Topologie | Sonstige Topologie |
IC-Revision | E |
The International Telecommunication Union (ITU) allocates the un-licensed 5.8 GHz industrial, scientific, and medical (ISM) radio frequency band for use worldwide. Advancements in wireless technologies and standards, as well as minimal regulatory compliance requirements, have made this frequency band popular for short range, wireless communication systems.The 5.8 GHz band is preferred for short range digital communication applications (such as WiFi) because of the number of channels and the bandwidth available. While the transmission range is short-er than that of the 2.4 GHz band, its 150 MHz bandwidth accommodates up to 23 non-overlapping WiFi channels. Additional com-mon uses include software defined radio, wireless access points, public safety radio, wireless repeaters, femtocells, and Long-Term Evolution (LTE)/Worldwide Interoperability for Microwave Access (WiMAX)/4G, base transceiver station (BTS) infrastructure.This design provides high gain, robust overpower monitoring, and protection all in a small footprint, which is a great addition to any ISM band application where low signal strength or distance may be a complication.The circuit shown in Figure 1 is a high performance RF receiver system with +23 dB of gain, optimized for operation at a center frequency of 5.8 GHz. The input is unfiltered, maintaining a noise figure of 2 dB, while a bandpass filter at the output attenuates out-of-band interferers.The circuit includes a high speed overpower detector and switch that protects sensitive downstream equipment connected to the receiver system. The receiver system also automatically returns to normal operation when the RF power level drops within the acceptable range. The RF inputs and outputs are standard SMA connectors, and the entire design is powered from a single micro USB connector.
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | Leiterplattendicke (mm) | f | Mittelkontakt | Muster | |
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885012105018 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | 100 nF | ±20% | 25 | 0402 | -55 °C up to +85 °C | 10 | 5 GΩ | X5R Klasse II | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | |||
885012107006 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 6.3 V(DC) | 47 µF | ±20% | 6.3 | 0805 | -55 °C up to +85 °C | 10 | 0.002 GΩ | X5R Klasse II | 2 | 1.25 | 1.25 | 0.5 | 7" Tape & Reel | – | – | – | |||
60312202114513 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-SMA PCB End Launch | – | – | – | – | -65 °C up to +165 °C | – | 5000 MΩ | – | – | – | – | – | Tray | 1.6 | DC~18 GHz | Ø 0.51 WIDE x 0.25 THK | ||
60314202124525 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-SMA PCB End Launch | – | – | – | – | -65 °C up to +165 °C | – | 5000 MΩ | – | – | – | – | – | Tray | 1.6 | DC~18 GHz | Ø 0.76 |
Artikel Nr. | Datenblatt | Simulation | |
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885012105018 | SPEC | ||
885012107006 | SPEC | ||
60312202114513 | SPEC | – | |
60314202124525 | SPEC | – |
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Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | Leiterplattendicke (mm) | f | Mittelkontakt | Muster |
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