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Overview
| Topology | Other Topology |
| Input voltage | 5 V |
| Output 1 | 9 V / 6 A |
| IC revision | A |
Description
The 50W Interleaved LLC Converter Development Board is a generic development board implementing interleaved LLC topology supporting rapid prototyping and code development based on dsPIC33 DSCs. It utilizes the dsPIC33CH128MP506 DSC supporting a fully digital and advanced power control algorithm scheme. The board is compatible with dsPIC33EP, dsPIC33CK and dsPIC33CH Digital Power Plug-in Modules (DP-PIM)
Features
- Passes AEC-Q100 Automotive Reliability Testing
- Ideally suited to drive low Figure-of-Merit (FOM) MOSFETs such as Microchip’s MCP87000 MOSFET family
- Independent PWM Input Control for High-Side and Low-Side Gate Drive
- Input Logic Level Threshold 3.0V TTL Compatible
- Dual Output MOSFET Drive for Synchronous Applications
- High Peak Output Current: 2A (typical)
- Internal Bootstrap Blocking Device
- +36V BOOT Pin Maximum Rating
- Low Supply Current: 45 µA (typical)
- High Capacitive Load Drive Capability:
- 3300 pF in 10.0 ns (typical)
- Input Voltage Undervoltage Lockout Protection
- Overtemperature Protection
- Space Saving Packages:
- 8-Lead SOIC
- 8-Lead 3x3 DFN
Typical applications
- General application, interleaved LLC Converter
More information
Products
| Order Code | Datasheet | Simulation | Downloads | Status | Product series | C | VR (V (DC)) | Endurance (h) | Operating Temperature | IRIPPLE (mA) | RESR (mΩ) | ILeak (µA) | DF (%) | Ø D (mm) | L (mm) | Packaging | Samples | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 875075355004 | SPEC | 7 files | Active i| Production is active. Expected lifetime: >10 years. | WCAP-PSLC Aluminum Polymer Capacitors | 330 µF | 16 | 2000 | -55 °C up to +105 °C | 4700 | 10 | 1056 | 8 | 8 | 12.4 | 15" Tape & Reel |
| Order Code | Datasheet | Simulation | |
|---|---|---|---|
| 875075355004 | SPEC |
| Samples |
|---|
| Order Code | Datasheet | Simulation | Downloads | Status | Product series | C | VR (V (DC)) | Endurance (h) | Operating Temperature | IRIPPLE (mA) | RESR (mΩ) | ILeak (µA) | DF (%) | Ø D (mm) | L (mm) | Packaging | Samples |
|---|