IC-Hersteller Intel

IC-Hersteller (99)

Intel 5CGXFC5C6F27C7N

FPGA - Field Programmable Gate Array FPGA - Cyclone V GX 2908 LABs 336 IOs

Details

TopologieAufwärtswandler
Schaltfrequenz800 kHz
IC-Revision2012.12.28

Beschreibung

Altera Cyclone& 174; V 28 nm FPGAs provide the industry's lowest system cost and power, along with performance levels that make the device family ideal for differentiating your high-volume applications. You'll get up to 40 percent lower total power compared with the previous generation, efficient logic integration capabilities, integrated transceiver variants, and SoC FPGA variants with an ARM-based hard processor system (HPS). The family comes in six targeted variants: Cyclone V E FPGA with logic only Cyclone V GX FPGA with 3.125-Gbps transceivers Cyclone V GT FPGA with 5-Gbps transceivers Cyclone V SE SoC FPGA with ARM-based HPS and logic Cyclone V SX SoC FPGA with ARM-based HPS and 3.125-Gbps transceivers Cyclone V ST SoC FPGA with ARM-based HPS and 5-Gbps transceivers

Eigenschaften

  • TSMC's 28-nm low-power (28LP) process technology
  • 1.1 V core voltage
  • Wirebond low-halogen packages
  • Multiple device densities with compatible package footprints for seamless migrationbetween different device densities
  • RoHS-compliant optionsEnhanced 8-input ALM with four registers
  • M10K—10-kilobits (Kb) memory blocks with soft error correction code (ECC)
  • Memory logic array block (MLAB)—640-bit distributed LUTRAM where you canuse up to 25% of the ALMs as MLAB memory
  • Native support for up to three signal processing precision levels(three 9 x 9, two 18 x 18, or one 27 x 27 multiplier) in the samevariable-precision DSP block
  • 64-bit accumulator and cascade
  • Embedded internal coefficient memory
  • Preadder/subtractor for improved efficiencyDDR3, DDR2, and LPDDR2 with 16 and 32 bit ECC supportPCI Express® (PCIe®) Gen2 and Gen1 (x1, x2, or x4) hard IP withmultifunction support, endpoint, and root port
  • Up to 550 MHz global clock network
  • Global, quadrant, and peripheral clock networks
  • Clock networks that are not used can be powered down to reduce dynamic power
  • Precision clock synthesis, clock delay compensation, and zero delay buffering (ZDB)
  • Integer mode and fractional mode
  • 875 megabits per second (Mbps) LVDS receiver and 840 Mbps LVDS transmitter
  • 400 MHz/800 Mbps external memory interface
  • On-chip termination (OCT)
  • 3.3 V support with up to 16 mA drive strength
  • 614 Mbps to 5.0 Gbps integrated transceiver speed
  • Transmit pre-emphasis and receiver equalization
  • Dynamic partial reconfiguration of individual channels
  • Single or dual-core ARM Cortex-A9 MPCore processor-up to 800 MHz maximumfrequency with support for symmetric and asymmetric multiprocessing
  • Interface peripherals—10/100/1000 Ethernet media access control (EMAC), USB 2.0On-The-GO (OTG) controller, quad serial peripheral interface (QSPI) flash controller,NANDflash controller, Secure Digital/MultiMediaCard (SD/MMC) controller, UART,controller area network (CAN), serial peripheral interface (SPI), I2C interface, andup to 85 HPS GPIO interfaces
  • System peripherals—general-purpose timers, watchdog timers, direct memory access(DMA) controller, FPGA configuration manager, and clock and reset managers
  • On-chip RAM and boot ROM
  • HPS–FPGA bridges—include the FPGA-to-HPS, HPS-to-FPGA, and lightweightHPS-to-FPGA bridges that allow the FPGA fabric to issue transactions to slaves inthe HPS, and vice versa
  • FPGA-to-HPS SDRAM controller subsystem—provides a configurable interface tothe multiport front end (MPFE) of the HPS SDRAM controller
  • ARM CoreSight™ JTAG debug access port, trace port, and on-chip trace storage
  • Tamper protection—comprehensive design protection to protect your valuable IPinvestments
  • Enhanced advanced encryption standard (AES) design security features
  • CvP
  • Partial and dynamic reconfiguration of the FPGA
  • Active serial (AS) x1 and x4, passive serial (PS), JTAG, and fast passive parallel (FPP)x8 and x16 configuration options

Weiterführende Informationen

Artikeldaten

Artikel Nr. Daten­blatt Simu­lation Downloads Status ProduktserieL
(µH)
IR 1
(mA)
ISAT
(A)
RDC
(mΩ)
fres
(MHz)
H
(mm)
W
(mm)
IR
(A)
MontageartIRP,40K
(A)
ISAT1
(A)
ISAT,30%
(A)
MaterialZ @ 100 MHz
(Ω)
Zmax
(Ω)
Testbedingung ZmaxIR 2
(mA)
RDC max.
(mΩ)
Typ Muster
744311100SPEC

Anstehende PCN

Aufgrund einer anstehenden PCN wird sich in Kürze das Datenblatt des ausgewählten Produktes ändern. Anbei finden Sie das neue Datenblatt, sowie das noch gültige Datenblatt. Bei weiteren Fragen wenden Sie sich bitte an Ihren Vertriebsmitarbeiter.

8 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WE-HCI SMT-Hochstrominduktivität 1 4.6 85 3.8 6.9 SMT 16.8 8 19 Superflux 4.6
7440530047SPEC
8 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WE-TPC SMT-Speicherdrossel 4.7 1.95 40 2.8 5.8 2.4 SMT 38
74479887310ASPEC
6 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WE-PMI Power-Multilayer-Induktivität 10 600 0.125 300 20 0.8 2 SMT 850 390 High Saturation Current
742792609SPEC
8 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WE-CBF SMT-Ferrit 2000 0.8 0.8 2 SMT 30 40 1000 MHz 3000 40 High Current
Artikel Nr. Daten­blatt Simu­lation
744311100SPEC

Anstehende PCN

Aufgrund einer anstehenden PCN wird sich in Kürze das Datenblatt des ausgewählten Produktes ändern. Anbei finden Sie das neue Datenblatt, sowie das noch gültige Datenblatt. Bei weiteren Fragen wenden Sie sich bitte an Ihren Vertriebsmitarbeiter.

7440530047SPEC
74479887310ASPEC
742792609SPEC
Muster
Artikel Nr. Daten­blatt Simu­lation Downloads Status ProduktserieL
(µH)
IR 1
(mA)
ISAT
(A)
RDC
(mΩ)
fres
(MHz)
H
(mm)
W
(mm)
IR
(A)
MontageartIRP,40K
(A)
ISAT1
(A)
ISAT,30%
(A)
MaterialZ @ 100 MHz
(Ω)
Zmax
(Ω)
Testbedingung ZmaxIR 2
(mA)
RDC max.
(mΩ)
Typ Muster