IC-Hersteller Analog Devices
IC-Hersteller (99)
- Alle Hersteller
Analog Devices
Infineon Technologies
Microchip
Onsemi
Renesas
ROHM
STMicroelectronics
Texas Instruments
- 3peak incorporated (27)
- Ablic (23)
- Advanced Power (4)
- Allegro Microsystems (84)
- Alpha & Omega Semiconductor (37)
- AnalogySemi (3)
- AnDAPT Inc (172)
- Anpec (13)
- AXElite (2)
- Backward (6)
- Bright Power Semiconductor (1)
- Broadcom (47)
- Cambridge GaN Devices (18)
- Chipanalog Micro (10)
- Cologne Chips (1)
- Convenient Power (1)
- Dialog Semiconductor (12)
- Diodes Incorporated (238)
- Divimath (8)
- Elmos AG (1)
- EPC (99)
- e-Peas Semiconductors (1)
- Eta Solutions Co. Ltd. (9)
- GaN Systems (7)
- GaNPower (3)
- Giantec (1)
- Gstek Wuxi (1)
- Helix Semiconductor (7)
- Ikanos (3)
- IKON (1)
- Indie Semiconductor (5)
- Innovision Semiconductor Inc (2)
- Intel (80)
- Inventchip Technology (3)
- ISSI (51)
- JoulWatt (20)
- KDPOF (2)
- Kinetic Technology (10)
- Lattice semiconductor Corporation (19)
- Littelfuse (1)
- M3 Technology (M3Tek) (7)
- Macnica (16)
- MaxLinear (175)
- MikroE (8)
- MindCet (2)
- Monolithic Power Systems (929)
- Navitas Semiconductor Inc (6)
- NewEdge Technologies, Inc. (1)
- Nexperia (32)
- Nisshinbo Micro Device Inc. (10)
- Nordic Semiconductor (1)
- Novosense Micro (1)
- NXP (314)
- O2 Micro International Ltd (10)
- On Bright (7)
- Panasonic (2)
- PN Junction Semiconductor (2)
- Power Integrations (110)
- Pulsiv (19)
- Qorvo (87)
- Realsil SuRealsil(tek) Microelectronics (1)
- Richtek (296)
- Sanken Electric Co., Ltd. (16)
- Sckipio (6)
- Semtech (90)
- SG-Micro (33)
- Silanna Semiconductor (8)
- Silergy Corporation (30)
- Silicon Laboratory Inc. (104)
- Silicontent Technology (57)
- Silvertel (56)
- Skycore Semiconductors (1)
- Skyworks (31)
- Southchip (8)
- Summit Wireless (1)
- Tagore Tech (7)
- Taiwan Semiconductor (1)
- TDK Corporation (1)
- Tempo Semiconductor (1)
- Torex (37)
- Toshiba (25)
- Transphorm (21)
- TransSIP (2)
- Union (21)
- uPI Semiconductor (2)
- Valens Semiconductor (18)
- Wise Integration (1)
- Wolfspeed (8)
- Xilinx (22)
- XL Semiconductor (3)
- XYSemi (62)
Analog Devices ADUM3166 | Demoboard EVAL-ADuM3166
Evaluating the ADuM3165/ADuM3166 3.75 kV RMS Digital Isolators for Isolated USB 2.0 High, Full, and Low Speed
Details
| Topologie | USB |
Beschreibung
The EVAL-ADuM3165EBZ and the EVAL-ADuM3166EBZ allow quick and easy evaluation of the ADuM3165 and ADuM3166 USB isolators, allowing direct connection to USB hosts and peripherals without the need for additional components. The ADuM3165/ADuM3166 employ Analog Devices, Inc., iCoupler® technology to combine isolator channels, USB transceivers, power and timing circuits, control logic and internal terminations, pull-ups, and pull-downs into a single, 20-lead, compact shrink small outline package (SSOP).
