IC-Hersteller (99)
- Alle Hersteller
Analog Devices
Infineon Technologies
Microchip
Onsemi
Renesas
ROHM
STMicroelectronics
Texas Instruments
- 3peak incorporated (27)
- Ablic (23)
- Advanced Power (4)
- Allegro Microsystems (84)
- Alpha & Omega Semiconductor (37)
- AnalogySemi (3)
- AnDAPT Inc (163)
- Anpec (13)
- AXElite (2)
- Backward (6)
- Bright Power Semiconductor (1)
- Broadcom (47)
- Cambridge GaN Devices (18)
- Chipanalog Micro (10)
- Cologne Chips (1)
- Convenient Power (1)
- Dialog Semiconductor (12)
- Diodes Incorporated (238)
- Divimath (8)
- Elmos AG (1)
- EPC (99)
- e-Peas Semiconductors (1)
- Eta Solutions Co. Ltd. (9)
- GaN Systems (7)
- GaNPower (3)
- Giantec (1)
- Gstek Wuxi (1)
- Helix Semiconductor (7)
- Ikanos (3)
- IKON (1)
- Indie Semiconductor (5)
- Innovision Semiconductor Inc (2)
- Intel (80)
- Inventchip Technology (3)
- ISSI (51)
- JoulWatt (20)
- KDPOF (2)
- Kinetic Technology (10)
- Lattice semiconductor Corporation (19)
- Littelfuse (1)
- M3 Technology (M3Tek) (7)
- Macnica (16)
- MaxLinear (175)
- MikroE (8)
- MindCet (2)
- Monolithic Power Systems (931)
- Navitas Semiconductor Inc (6)
- NewEdge Technologies, Inc. (1)
- Nexperia (32)
- Nisshinbo Micro Device Inc. (10)
- Nordic Semiconductor (1)
- Novosense Micro (1)
- NXP (314)
- O2 Micro International Ltd (10)
- On Bright (7)
- Panasonic (2)
- PN Junction Semiconductor (2)
- Power Integrations (102)
- Pulsiv (19)
- Qorvo (87)
- Realsil SuRealsil(tek) Microelectronics (1)
- Richtek (296)
- Sanken Electric Co., Ltd. (16)
- Sckipio (6)
- Semtech (90)
- SG-Micro (33)
- Silanna Semiconductor (8)
- Silergy Corporation (29)
- Silicon Laboratory Inc. (104)
- Silicontent Technology (57)
- Silvertel (56)
- Skycore Semiconductors (1)
- Skyworks (31)
- Southchip (8)
- Summit Wireless (1)
- Tagore Tech (7)
- Taiwan Semiconductor (1)
- TDK Corporation (1)
- Tempo Semiconductor (1)
- Torex (37)
- Toshiba (25)
- Transphorm (21)
- TransSIP (2)
- Union (21)
- uPI Semiconductor (2)
- Valens Semiconductor (18)
- Wise Integration (1)
- Wolfspeed (8)
- Xilinx (22)
- XL Semiconductor (3)
- XYSemi (62)
Details
| Topologie | Drahtlose Energieübertragung |
| Eingangsspannung | 0-40 V |
| Ausgang 1 | 1 A |
Beschreibung
The EPC9053 is a high efficiency, differential mode Class-E amplifierdevelopment board that can operate up to 15 MHz. Higher frequencymay be possible but is currently under evaluation. The purpose of thisdevelopment board is to simplify the evaluation process of class-Eamplifier technology using eGaN® FETs by allowing engineers to easilymount all the critical class-E components on a single board that can beeasily connected into an existing system.This board may also be used for applications where a low side switch isutilized. Examples include, and are not limited to, push-pull converters,current-mode Class D amplifiers, common source bi-directional switch,and generic high voltage narrow pulse width applications such as LiDAR.The amplifier board features the 200 V rated EPC2019 eGaN FET. Theamplifier is set to operate in differential mode and can be re-configured tooperate in single-ended mode and includes the gate driver and logicsupply regulator.For more information on the EPC2019 eGaN FETs please refer to thedatasheet available from EPC at www.epc-co.com. The datasheet shouldbe read in conjunction with this quick start guide.
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Raster (mm) | Montageart | IR 1 (A) | Arbeitsspannung (V (AC)) | PCB/Kabel/Panel | Kontaktwiderstand (mΩ) | Tol. R | L (mm) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q | DF (%) | RISO | Keramiktyp | W (mm) | Fl (mm) | Pins (Value) (pcs) | Reihen | H (mm) | Gender | Typ | IR (A) | Verpackung | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 61300111121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Pin Header | 2.54 | THT | – | 250 | – | 20 | max. | 2.54 | – | – | – | – | -40 °C up to +105 °C | – | – | 1000 MΩ | – | – | – | 1 | Single | – | Pin Header | Gerade | 3 | Beutel | |
 | 61300211121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Pin Header | 2.54 | THT | – | 250 | – | 20 | max. | 5.08 | – | – | – | – | -40 °C up to +105 °C | – | – | 1000 MΩ | – | – | – | 2 | Single | – | Pin Header | Gerade | 3 | Beutel | |
 | 645002114822 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-WTB 3.96 mm Male Vertical Locking Header | 3.96 | THT | 7 | 250 | PCB | 20 | max. | 7.92 | – | – | – | – | -40 °C up to +105 °C | – | – | 1000 MΩ | – | – | – | 2 | – | – | Männlich | Vertikal | 7 | Beutel | |
 | 885012005057 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | – | – | – | 1 | 22 pF | ±5% | 50 | 0402 | -55 °C up to +125 °C | 840 | – | 10 GΩ | NP0 Klasse I | 0.5 | 0.25 | – | – | 0.5 | – | – | – | 7" Tape & Reel | ||
| 885012205037 | SPEC | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 16 V(DC) | – | – | – | – | – | – | – | 1 | 100 nF | ±10% | 16 | 0402 | -55 °C up to +125 °C | – | 5 | 5 GΩ | X7R Klasse II | 0.5 | 0.25 | – | – | 0.5 | – | – | – | 7" Tape & Reel | ||
| 885012206076 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | 1.6 | 1 µF | ±10% | 25 | 0603 | -55 °C up to +125 °C | – | 10 | 0.5 GΩ | X7R Klasse II | 0.8 | 0.4 | – | – | 0.8 | – | – | – | 7" Tape & Reel |
| Artikel Nr. | Datenblatt | Simulation | |
|---|---|---|---|
| 61300111121 | SPEC | – |
| 61300211121 | SPEC | – |
| 645002114822 | SPEC | – |
| 885012005057 | SPEC | |
| 885012205037 | SPEC | |
| 885012206076 | SPEC |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Raster (mm) | Montageart | IR 1 (A) | Arbeitsspannung (V (AC)) | PCB/Kabel/Panel | Kontaktwiderstand (mΩ) | Tol. R | L (mm) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q | DF (%) | RISO | Keramiktyp | W (mm) | Fl (mm) | Pins (Value) (pcs) | Reihen | H (mm) | Gender | Typ | IR (A) | Verpackung | Muster |
|---|