IC-Hersteller Microchip

IC-Hersteller (99)

Microchip MCP14700 | Demoboard EV84C64A

50W INTERLEAVED LLC CONVERTER DEVELOPMENT BOARD

Details

TopologieSonstige Topologie
Eingangsspannung5 V
Ausgang 19 V / 6 A
IC-RevisionA

Beschreibung

The 50W Interleaved LLC Converter Development Board is a generic development board implementing interleaved LLC topology supporting rapid prototyping and code development based on dsPIC33 DSCs. It utilizes the dsPIC33CH128MP506 DSC supporting a fully digital and advanced power control algorithm scheme. The board is compatible with dsPIC33EP, dsPIC33CK and dsPIC33CH Digital Power Plug-in Modules (DP-PIM)

Eigenschaften

  • Passes AEC-Q100 Automotive Reliability Testing
  • Ideally suited to drive low Figure-of-Merit (FOM) MOSFETs such as Microchip’s MCP87000 MOSFET family
  • Independent PWM Input Control for High-Side and Low-Side Gate Drive
  • Input Logic Level Threshold 3.0V TTL Compatible
  • Dual Output MOSFET Drive for Synchronous Applications
  • High Peak Output Current: 2A (typical)
  • Internal Bootstrap Blocking Device
  • +36V BOOT Pin Maximum Rating
  • Low Supply Current: 45 µA (typical)
  • High Capacitive Load Drive Capability:
  • 3300 pF in 10.0 ns (typical)
  • Input Voltage Undervoltage Lockout Protection
  • Overtemperature Protection
  • Space Saving Packages:
  • 8-Lead SOIC
  • 8-Lead 3x3 DFN

Typische Anwendungen

  • General application, interleaved LLC Converter

Weiterführende Informationen

Artikeldaten

Artikel Nr. Daten­blatt Simu­lation Downloads Status ProduktserieCVR
(V (DC))
Endurance
(h)
BetriebstemperaturIRIPPLE
(mA)
RESR
(mΩ)
ILeak
(µA)
DF
(%)
Ø D
(mm)
L
(mm)
Verpackung Muster
875075355004SPEC
7 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WCAP-PSLC Aluminium-Polymer-Kondensatoren330 µF 16 2000 -55 °C bis zu +105 °C 4700 10 1056 8 8 12.4 15" Tape & Reel
Artikel Nr. Daten­blatt Simu­lation
875075355004SPEC
Muster
Artikel Nr. Daten­blatt Simu­lation Downloads Status ProduktserieCVR
(V (DC))
Endurance
(h)
BetriebstemperaturIRIPPLE
(mA)
RESR
(mΩ)
ILeak
(µA)
DF
(%)
Ø D
(mm)
L
(mm)
Verpackung Muster