Topologie | Abwärtswandler |
Eingangsspannung | 12 V |
Ausgang 1 | 1.2 V / 25 A |
Ausgang 2 | 3.3 V / 23 A |
IC-Revision | 1 |
The 25A LFPAK demonstration board is a single phase buck converter design to demonstrate the performance of NXP LFPAK MOSFETS in a small form factor point of load (POL) circuit. The very small 3.3 cm x 6.1 cm (1.3x2.4 inch), four layer board converts 12V nominal input to 1.2 V nominal output and is capable of output currents of 25 amps while maintaining case temperatures at or below 90 C with a minimal 200 LFM airflow at 25 C ambient. Efficiencies above 90% are achieved (12v in, 3.3v out), on this small demonstration board due to the superior level of on-resistance and thermal performance of the small S08 foot print NXP LFPAK devices.
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | L (µH) | IRP,40K (A) | ISAT1 (A) | ISAT,30% (A) | RDC (mΩ) | fres (MHz) | Material | Muster | |
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![]() | 744355047 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-HCI SMT-Hochstrominduktivität | 0.47 | 50.1 | 24 | 50 | 0.9 | 95 | WE-PERM |
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Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | L (µH) | IRP,40K (A) | ISAT1 (A) | ISAT,30% (A) | RDC (mΩ) | fres (MHz) | Material | Muster |
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