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Details
| Topologie | Sonstige Topologie |
Beschreibung
When connected to a specified Analog Devices high speed converter evaluation board, the ADS9-V2EBZ works as a data capture/transmit board. Designed to support the highest speed JESD204B/C data converters, the FPGA on the ADS9-V2EBZ acts as the data receiver for high speed ADC's, and as the transmitter for high speed DAC's.
Eigenschaften
- Xilinx Kintex Ultrascale+ XCKU15P-2FFVE1517E FPGA
- One (1) FMC+ connector.
- Twenty (20) 28Gbps transceivers supported by one (1) FMC+ connector.
- HMC DRAM
- Simple USB 3.0 port interface.
- Two micro SD cards are included, "TRX" -- for ADRV9026 evaluation boards and "HSX" -- for MxFE™ evaluation boards.
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | Interface typ | Typ | Gender | Pins (Value) (pcs) | Montageart | IR 1 (A) | Arbeitsspannung (V (AC)) | Kanäle | Polarität | VCh max. (V) | VBR min. (V) | CCh typ. (pF) | IPeak (A) | VCh Clamp ESD typ. (V) | VESD Contact (kV) | Anwendung | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 885012206076 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | 1 µF | ±10% | 25 | 0603 | -55 °C up to +125 °C | 10 | 0.5 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.8 | 0.4 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | ||
 | 82400102 | SPEC | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-TVS TVS Diode – High Speed Series | – | – | – | SOT23-6L | -55 °C up to +125 °C | – | – | – | 2.9 | 2.8 | 1.16 | – | – | – | – | – | – | SMT | – | – | 2+1 | Unidirectional | 5 | 6 | 2 | 7 | 10 | 8 | USB 1.0 -2.0 Flow Thru Design | ||
 | 692221030100 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-COM USB 3.0 Type B Horizontal | – | – | – | – | -20 °C up to +85 °C | – | 100 MΩ | – | – | – | – | – | Tray | Type B | Horizontal | Receptacle | 9 | THT | 1.8 | 30 | – | – | – | – | – | – | – | – | USB 3.0 |
| Artikel Nr. | Datenblatt | Simulation | |
|---|---|---|---|
| 885012206076 | SPEC | |
| 82400102 | SPEC | |
| 692221030100 | SPEC | – |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | Interface typ | Typ | Gender | Pins (Value) (pcs) | Montageart | IR 1 (A) | Arbeitsspannung (V (AC)) | Kanäle | Polarität | VCh max. (V) | VBR min. (V) | CCh typ. (pF) | IPeak (A) | VCh Clamp ESD typ. (V) | VESD Contact (kV) | Anwendung | Muster |
|---|