160A, 16x Arm® Cortex®-A72 CPU, 2.2GHz
- Memory:
- Two DDR4 UDIMM to 3200MT/s
- 32GB total capacity (16GB per UDIMM)
- Flash: 128MB NOR, 128GB eMMC
- Ethernet:
- One 40G Ethernet QSFP+
- Two 25G Ethernet SFP+
- Two RJ45 10G Ethernet
- Two RJ45 1G Ethernet
- Other IO:
- One PCIe Gen3 x8 slot
- One PCIe Gen3 x4 slot
- Four SATA3.0 connectors
- One USB3.0 Type A connector
- One USB3.0 micro-AB connector
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Pins (Value) (pcs) | Gender | Typ | Montageart | Betriebstemperatur | Arbeitsspannung (V (AC)) | C | Tol. C | VR (V (DC)) | Bauform | Q | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | L (µH) | IRP,40K (A) | ISAT (A) | RDC max. (mΩ) | fres (MHz) | Version | LR (nH) | IR (A) | ISAT1 (A) | ISAT,30% (A) | RDC (mΩ) | Material | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 7447714015 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-PD SMT-Speicherdrossel | 2 | – | – | SMT | -40 °C up to +150 °C | – | – | – | – | 1050 | – | – | – | 10 | 10 | 5 | – | – | 1.5 | – | 12.5 | 6.6 | 69 | Performance | – | 10 | – | – | – | – | ||
 | 744308033 | SPEC Anstehende PCNAufgrund einer anstehenden PCN wird in Kürze eine Änderung am Bauteil durchgeführt. Anbei finden Sie die entsprechende PCN. Bei weiteren Fragen wenden Sie sich bitte an Ihren Vertriebsmitarbeiter. | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-HCM SMT-Hochstrominduktivität | 2 | – | – | SMT | -40 °C up to +125 °C | – | – | – | – | 1070 | – | – | – | 10.1 | 7 | 6.8 | 2.6 | – | 0.33 | 54.3 | – | 396 | 35 | – | 305 | 25 | 27.3 | 32 | 0.37 | MnZn | ||
 | 693061010911 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-CRD SD Card Connector Push & Push with Card Detection 9 pins | 9 | Socket | Push & Push | SMT | -25 °C up to +85 °C | 100 | – | – | – | – | – | 1000 MΩ | – | – | – | – | – | Tape and Reel | – | – | – | – | – | – | – | 0.5 | – | – | – | – | |
 | 885012005057 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | -55 °C up to +125 °C | – | 22 pF | ±5% | 50 | 0402 | 840 | 10 GΩ | NP0 Klasse I | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – |
| Artikel Nr. | Datenblatt | Simulation | |
|---|---|---|---|
| 7447714015 | SPEC | |
| 744308033 | SPEC Anstehende PCNAufgrund einer anstehenden PCN wird in Kürze eine Änderung am Bauteil durchgeführt. Anbei finden Sie die entsprechende PCN. Bei weiteren Fragen wenden Sie sich bitte an Ihren Vertriebsmitarbeiter. | |
| 693061010911 | SPEC | – |
| 885012005057 | SPEC |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Pins (Value) (pcs) | Gender | Typ | Montageart | Betriebstemperatur | Arbeitsspannung (V (AC)) | C | Tol. C | VR (V (DC)) | Bauform | Q | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | L (µH) | IRP,40K (A) | ISAT (A) | RDC max. (mΩ) | fres (MHz) | Version | LR (nH) | IR (A) | ISAT1 (A) | ISAT,30% (A) | RDC (mΩ) | Material | Muster |
|---|