IC-Hersteller Texas Instruments
IC-Hersteller (99)
- Alle Hersteller
Analog Devices
Infineon Technologies
Microchip
Onsemi
Renesas
ROHM
STMicroelectronics
Texas Instruments
- 3peak incorporated (27)
- Ablic (23)
- Advanced Power (4)
- Allegro Microsystems (84)
- Alpha & Omega Semiconductor (37)
- AnalogySemi (3)
- AnDAPT Inc (163)
- Anpec (13)
- AXElite (2)
- Backward (6)
- Bright Power Semiconductor (1)
- Broadcom (47)
- Cambridge GaN Devices (18)
- Chipanalog Micro (10)
- Cologne Chips (1)
- Convenient Power (1)
- Dialog Semiconductor (12)
- Diodes Incorporated (238)
- Divimath (8)
- Elmos AG (1)
- EPC (99)
- e-Peas Semiconductors (1)
- Eta Solutions Co. Ltd. (9)
- GaN Systems (7)
- GaNPower (3)
- Giantec (1)
- Gstek Wuxi (1)
- Helix Semiconductor (7)
- Ikanos (3)
- IKON (1)
- Indie Semiconductor (5)
- Innovision Semiconductor Inc (2)
- Intel (80)
- Inventchip Technology (3)
- ISSI (51)
- JoulWatt (20)
- KDPOF (2)
- Kinetic Technology (10)
- Lattice semiconductor Corporation (19)
- Littelfuse (1)
- M3 Technology (M3Tek) (7)
- Macnica (16)
- MaxLinear (175)
- MikroE (8)
- MindCet (2)
- Monolithic Power Systems (931)
- Navitas Semiconductor Inc (6)
- NewEdge Technologies, Inc. (1)
- Nexperia (32)
- Nisshinbo Micro Device Inc. (10)
- Nordic Semiconductor (1)
- Novosense Micro (1)
- NXP (314)
- O2 Micro International Ltd (10)
- On Bright (7)
- Panasonic (2)
- PN Junction Semiconductor (2)
- Power Integrations (102)
- Pulsiv (19)
- Qorvo (87)
- Realsil SuRealsil(tek) Microelectronics (1)
- Richtek (296)
- Sanken Electric Co., Ltd. (16)
- Sckipio (6)
- Semtech (90)
- SG-Micro (33)
- Silanna Semiconductor (8)
- Silergy Corporation (29)
- Silicon Laboratory Inc. (104)
- Silicontent Technology (57)
- Silvertel (56)
- Skycore Semiconductors (1)
- Skyworks (31)
- Southchip (8)
- Summit Wireless (1)
- Tagore Tech (7)
- Taiwan Semiconductor (1)
- TDK Corporation (1)
- Tempo Semiconductor (1)
- Torex (37)
- Toshiba (25)
- Transphorm (21)
- TransSIP (2)
- Union (21)
- uPI Semiconductor (2)
- Valens Semiconductor (18)
- Wise Integration (1)
- Wolfspeed (8)
- Xilinx (22)
- XL Semiconductor (3)
- XYSemi (62)
Texas Instruments LM53635 | Demoboard TIDA-01054
Multi-Rail Power Reference Design for Eliminating EMI Effects in High Performance DAQ Systems
Details
| Topologie | Sonstige Topologie |
| IC-Revision | E1 |
Beschreibung
The TIDA-01054 reference design helps eliminate the performance degrading effects of EMI on Data Acquisition (DAQ) systems greater than 16 bits with the help of the LM53635 buck converter. The buck converter enables the designer to place power solutions close to the signal path without the unwanted noise degradation of EMI while saving board space. This design allows for a system SNR performance of 100.13 dB using a 20-bit, 1-MSPS SAR ADC, which almost matches the 100.14 dB SNR performances when using external power sources.
Eigenschaften
Remark: BOM & user guide PDF is added with main pdf.
FeaturesPower design minimizing DC to DC EMI impact on system performanceTwo 20-bit SAR ADC channelsModular front-end reference design for high channel count systems that can be repeatedUp to +/-4V input signal (8Vpp differential).
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | L (µH) | ISAT (A) | fres (MHz) | Montageart | Ti | Ø ID (mm) | Ø OD (mm) | VPE | Pins (Value) (pcs) | Reihen | H (mm) | Gender | Typ | IR (A) | Verpackung | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 150060RS75000 | SPEC | 25 Dateien Strahldaten
| Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMCW SMT Mono-color Chip LED Waterclear | 625 | Rot | 630 | 250 | 2 | AlInGaP | 140 | – | – | – | 0603 | -40 °C up to +85 °C | – | – | – | 1.6 | 0.8 | – | – | – | – | SMT | – | – | – | 4000 | – | – | 0.7 | – | – | – | Tape and Reel | ||
 | 744031680 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-TPC SMT-Speicherdrossel | – | – | – | – | – | – | – | – | – | – | 3816 | -40 °C up to +125 °C | – | – | – | 3.8 | 3.8 | – | 68 | 0.22 | 12 | SMT | – | – | – | 1000 | 2 | – | 1.65 | – | – | 0.32 | – | ||
 | 885012006057 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | 100 pF | ±5% | 50 | 0603 | -55 °C up to +125 °C | 1000 | 10 GΩ | NP0 Klasse I | 1.6 | 0.8 | 0.4 | – | – | – | – | – | – | – | 4000 | – | – | 0.8 | – | – | – | 7" Tape & Reel | ||
 | 9774050360R | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WA-SMSI SMT Stahl Spacer mit Innengewinde M3 | – | – | – | – | – | – | – | – | – | – | – | -55 °C up to +150 °C | – | – | – | 5 | – | – | – | – | – | – | M3 | 4.2 | 6 | 650 | – | – | – | – | – | – | Tape and Reel | |
 | 61300211121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | 1000 MΩ | – | 5.08 | – | – | – | – | – | THT | – | – | – | – | 2 | Single | – | Pin Header | Gerade | 3 | Beutel | |
 | 61300311121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | 1000 MΩ | – | 7.62 | – | – | – | – | – | THT | – | – | – | – | 3 | Single | – | Pin Header | Gerade | 3 | Beutel |
| Artikel Nr. | Datenblatt | Simulation | |
|---|---|---|---|
| 150060RS75000 | SPEC | |
| 744031680 | SPEC | |
| 885012006057 | SPEC | |
| 9774050360R | SPEC | – |
| 61300211121 | SPEC | – |
| 61300311121 | SPEC | – |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | L (µH) | ISAT (A) | fres (MHz) | Montageart | Ti | Ø ID (mm) | Ø OD (mm) | VPE | Pins (Value) (pcs) | Reihen | H (mm) | Gender | Typ | IR (A) | Verpackung | Muster |
|---|