Topologie | Sonstige Topologie |
Eingangsspannung | 10-15 V |
Ausgang 1 | 15 V |
The UCC5870-Q1 three-phase evaluation module (EVM) is designed for evaluation of TI's 15-A isolated single-channel gate driver with advanced protection features. This EVM is targeted to drive high-power SiC MOSFETs and IGBTs in EV/HEV applications. This three-phase EVM can be used for debugging software for the driver's serial peripheral interface (SPI) and exploring the driver's sophisticated diagnostic, protection, and monitoring features.
Supports three-phase application software developmentSPI-based device reconfiguration, verification, supervision, and diagnosisSupports both address-mode SPI and daisy-chain mode SPIPower transistor protections: DESAT, OC/SC, Programmable soft turn off (STO) and two-level turn off (2LTOFF) during power transistor faultsSplit driver outputs guarantee 15-A peak source and 15-A peak sink currents
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Anwendung | PCB/Kabel/Panel | Modularity | Wire Section | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Pins (Value) (pcs) | Reihen | H (mm) | Gender | Typ | IR (A) | Verpackung | Muster | |
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691214110003 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-TBL Series 2141 - 3.50 mm Horiz. Entry Modular | Rising Cage Clamp | PCB | Ja | 24 to 16 (AWG) 0.2 to 1 (mm²) | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | – | – | – | 10.5 | – | – | 3 | – | – | – | Horizontal | 10 | Karton | ||
150060RS75000 | SPEC | 25 Dateien Strahldaten
| Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMCW SMT Mono-color Chip LED Waterclear | – | – | – | – | 625 | Rot | 630 | 250 | 2 | AlInGaP | 140 | – | – | – | 0603 | -40 °C up to +85 °C | – | – | – | – | 1.6 | 0.8 | – | – | – | 0.7 | – | – | – | Tape and Reel | |||
885012006057 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | – | 100 pF | ±5% | 50 | 0603 | -55 °C up to +125 °C | 1000 | – | 10 GΩ | NP0 Klasse I | 1.6 | 0.8 | 0.4 | – | – | 0.8 | – | – | – | 7" Tape & Reel | |||
885012206095 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | – | 100 nF | ±10% | 50 | 0603 | -55 °C up to +125 °C | – | 3 | 5 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.4 | – | – | 0.8 | – | – | – | 7" Tape & Reel | |||
885012207092 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | – | – | – | – | 10 nF | ±10% | 50 | 0805 | -55 °C up to +125 °C | – | 2.5 | 10 GΩ | X7R Klasse II | 2 | 1.25 | 0.5 | – | – | 0.8 | – | – | – | 7" Tape & Reel | |||
61300311021 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Angled Pin Header | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | – | 1000 MΩ | – | 7.62 | – | – | 3 | Single | – | Pin Header | Angled | 3 | Beutel | ||
61300511021 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Angled Pin Header | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | – | 1000 MΩ | – | 12.7 | – | – | 5 | Single | – | Pin Header | Angled | 3 | Beutel |
Artikel Nr. | Datenblatt | Simulation | |
---|---|---|---|
691214110003 | SPEC | – | |
150060RS75000 | SPEC | ||
885012006057 | SPEC | ||
885012206095 | SPEC | ||
885012207092 | SPEC | ||
61300311021 | SPEC | – | |
61300511021 | SPEC | – |
Muster |
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Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Anwendung | PCB/Kabel/Panel | Modularity | Wire Section | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Pins (Value) (pcs) | Reihen | H (mm) | Gender | Typ | IR (A) | Verpackung | Muster |
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