Topologie | Sonstige Topologie |
IC-Revision | E1 |
The TIDA-01055 reference design for high performance DAQ Systems optimizes the ADC reference buffer to improve SNR performance and reduce power consumption with the TI OPA837 high-speed op amp. This device is used in a composite buffer configuration and provides a 22% power improvement over traditional op amps. Voltage reference sources with an integrated buffer often lack the drive strength required to achieve optimal performance in a high-channel count systems. This reference design is capable of driving several ADCs, and achieves a system ENOB of 15.77 bits using an 18-bit, 2-MSPS SAR ADC.
Remark: Schematic and BOM PDF are added.
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Anwendung | PCB/Kabel/Panel | Modularity | Wire Section | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | L (µH) | ISAT (A) | fres (MHz) | Montageart | Ti | Ø ID (mm) | Ø OD (mm) | VPE | Pins (Value) (pcs) | Reihen | H (mm) | Gender | Typ | IR (A) | Verpackung | Muster | |
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691213710002 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-TBL Series 213 - 5.00 mm Horiz.l Entry Modular | Rising Cage Clamp | PCB | Ja | 26 to 16 (AWG) 0.5 to 1.5 (mm²) | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | – | – | 10 | – | – | – | – | – | THT | – | – | – | – | 2 | – | – | – | Horizontal | 10 | Karton | ||
744025006 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-TPC SMT-Speicherdrossel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 2828 | -40 °C up to +125 °C | – | – | – | 2.8 | 2.8 | – | 6.8 | 1.3 | 59 | SMT | – | – | – | 550 | 2 | – | 2.8 | – | – | 1.1 | – | |||
744031680 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-TPC SMT-Speicherdrossel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 3816 | -40 °C up to +125 °C | – | – | – | 3.8 | 3.8 | – | 68 | 0.22 | 12 | SMT | – | – | – | 1000 | 2 | – | 1.65 | – | – | 0.32 | – | |||
150060RS75000 | SPEC | 25 Dateien Strahldaten
| Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMCW SMT Mono-color Chip LED Waterclear | – | – | – | – | 625 | Rot | 630 | 250 | 2 | AlInGaP | 140 | – | – | – | 0603 | -40 °C up to +85 °C | – | – | – | 1.6 | 0.8 | – | – | – | – | SMT | – | – | – | 4000 | – | – | 0.7 | – | – | – | Tape and Reel | |||
885012006057 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | – | 100 pF | ±5% | 50 | 0603 | -55 °C up to +125 °C | 1000 | 10 GΩ | NP0 Klasse I | 1.6 | 0.8 | 0.4 | – | – | – | – | – | – | – | 4000 | – | – | 0.8 | – | – | – | 7" Tape & Reel | |||
9774050360R | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WA-SMSI SMT Stahl Spacer mit Innengewinde M3 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | -55 °C up to +150 °C | – | – | – | 5 | – | – | – | – | – | – | M3 | 4.2 | 6 | 650 | – | – | – | – | – | – | Tape and Reel | ||
61300211121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | 1000 MΩ | – | 5.08 | – | – | – | – | – | THT | – | – | – | – | 2 | Single | – | Pin Header | Gerade | 3 | Beutel | ||
61300311121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | 1000 MΩ | – | 7.62 | – | – | – | – | – | THT | – | – | – | – | 3 | Single | – | Pin Header | Gerade | 3 | Beutel |
Artikel Nr. | Datenblatt | Simulation | |
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691213710002 | SPEC | – | |
744025006 | SPEC | ||
744031680 | SPEC | ||
150060RS75000 | SPEC | ||
885012006057 | SPEC | ||
9774050360R | SPEC | – | |
61300211121 | SPEC | – | |
61300311121 | SPEC | – |
Muster |
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Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Anwendung | PCB/Kabel/Panel | Modularity | Wire Section | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | L (µH) | ISAT (A) | fres (MHz) | Montageart | Ti | Ø ID (mm) | Ø OD (mm) | VPE | Pins (Value) (pcs) | Reihen | H (mm) | Gender | Typ | IR (A) | Verpackung | Muster |
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