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Details
| Topologie | Sonstige Topologie |
Beschreibung
TMDSCNCD280025C is a low-cost evaluation and development board for TI C2000™ MCU series of F28002x devices. It comes with a HSEC180 (180-pin High Speed Edge Connector) and, as a controlCARD, is ideal for initial evaluation and prototyping. For evaluation of TMDSCNCD280025C, a 180-pin docking station TMDSHSECDOCK is required and can be purchased separately or as a bundled kit.
Eigenschaften
- Isolated on-board XDS100v2 USB-to-JTAG debug probe enables real-time in-system programming and debugging
- Standard 180-pin controlCARD HSEC interface
- Analog I/O, digital I/O and JTAG signals at card interface
- Find hardware Files by downloading C2000Ware at boards\controlCARDs\TMDSCNCD280025C
Typische Anwendungen
- Hybrids, electric & powertrain systems, Body electronics & lighting
- Industrial power, UPS, Telecom & server power
- Renewable energy storage, Solar energy
- Building automation, Industrial machine & machine tools, EV charging infrastructure, AC inverter & VF drives, Linear motor transport systems, Single & multi axis servo drives, Speed controlled BLDC drives
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | Anwendung | Interface typ | Typ | Gender | Pins (Value) (pcs) | Montageart | Arbeitsspannung (V (AC)) | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 150080BS75000 | SPEC | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMCW SMT Mono-color Chip LED Waterclear | 470 | Blau | 465 | 145 | 3.2 | InGaN | 140 | – | – | – | 0805 | -40 °C up to +85 °C | – | – | – | – | 2 | 1.25 | 0.7 | – | Tape and Reel | – | – | – | – | – | SMT | – | ||
| 150080VS75000 | SPEC | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMCW SMT Mono-color Chip LED Waterclear | 570 | Hellgrün | 572 | 40 | 2 | AlInGaP | 140 | – | – | – | 0805 | -40 °C up to +85 °C | – | – | – | – | 2 | 1.25 | 0.7 | – | Tape and Reel | – | – | – | – | – | SMT | – | ||
| 150080SS75000 | SPEC | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMCW SMT Mono-color Chip LED Waterclear | 630 | Superrot | 645 | 60 | 1.9 | AlInGaP | 140 | – | – | – | 0805 | -40 °C up to +85 °C | – | – | – | – | 2 | 1.25 | 0.7 | – | Tape and Reel | – | – | – | – | – | SMT | – | ||
 | 885012005056 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | 15 pF | ±5% | 50 | 0402 | -55 °C up to +125 °C | 700 | – | 10 GΩ | NP0 Klasse I | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | ||
| 885012105010 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 10 V(DC) | – | – | – | – | – | – | – | 100 nF | ±20% | 10 | 0402 | -55 °C up to +85 °C | – | 5 | 5 GΩ | X5R Klasse II | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | ||
 | 65100516121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-COM Mini USB 2.0 Type B SMT Horizontal 5 Contacts | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | – | 1000 MΩ | – | – | – | – | – | Tape and Reel & Mylar | Mini USB | Type B | Horizontal | Receptacle | 5 | SMT | 30 |
| Artikel Nr. | Datenblatt | Simulation | |
|---|---|---|---|
| 150080BS75000 | SPEC | |
| 150080VS75000 | SPEC | |
| 150080SS75000 | SPEC | |
| 885012005056 | SPEC | |
| 885012105010 | SPEC | |
| 65100516121 | SPEC | – |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | Anwendung | Interface typ | Typ | Gender | Pins (Value) (pcs) | Montageart | Arbeitsspannung (V (AC)) | Muster |
|---|