Topologie | Sonstige Topologie |
IC-Revision | E1 |
This reference design is built keeping an electronic imaging system in mind. Image sensors today force heavy demands on ADCs in terms of: excellent linearity (DNL < 0.5 LSB and INL < 4 LSB), high resolution (12- to 18-bit), high speed (up to 20 MSPS), and high SNR (> 74-dB SNR) to assure superior image quality and freedom from distortion over time. Enabled by the low-noise, high-speed amplifier, fully differential amplifier (FDA), high-speed ADC, and low-noise LDO from TI, this reference design demonstrates how to design a high-performance analog signal chain for digitizing the pixel-output signal in thermal imaging cameras.
Artikel Nr. | Datenblatt | Simulation | |
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150060RS75000 | SPEC | ||
742792097 | SPEC | ||
885012005043 | SPEC |
Muster |
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Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR 2 (mA) | RDC max. (Ω) | Typ | Muster |
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