IC-Hersteller STMicroelectronics
IC-Hersteller (97)
- Alle Hersteller
Analog Devices
Infineon Technologies
Microchip
Onsemi
Renesas
ROHM
STMicroelectronics
Texas Instruments
- 3peak incorporated (16)
- Ablic (24)
- Advanced Power (4)
- Allegro Microsystems (84)
- Alpha & Omega Semiconductor (37)
- AnalogySemi (3)
- AnDAPT Inc (181)
- Anpec (13)
- AXElite (2)
- Backward (6)
- Broadcom (47)
- Cambridge GaN Devices (18)
- Chipanalog Micro (10)
- Cologne Chips (1)
- Convenient Power (1)
- Dialog Semiconductor (12)
- Diodes Incorporated (232)
- Divimath (8)
- Elmos AG (1)
- EPC (99)
- e-Peas Semiconductors (1)
- Eta Solutions Co. Ltd. (9)
- GaN Systems (7)
- GaNPower (3)
- Giantec (1)
- Gstek Wuxi (1)
- Helix Semiconductor (7)
- Ikanos (3)
- IKON (1)
- Indie Semiconductor (5)
- Innovision Semiconductor Inc (2)
- Intel (80)
- Inventchip Technology (3)
- ISSI (51)
- JoulWatt (20)
- KDPOF (3)
- Kinetic Technology (9)
- Lattice semiconductor Corporation (20)
- Littelfuse (1)
- M3 Technology (M3Tek) (7)
- Macnica (16)
- MaxLinear (178)
- MikroE (19)
- MindCet (2)
- Monolithic Power Systems (930)
- Navitas Semiconductor Inc (6)
- NewEdge Technologies, Inc. (1)
- Nexperia (34)
- Nisshinbo Micro Device Inc. (10)
- Novosense Micro (1)
- NXP (313)
- O2 Micro International Ltd (10)
- On Bright (7)
- Panasonic (2)
- PN Junction Semiconductor (2)
- Power Integrations (112)
- Powermat (1)
- Pulsiv (19)
- Qorvo (86)
- Realsil SuRealsil(tek) Microelectronics (1)
- Richtek (296)
- Sanken Electric Co., Ltd. (16)
- Sckipio (6)
- Semtech (90)
- SG-Micro (32)
- Silanna Semiconductor (8)
- Silergy Corporation (30)
- Silicon Laboratory Inc. (105)
- Silicontent Technology (59)
- Silvertel (53)
- Skycore Semiconductors (1)
- Skyworks (29)
- Southchip (8)
- Summit Wireless (1)
- Tagore Tech (4)
- Taiwan Semiconductor (1)
- TDK Corporation (1)
- Tempo Semiconductor (1)
- Torex (37)
- Toshiba (25)
- Transphorm (21)
- TransSIP (2)
- Union (21)
- uPI Semiconductor (2)
- Valens Semiconductor (18)
- Wolfspeed (8)
- Xilinx (22)
- XL Semiconductor (3)
- XYSemi (62)
STMicroelectronics FT260Q | Demoboard STEVAL-USBI2CFT
USB to I2C evaluation board for interfacing wireless applications with PC GUI tool
Details
| Topologie | USB |
| Eingangsspannung | 5-5.5 V |
| IC-Revision | 1 |
Beschreibung
The STEVAL-USBI2CFT allows the quick start of Qi compatible wireless charging transmitter and receiver projects.With the usage of a USB I2C bridge, the user can monitor and control the ST wireless charging evaluation boards using the STSW-WPSTUDIO graphical user interface (GUI).The STEVAL-USBI2CFT board includes an internal level-shifter.The voltage level can be changed soldering one of the soldering bridges.The voltage can be set to 1.8, 2.5 or 3.3 V depending from what solder bridge was soldered.
Eigenschaften
- Fully independent USB I2C bridge for communication between GUI and ST evaluation boards for wireless charging
- Standardized pinout for all ST wireless charging evaluation boards
- No additional programming
- I2C interface
- Output voltage from USB connector for DC powering of evaluation boards
Typische Anwendungen
- Wireless Chargers
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q (%) | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Anwendung | Interface typ | Montageart | Arbeitsspannung (V (AC)) | Pins (pcs) | Reihen | H (mm) | G (mm) | Gender | Typ | IR (A) | Verpackung | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 150060RS75000 | SPEC | 26 Dateien Strahldaten
| Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMCW SMT Mono-color Chip LED Waterclear | 625 | Rot | 630 | 250 | 2 | AlInGaP | 140 | – | – | – | 0603 | -40 °C up to +85 °C | – | – | – | – | 1.6 | 0.8 | – | – | – | SMT | – | – | – | 0.7 | – | – | – | – | Tape and Reel | ||
 | 885012006055 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | 47 pF | ±5% | 50 | 0603 | -55 °C up to +125 °C | 1000 | – | 10 GΩ | NP0 Klasse I | 1.6 | 0.8 | 0.4 | – | – | – | – | – | – | 0.8 | – | – | – | – | 7" Tape & Reel | ||
| 885012206071 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | 100 nF | ±10% | 25 | 0603 | -55 °C up to +125 °C | – | 3.5 | 5 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.4 | – | – | – | – | – | – | 0.8 | – | – | – | – | 7" Tape & Reel | ||
| 885012206077 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | 100 pF | ±10% | 50 | 0603 | -55 °C up to +125 °C | – | 2.5 | 10 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.4 | – | – | – | – | – | – | 0.8 | – | – | – | – | 7" Tape & Reel | ||
| 885012106011 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 10 V(DC) | – | – | – | – | – | – | – | 2.2 µF | ±20% | 10 | 0603 | -55 °C up to +85 °C | – | 10 | 0.05 GΩ | X5R Klasse II | 1.6 | 0.8 | 0.4 | – | – | – | – | – | – | 0.8 | – | – | – | – | 7" Tape & Reel | ||
| 885012106012 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 10 V(DC) | – | – | – | – | – | – | – | 4.7 µF | ±20% | 10 | 0603 | -55 °C up to +85 °C | – | 10 | 0.02 GΩ | X5R Klasse II | 1.6 | 0.8 | 0.4 | – | – | – | – | – | – | 0.8 | – | – | – | – | 7" Tape & Reel | ||
 | 61300611021 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Angled Pin Header | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | – | 1000 MΩ | – | 15.24 | – | – | – | – | THT | 250 | 6 | Single | – | – | Pin Header | Angled | 3 | Beutel | |
 | 629722000214 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-COM USB 2.0 Type C Receptacle Horizontal SMT | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +85 °C | – | – | 100 MΩ | – | – | – | – | USB 2.0 | Type C | SMT | 20 | 16 | – | – | 0.95 | Receptacle | Horizontal | 5 | Tape and Reel |
| Artikel Nr. | Datenblatt | Simulation | |
|---|---|---|---|
| 150060RS75000 | SPEC | |
| 885012006055 | SPEC | |
| 885012206071 | SPEC | |
| 885012206077 | SPEC | |
| 885012106011 | SPEC | |
| 885012106012 | SPEC | |
| 61300611021 | SPEC | – |
| 629722000214 | SPEC | – |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q (%) | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Anwendung | Interface typ | Montageart | Arbeitsspannung (V (AC)) | Pins (pcs) | Reihen | H (mm) | G (mm) | Gender | Typ | IR (A) | Verpackung | Muster |
|---|
