IC-Hersteller Texas Instruments
IC-Hersteller (99)
- Alle Hersteller
Analog Devices
Infineon Technologies
Microchip
Onsemi
Renesas
ROHM
STMicroelectronics
Texas Instruments
- 3peak incorporated (27)
- Ablic (23)
- Advanced Power (4)
- Allegro Microsystems (84)
- Alpha & Omega Semiconductor (37)
- AnalogySemi (3)
- AnDAPT Inc (163)
- Anpec (13)
- AXElite (2)
- Backward (6)
- Bright Power Semiconductor (1)
- Broadcom (47)
- Cambridge GaN Devices (18)
- Chipanalog Micro (10)
- Cologne Chips (1)
- Convenient Power (1)
- Dialog Semiconductor (12)
- Diodes Incorporated (238)
- Divimath (8)
- Elmos AG (1)
- EPC (99)
- e-Peas Semiconductors (1)
- Eta Solutions Co. Ltd. (9)
- GaN Systems (7)
- GaNPower (3)
- Giantec (1)
- Gstek Wuxi (1)
- Helix Semiconductor (7)
- Ikanos (3)
- IKON (1)
- Indie Semiconductor (5)
- Innovision Semiconductor Inc (2)
- Intel (80)
- Inventchip Technology (3)
- ISSI (51)
- JoulWatt (20)
- KDPOF (2)
- Kinetic Technology (10)
- Lattice semiconductor Corporation (19)
- Littelfuse (1)
- M3 Technology (M3Tek) (7)
- Macnica (16)
- MaxLinear (175)
- MikroE (8)
- MindCet (2)
- Monolithic Power Systems (931)
- Navitas Semiconductor Inc (6)
- NewEdge Technologies, Inc. (1)
- Nexperia (32)
- Nisshinbo Micro Device Inc. (10)
- Nordic Semiconductor (1)
- Novosense Micro (1)
- NXP (314)
- O2 Micro International Ltd (10)
- On Bright (7)
- Panasonic (2)
- PN Junction Semiconductor (2)
- Power Integrations (102)
- Pulsiv (19)
- Qorvo (87)
- Realsil SuRealsil(tek) Microelectronics (1)
- Richtek (296)
- Sanken Electric Co., Ltd. (16)
- Sckipio (6)
- Semtech (90)
- SG-Micro (33)
- Silanna Semiconductor (8)
- Silergy Corporation (29)
- Silicon Laboratory Inc. (104)
- Silicontent Technology (57)
- Silvertel (56)
- Skycore Semiconductors (1)
- Skyworks (31)
- Southchip (8)
- Summit Wireless (1)
- Tagore Tech (7)
- Taiwan Semiconductor (1)
- TDK Corporation (1)
- Tempo Semiconductor (1)
- Torex (37)
- Toshiba (25)
- Transphorm (21)
- TransSIP (2)
- Union (21)
- uPI Semiconductor (2)
- Valens Semiconductor (18)
- Wise Integration (1)
- Wolfspeed (8)
- Xilinx (22)
- XL Semiconductor (3)
- XYSemi (62)
Texas Instruments DRV8162L | Demoboard TIDA-010956
48V, 4kW small form-factor three-phase inverter reference design for integrated motor drives
Details
| Topologie | Gegentaktwandler (Vollbrücken) |
| Eingangsspannung | 48 V |
| Ausgang 1 | 100 V / 85 A |
| IC-Revision | A |
Beschreibung
This reference design demonstrates a three-phase inverter with nominal 48V DC input and 85Arms output current rating. The 100V intelligent half-bridge gate driver DRV8162L enables a small size, robust and high efficiency power stage. Multichannel shutdown paths using the split power supply architecture of RV8162L are proposed for the Safe Torque Off (STO) function. With the internal VDS monitor and protection feature of the DRV8162L, the power stage is protected against overcurrent failures of shoot-through or outputs short-circuit. Precision phase current sensing is achieved using the INA241A. The design offers a 3.3V I/O interface to connect a host controller like a C2000™ MCU for quick and easy evaluation.
