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Texas Instruments BQ2969 | Demoboard BQ2969EVM

BQ2969 evaluation module

Details

TopologieSonstige Topologie

Beschreibung

The BQ2969EVM evaluation module (EVM) is a complete evaluation system for the BQ2969, a high accuracy, low-power overvoltage protector with an integrated LDO for 2-series to 4-series Li-Ion, and LiFePO4 battery packs. The EVM consists of a BQ2969 circuit module which is used for simple evaluation of the BQ2969 protection functions. The circuit module includes one BQ2969 integrated circuit (IC) and all other onboard components necessary to signal the conditions of overcharge and overdischarge in a 4-series cell Li-Ion or Li-Polymer battery pack. The circuit module connects directly across the cells in a battery, or can be connected with a power supply and the included cell simulator resistors.

Eigenschaften

Complete evaluation system for the BQ2969 2-cell to 4-cell Li-Ion high accuracy battery overvoltage protectorPopulated circuit module for 4-cell configuration for quick setupPower connections available on test pointsResistor cell simulator for quick setup with only a power supply

Typische Anwendungen

Weiterführende Informationen

Artikeldaten

Artikel Nr. Daten­blatt Simu­lation Downloads Status ProduktserieλDom typ.
(nm)
FarbeλPeak typ.
(nm)
IV typ.
(mcd)
VF typ.
(V)
Chiptechnologie50% typ.
(°)
CTol. CVR
(V (DC))
BauformBetriebstemperaturDF
(%)
RISOKeramiktypL
(mm)
W
(mm)
H
(mm)
Fl
(mm)
Verpackung Muster
150060RS75000SPEC
25 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WL-SMCW SMT Mono-color Chip LED Waterclear 625 Rot 630 250 2 AlInGaP 140 0603 -40 °C up to +85 °C 1.6 0.8 0.7 Tape and Reel
885012206095SPEC
8 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WCAP-CSGP MLCCs 50 V(DC)100 nF ±10% 50 0603 -55 °C up to +125 °C 35 GΩ X7R Klasse II 1.6 0.8 0.8 0.4 7" Tape & Reel
Artikel Nr. Daten­blatt Simu­lation
150060RS75000SPEC
885012206095SPEC
Muster
Artikel Nr. Daten­blatt Simu­lation Downloads Status ProduktserieλDom typ.
(nm)
FarbeλPeak typ.
(nm)
IV typ.
(mcd)
VF typ.
(V)
Chiptechnologie50% typ.
(°)
CTol. CVR
(V (DC))
BauformBetriebstemperaturDF
(%)
RISOKeramiktypL
(mm)
W
(mm)
H
(mm)
Fl
(mm)
Verpackung Muster