IC-Hersteller Texas Instruments

IC-Hersteller (96)

Texas Instruments TPS40077PWP-LFPAK-Stout

LFPAK, Point of Load, demonstration board

Details

TopologieAbwärtswandler
Eingangsspannung12 V
Ausgang 11.2 V / 25 A
Ausgang 23.3 V / 23 A
IC-Revision1

Beschreibung

The 25A LFPAK demonstration board is a single phase buck converter design to demonstrate the performance of NXP LFPAK MOSFETS in a small form factor point of load (POL) circuit. The very small 3.3 cm x 6.1 cm (1.3x2.4 inch), four layer board converts 12V nominal input to 1.2 V nominal output and is capable of output currents of 25 amps while maintaining case temperatures at or below 90 C with a minimal 200 LFM airflow at 25 C ambient. Efficiencies above 90% are achieved (12v in, 3.3v out), on this small demonstration board due to the superior level of on-resistance and thermal performance of the small S08 foot print NXP LFPAK devices.

Artikeldaten

Artikel Nr. Daten­blatt Simu­lation Downloads ProduktserieL
(µH)
IRP,40K
(A)
ISAT1
(A)
ISAT,30%
(A)
RDC
(mΩ)
fres
(MHz)
Material Muster
744355047SPEC
8 Dateien WE-HCI SMT-Hochstrominduktivität 0.47 50.1 24 50 0.9 95 WE-PERM
Artikel Nr. Daten­blatt Simu­lation
744355047SPEC
Muster
Artikel Nr. Daten­blatt Simu­lation Downloads ProduktserieL
(µH)
IRP,40K
(A)
ISAT1
(A)
ISAT,30%
(A)
RDC
(mΩ)
fres
(MHz)
Material Muster