Topologie | Sonstige Topologie |
IC-Revision | D |
The LTM®4693 is an ultrathin, highly efficient, 2A buckboost µModule® DC/DC converter that operates from input voltages above, below or equal to the output voltage. Included in the package are the switching controller, power MOSFETs, inductor and support components. The LTM4693’s advanced topology provides a continuous transfer through all operating modes. VIN operation from 2.6V to 5.5V covers a wide variety of power sources including typical 3.3V and 5V. Output voltage ranging from 1.8V to 5.5V is set by an external resistor. Only a few external components are needed for a typical application
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | Muster | |
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150060VS55040 | SPEC | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMCD SMT Mono-color Chip LED Diffused | 573 | Hellgrün | 575 | 60 | 2 | AlInGaP | 140 | – | – | – | 0603 | -40 °C up to +85 °C | – | – | – | – | 1.6 | 0.8 | 0.4 | – | Tape and Reel | |||
885012205046 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | 2.2 nF | ±10% | 25 | 0402 | -55 °C up to +125 °C | – | 3.5 | 10 GΩ | X7R Klasse II | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | |||
885012006055 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | 47 pF | ±5% | 50 | 0603 | -55 °C up to +125 °C | 1000 | – | 10 GΩ | NP0 Klasse I | 1.6 | 0.8 | 0.8 | 0.4 | 7" Tape & Reel |
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150060VS55040 | SPEC | ||
885012205046 | SPEC | ||
885012006055 | SPEC |
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Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | Muster |
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