IC-Hersteller Onsemi

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Onsemi NCH-RSL10-101S51 | Demoboard RSL10-SENSE-DB-GEVB Evaluation Board

System-in-Package, Bluetooth® 5 Certified, SDK 3.5

Details

TopologieSensors

Beschreibung

The RSL10−SENSE−DB−GEVK is a comprehensive, compact, node−to−cloud IoT sensor platform that allows development of various Bluetooth Low Energy based use cases. Along with the hardware and software, the RSL10−SENSE−GEVK includes a mobile app to interact with sensors and actuators. The board features RSL10, Industry’s lowest power Bluetooth® 5 SoC and several sensors from ON Semiconductor and Bosch. By combining motion, environmental, ambient light sensing with the ultra−low power of the Bluetooth 5 Certified RSL10 and will enable customers to realize a new class of battery powered static, mobile and wearable smart sensors targeting consumer and industrial applications in the IoT. The overall deep sleep consumption of 20 A results in a battery life of over 1 year

Eigenschaften

  • Fully-Certified to Worldwide Regulatory Standards
  • FCC (U.S)
  • ISED (Canada)
  • CE (Europe)
  • MIC (Japan)
  • KCC (Korea)
  • Ultra-Low-Power:
  • Industry's lowest power consumption in Deep Sleep Mode (62.5 nW) and Rx in Receive Mode (7 mW)
  • Industry's best EEMBC® ULPMark™ scores (1090 ULPMark CP @ 3 V; 1260 @ 2.1 V)
  • Complete Solution
  • Fully-integrated antenna
  • RSL10 Radio SoC
  • All passive components
  • Advanced Multi-Protocol Wireless Functionality
  • Supports Bluetooth Low Energy and 2.4 GHz proprietary/custom protocols
  • Rx Sensitivity: -93 dBm
  • Transmitting Power: -17 to 0 dBm
  • Supports Firmware Over The Air (FOTA) Other Key Technical Features
  • Built-in power management
  • Advanced dual-core architecture
  • 1.1 to 3.3 Voltage Supply Range
  • 384 kB Flash, 76 kB Program Memory, 88 kB Data Memory
  • IP protection feature to secure flash contents
  • Configurable analog and digital sensor interfaces (GPIOs, LSADs, I2C, SPI, PCM)

Typische Anwendungen

  • IoT Edge-Node Applications
  • Energy Harvesting
  • Wearables
  • Automotive Applications

Weiterführende Informationen

Artikeldaten

Artikel Nr. Daten­blatt Simu­lation Downloads Status ProduktserieCTol. CVR
(V (DC))
BauformBetriebstemperaturDF
(%)
RISOKeramiktypL
(mm)
W
(mm)
H
(mm)
Fl
(mm)
Verpackung Muster
885012205037SPEC
6 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WCAP-CSGP MLCCs 16 V(DC)100 nF ±10% 16 0402 -55 °C up to +125 °C 55 GΩ X7R Klasse II 1 0.5 0.5 0.25 7" Tape & Reel
885012206095SPEC
8 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WCAP-CSGP MLCCs 50 V(DC)100 nF ±10% 50 0603 -55 °C up to +125 °C 35 GΩ X7R Klasse II 1.6 0.8 0.8 0.4 7" Tape & Reel
885012105004SPEC
6 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WCAP-CSGP MLCCs 6.3 V(DC)470 nF ±20% 6.3 0402 -55 °C up to +85 °C 100.2 GΩ X5R Klasse II 1 0.5 0.5 0.25 7" Tape & Reel
Artikel Nr. Daten­blatt Simu­lation
885012205037SPEC
885012206095SPEC
885012105004SPEC
Muster
Artikel Nr. Daten­blatt Simu­lation Downloads Status ProduktserieCTol. CVR
(V (DC))
BauformBetriebstemperaturDF
(%)
RISOKeramiktypL
(mm)
W
(mm)
H
(mm)
Fl
(mm)
Verpackung Muster