Eigenschaften
Three-phase inverter with 24V DC to 60V DC input and 85ARMS continuous output currentSmart half-bridge gate driver DRV8162L with on-chip hardware protectionFully-protected power stage: shoot-through, overcurrent, short circuit, undervoltage, overtemperature protections
Typische Anwendungen
- Single and multiaxis servo drives
- Mobile robot
- AC inverter and VF drives
- Robotics
- Industrial and collaborative robot
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Pins (Value) (pcs) | Anwendung | PCB/Kabel/Panel | Modularity | Wire Section | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | L (µH) | IRP,40K (A) | ISAT1 (A) | ISAT,30% (A) | fres (MHz) | Montageart | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR 2 (mA) | RDC max. (mΩ) | Typ | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 74437324220 | SPEC Anstehende PCNAufgrund einer anstehenden PCN wird in Kürze eine Änderung am Bauteil durchgeführt. Anbei finden Sie die entsprechende PCN. Bei weiteren Fragen wenden Sie sich bitte an Ihren Vertriebsmitarbeiter. | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-LHMI SMT Speicherdrossel | 2 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 4020 | -40 °C up to +125 °C | – | – | – | 4.45 | 4.06 | 1.8 | – | – | 22 | 1.3 | 1.45 | 2.35 | 14 | SMT | – | – | – | – | 500 | – | ||
 | 691243110004 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-TBL Series 2431 - 3.50 mm Horizontal cable entry with rising clamp | 4 | Rising Cage Clamp | PCB | Nein | 30 to 16 (AWG) 0.05 to 1.31 (mm²) | – | – | – | – | – | – | – | – | – | – | – | -30 °C up to +120 °C | – | – | – | 14 | – | – | – | Karton | – | – | – | – | – | THT | – | – | – | – | – | Horizontal | |
 | 742792711 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-CBF SMT-Ferrit | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0402 | -55 °C up to +125 °C | – | – | – | 1 | 0.5 | 0.5 | 0.25 | – | – | – | – | – | – | SMT | 100 | 200 | 800 MHz | 870 | 300 | High Speed | ||
| 74279272 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-CBF SMT-Ferrit | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0402 | -55 °C up to +125 °C | – | – | – | 1 | 0.5 | 0.5 | 0.25 | – | – | – | – | – | – | SMT | 300 | 400 | 380 MHz | 700 | 800 | Breitband | ||
 | 150060GS75000 | SPEC | 25 Dateien Strahldaten
| Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMCW SMT Mono-color Chip LED Waterclear | – | – | – | – | – | 525 | Grün | 515 | 430 | 3.2 | InGaN | 140 | – | – | – | 0603 | -40 °C up to +85 °C | – | – | – | 1.6 | 0.8 | 0.7 | – | Tape and Reel | – | – | – | – | – | SMT | – | – | – | – | – | – | ||
 | 885012205037 | SPEC | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 16 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | 100 nF | ±10% | 16 | 0402 | -55 °C up to +125 °C | 5 | 5 GΩ | X7R Klasse II | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | ||
| 885012207026 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 10 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | 10 µF | ±10% | 10 | 0805 | -55 °C up to +125 °C | 10 | 0.01 GΩ | X7R Klasse II | 2 | 1.25 | 1.25 | 0.5 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | ||
| 885012207103 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | 1 µF | ±10% | 50 | 0805 | -55 °C up to +125 °C | 10 | 0.1 GΩ | X7R Klasse II | 2 | 1.25 | 1.25 | 0.5 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | ||
| 885012209073 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | 10 µF | ±10% | 50 | 1210 | -55 °C up to +125 °C | 10 | 0.01 GΩ | X7R Klasse II | 3.2 | 2.5 | 2.5 | 0.6 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | ||
| 885012206126 | SPEC | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | 1 µF | ±10% | 50 | 0603 | -55 °C up to +125 °C | 10 | 0.5 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.8 | 0.35 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – |
| Artikel Nr. | Datenblatt | Simulation | |
|---|---|---|---|
| 74437324220 | SPEC Anstehende PCNAufgrund einer anstehenden PCN wird in Kürze eine Änderung am Bauteil durchgeführt. Anbei finden Sie die entsprechende PCN. Bei weiteren Fragen wenden Sie sich bitte an Ihren Vertriebsmitarbeiter. | |
| 691243110004 | SPEC | – |
| 742792711 | SPEC | |
| 74279272 | SPEC | |
| 150060GS75000 | SPEC | |
| 885012205037 | SPEC | |
| 885012207026 | SPEC | |
| 885012207103 | SPEC | |
| 885012209073 | SPEC | |
| 885012206126 | SPEC |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Pins (Value) (pcs) | Anwendung | PCB/Kabel/Panel | Modularity | Wire Section | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | L (µH) | IRP,40K (A) | ISAT1 (A) | ISAT,30% (A) | fres (MHz) | Montageart | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR 2 (mA) | RDC max. (mΩ) | Typ | Muster |
|---|