Topologie | Sonstige Topologie |
IC-Revision | E1 |
This reference design is built keeping an electronic imaging system in mind. Image sensors today force heavy demands on ADCs in terms of: excellent linearity (DNL < 0.5 LSB and INL < 4 LSB), high resolution (12- to 18-bit), high speed (up to 20 MSPS), and high SNR (> 74-dB SNR) to assure superior image quality and freedom from distortion over time. Enabled by the low-noise, high-speed amplifier, fully differential amplifier (FDA), high-speed ADC, and low-noise LDO from TI, this reference design demonstrates how to design a high-performance analog signal chain for digitizing the pixel-output signal in thermal imaging cameras.
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | Muster | |
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885012005043 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | 33 pF | ±5% | 25 | 0402 | -55 °C up to +125 °C | 1000 | 10 GΩ | NP0 Klasse I | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel |
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885012005043 | SPEC |
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Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | Muster |
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