IC-Hersteller STMicroelectronics

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STMicroelectronics MP23DB02MMTR | Demoboard X-STM32MP-MSP01

STM32MP expansion board for motion MEMS, environmental, ToF, and ALS sensor applications

Details

TopologieSonstige Topologie
IC-Revision2

Beschreibung

The X-STM32MP-MSP01 is a multisensor evaluation board that embeds motion MEMS, environmental, ambient light and Time-of-Flight sensors, a digital microphone, and an NFC tag. This board works with the STM32MPU discovery kit. It can be used with the X-LINUX-MSP1 to read the sensors. The X-STM32MP-MSP01 main devices are the ISM330DHCX 3-axis accelerometer and gyroscope, the IIS2MDC 3-axis magnetometer, and the LPS22HH MEMS nano pressure sensor. The board also includes the STTS22H digital temperature sensor, the VD6283TX ambient light sensor, the IIS2DLPC 3-axis accelerometer, the VL53L5CX multizone ranging sensor, and the MP23DB02MM digital MEMS microphone. The on-board dynamic NFC/RFID tag IC can work with a dual interface for the I²C, through a 13.56 MHz RFID reader, or via an NFC phone. The X-STM32MP-MSP01 interfaces with the STM32MP1Dev via a 40-pin GPIO connector pins using I²C, SPI, and general GPIO pins. It is compatible with STM32MP157F-DK2 and a Raspberry Pi GPIO connector layout.

Eigenschaften

  • ISM330DHCX: 3-axis accelerometer and 3-axis gyroscope
  • IIS2MDC: 3-axis digital magnetometer (±50 gausses)
  • IIS2DLPC: 3-axis accelerometer for industrial applications (±2/±4/±8/±16 g)
  • STTS22H: digital temperature sensor (-40 to +125°C)
  • LPS22HH: nano pressure sensor (260 - 1260 hPa)
  • VD6283TX: ambient light sensor
  • VL53L5CX: Time-of-Flight (ToF) multizone ranging sensor
  • Dynamic NFC/RFID tag
  • Digital microphone
  • Standard DIL 24 pin socket for adapter boards
  • Compatible with STM32MP157F-DK2 and Raspberry Pi

Typische Anwendungen

  • Industrial robots

Weiterführende Informationen

Artikeldaten

Artikel Nr. Daten­blatt Simu­lation Downloads Status ProduktserieL
(mm)
TiλDom typ.
(nm)
FarbeλPeak typ.
(nm)
IV typ.
(mcd)
VF typ.
(V)
Chiptechnologie50% typ.
(°)
CTol. CVR
(V (DC))
BauformBetriebstemperaturQRISOKeramiktypW
(mm)
H
(mm)
Fl
(mm)
VerpackungZ @ 100 MHz
(Ω)
Zmax
(Ω)
Testbedingung ZmaxIR 2
(mA)
RDC max.
(Ω)
Typ Muster
150060RS75000SPEC
25 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WL-SMCW SMT Mono-color Chip LED Waterclear 1.6 625 Rot 630 250 2 AlInGaP 140 0603 -40 °C up to +85 °C 0.8 0.7 Tape and Reel
150060GS75000SPEC
25 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WL-SMCW SMT Mono-color Chip LED Waterclear 1.6 525 Grün 515 430 3.2 InGaN 140 0603 -40 °C up to +85 °C 0.8 0.7 Tape and Reel
885012006023SPEC
8 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WCAP-CSGP MLCCs 16 V(DC) 1.6100 pF ±5% 16 0603 -55 °C up to +125 °C 100010 GΩ NP0 Klasse I 0.8 0.8 0.4 7" Tape & Reel
742792042SPEC
9 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WE-CBF SMT-Ferrit 2 0805 -55 °C up to +125 °C 1.2 0.9 0.5 600 3000 180 MHz 900 0.5 High Speed
709940300SPEC
3 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WA-SNTE Snap-In Stop Spacer for Printed Circuit Boards M3 -30 °C up to +85 °C 2.4 Beutel
Muster
Artikel Nr. Daten­blatt Simu­lation Downloads Status ProduktserieL
(mm)
TiλDom typ.
(nm)
FarbeλPeak typ.
(nm)
IV typ.
(mcd)
VF typ.
(V)
Chiptechnologie50% typ.
(°)
CTol. CVR
(V (DC))
BauformBetriebstemperaturQRISOKeramiktypW
(mm)
H
(mm)
Fl
(mm)
VerpackungZ @ 100 MHz
(Ω)
Zmax
(Ω)
Testbedingung ZmaxIR 2
(mA)
RDC max.
(Ω)
Typ Muster