Eigenschaften
- Supports USB 2.0 data transfer
- Low speed (1.5 Mbps)
- Full speed (12 Mbps)
- High speed (480 Mbps)
- USB Type C (upstream) and USB Type A (downstream) connectors
- Upstream 5 V power from cable or external supply
- Downstream power from external supply
- Accepts 3.3 V or 5 V external supplies
- PGOOD (power good) indicator on downstream side
- Option to connect test points
- 20-lead SSOP package option with 5.3 mm creepage
Typische Anwendungen
- USB peripheral, USB host, and USB hub isolation
- Industrial Connectivity Technology, Industrial Robotics, PLC & DSC,
- Disease Management & Wellness, Wearable Health Monitor, Spectrometer, Non-Invasive Blood Pressure (NIBP), Vital Signs Measurements
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | PCB/Kabel/Panel | Modularity | Wire Section | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Interface typ | Montageart | IR 1 (A) | Arbeitsspannung (V (AC)) | Kanäle | Polarität | VCh max. (V) | VBR min. (V) | CCh typ. (pF) | IPeak (A) | VCh Clamp ESD typ. (V) | VESD Contact (kV) | Anwendung | Pins (Value) (pcs) | Reihen | H (mm) | Gender | Typ | IR (A) | Verpackung | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 691213710002 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-TBL Series 213 - 5.00 mm Horiz.l Entry Modular | PCB | Ja | 26 to 16 (AWG) 0.5 to 1.5 (mm²) | – | – | – | – | -40 °C up to +105 °C | – | – | – | 10 | – | – | – | THT | – | 250 | – | – | – | – | – | – | – | – | Rising Cage Clamp | 2 | – | – | – | Horizontal | 10 | Karton | |
 | 82402304 | SPEC | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-TVS TVS Diode – Standard Series | – | – | – | – | – | – | SOT23-6L | -55 °C up to +85 °C | – | – | – | 2.9 | 2.8 | – | – | SMT | – | – | 4 | Unidirectional | 5 | 6 | 13 | 6 | 8.5 | 10 | – | – | – | 1.16 | – | – | – | – | ||
 | 885012205037 | SPEC | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 16 V(DC) | – | – | – | 100 nF | ±10% | 16 | 0402 | -55 °C up to +125 °C | 5 | 5 GΩ | X7R Klasse II | 1 | 0.5 | 0.25 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.5 | – | – | – | 7" Tape & Reel | ||
| 885012207026 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 10 V(DC) | – | – | – | 10 µF | ±10% | 10 | 0805 | -55 °C up to +125 °C | 10 | 0.01 GΩ | X7R Klasse II | 2 | 1.25 | 0.5 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 1.25 | – | – | – | 7" Tape & Reel | ||
 | 61300311121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | 1000 MΩ | – | 7.62 | – | – | – | THT | – | 250 | – | – | – | – | – | – | – | – | – | 3 | Single | – | Pin Header | Gerade | 3 | Beutel | |
 | 61300421121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Dual Pin Header | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | 1000 MΩ | – | 5.08 | – | – | – | THT | – | 250 | – | – | – | – | – | – | – | – | – | 4 | Dual | – | Pin Header | Gerade | 3 | Beutel | |
 | 61300621121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Dual Pin Header | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | 1000 MΩ | – | 7.62 | – | – | – | THT | – | 250 | – | – | – | – | – | – | – | – | – | 6 | Dual | – | Pin Header | Gerade | 3 | Beutel | |
 | 61400416021 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-COM USB 2.0 Type A Horizontal | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | 1000 MΩ | – | – | – | – | Type A | THT | 1.5 | 30 | – | – | – | – | – | – | – | – | USB 2.0 | 4 | – | – | Receptacle | Horizontal | 1.5 | Tray |
| Artikel Nr. | Datenblatt | Simulation | |
|---|---|---|---|
| 691213710002 | SPEC | – |
| 82402304 | SPEC | |
| 885012205037 | SPEC | |
| 885012207026 | SPEC | |
| 61300311121 | SPEC | – |
| 61300421121 | SPEC | – |
| 61300621121 | SPEC | – |
| 61400416021 | SPEC | – |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | PCB/Kabel/Panel | Modularity | Wire Section | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Interface typ | Montageart | IR 1 (A) | Arbeitsspannung (V (AC)) | Kanäle | Polarität | VCh max. (V) | VBR min. (V) | CCh typ. (pF) | IPeak (A) | VCh Clamp ESD typ. (V) | VESD Contact (kV) | Anwendung | Pins (Value) (pcs) | Reihen | H (mm) | Gender | Typ | IR (A) | Verpackung | Muster |
|---|