IC-Hersteller Texas Instruments

IC-Hersteller (99)

Texas Instruments TDA2SX | Demoboard MMWCAS-DSP-EVM

TDA2x ADAS Applications Processor 23mm Package

Details

TopologieSonstige Topologie

Beschreibung

The MMWCAS-DSP evaluation module (EVM) design provides a processing foundation for a cascaded imaging radar system. Cascade radar devices can support front, long-range radar (LRR), beamforming applications, as well as corner- and side-cascade radar and sensor fusion systems. This EVM design provides qualified developers the design materials to create a functioning software evaluation platform for developing and testing advanced driver-assistance systems (ADAS).MMWCAS-DSP-EVM aids in shortening the development time of a base platform supporting multiple automotive radar front end and antenna subsystems.MMWCAS-DSP-EVM is supported by standard mmWave tools and software, including mmWave Studio (MMWAVE-STUDIO), as well as the processor SDK for TDAx ADAS SoCs (PROCESSOR-SDK-TDAX).For proper evaluation of MMWCAS-DSP-EVM, one other board is required - the mmWave cascaded imaging radar RF evaluation module (MMWCAS-RF-EVM) (sold separately).

Eigenschaften

  • High-performance TDA2x device with four radar processing SIMD accelerators (one EVE per AWRx)
  • Ethernet and PCIe connectivity for control and data, respectively
  • Reference designs provided in Cascade Imaging Radar Capture Reference Design Using Jacinto™ ADAS Processor (TIDEP-01017) and Imaging Radar Using Cascaded mWave Sensor Reference Design (TIDEP-01012)

Typische Anwendungen

  • Mono, Stereo or Tri-Optic Front Camera, LVDS or ethernet surround view
  • Sensor fusion – vision, radar, ultrasonic, lidar sensors

Weiterführende Informationen

Artikeldaten

Artikel Nr. Daten­blatt Simu­lation Downloads Status ProduktserieλDom typ.
(nm)
FarbeλPeak typ.
(nm)
IV typ.
(mcd)
VF typ.
(V)
Chiptechnologie50% typ.
(°)
CTol. CVR
(V (DC))
BauformBetriebstemperaturQRISOKeramiktypL
(mm)
W
(mm)
H
(mm)
Fl
(mm)
VerpackungTiØ OD
(mm)
Ø ID
(mm)
VPEAnwendungInterface typTypGenderPins (Value)
(pcs)
MontageartArbeitsspannung
(V (AC))
Muster
150060GS75000SPEC
25 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WL-SMCW SMT Mono-color Chip LED Waterclear 525 Grün 515 430 3.2 InGaN 140 0603 -40 °C up to +85 °C 1.6 0.8 0.7 Tape and Reel 4000 SMT
885012005063SPEC
8 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WCAP-CSGP MLCCs 50 V(DC)220 pF ±5% 50 0402 -55 °C up to +125 °C 100010 GΩ NP0 Klasse I 1 0.5 0.5 0.25 7" Tape & Reel 10000
9774025243RSPEC
6 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WA-SMSI SMT Stahl Spacer mit Innengewinde M2 -55 °C up to +150 °C 2.5 Tape and Reel M2 4.35 2.8 950
65100516121SPEC
6 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WR-COM Mini USB 2.0 Type B SMT Horizontal 5 Contacts -40 °C up to +105 °C1000 MΩ Tape and Reel & Mylar Mini USB Type B Horizontal Receptacle 5 SMT 30
Artikel Nr. Daten­blatt Simu­lation
150060GS75000SPEC
885012005063SPEC
9774025243RSPEC
65100516121SPEC
Muster
Artikel Nr. Daten­blatt Simu­lation Downloads Status ProduktserieλDom typ.
(nm)
FarbeλPeak typ.
(nm)
IV typ.
(mcd)
VF typ.
(V)
Chiptechnologie50% typ.
(°)
CTol. CVR
(V (DC))
BauformBetriebstemperaturQRISOKeramiktypL
(mm)
W
(mm)
H
(mm)
Fl
(mm)
VerpackungTiØ OD
(mm)
Ø ID
(mm)
VPEAnwendungInterface typTypGenderPins (Value)
(pcs)
MontageartArbeitsspannung
(V (AC))
Muster