IC-Hersteller Onsemi

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Onsemi RSL10 | Demoboard RSL10-COIN-GEVB

Ultra-low power temperature sensor beacon

Details

TopologieSonstige Topologie

Beschreibung

RSL10-COIN-GEVB is a coin cell operated ultra-low power Bluetooth beacon. The board incorporates a temperature sensor, NCT375, and RSL10, industry's lowest power Bluetooth 5 SoC. With the included CR2032 coin cell and an advertising packet being sent every 2 seconds, the device lasts over 6 years! The beacon follows Eddystone, an open beacon format from Google. A web URL and ambient temperature data embedded in the advertising packet can be read using Beacon Scanner or other freely available beacon scanning apps from the Android and iOS app stores.

Eigenschaften

  • Rx Sensitivity (Bluetooth Low Energy Mode, 1 Mbps): −94 dBm
  • Data Rate: 62.5 to 2000 kbps
  • Transmitting Power: −17 to +6 dBm
  • Peak Rx Current = 5.6 mA (1.25 V VBAT)
  • Peak Rx Current = 3.0 mA (3 V VBAT)
  • Peak Tx Current (0 dBm) = 8.9 mA (1.25 V VBAT)
  • Peak Tx Current (0 dBm) = 4.6 mA (3 V VBAT)
  • Bluetooth 5 Certified with LE 2M PHY Support
  • Arm Cortex−M3 Processor Clocked at up to 48 MHz
  • LPDSP32 for Audio Codec
  • Supply Voltage Range: 1.1 − 3.3 V
  • Current Consumption (1.25 V VBAT):
  • Deep Sleep, IO Wake−up: 50 nA
  • Deep Sleep, 8 kB RAM Retention: 300 nA
  • Audio Streaming at 7 kHz Audio BW: 1.8 mA RX, 1.8 mA TX
  • Current Consumption (3 V VBAT):
  • Deep Sleep, IO Wake−up: 25 nA
  • Deep Sleep, 8 kB RAM Retention: 100 nA
  • Audio Streaming at 7 kHz Audio BW: 0.9 mA RX, 0.9 mA TX
  • 384 kB of Flash Memory
  • Highly−integrated System−on−Chip (SoC)
  • Supports FOTA (Firmware Over−The−Air) Updates

Typische Anwendungen

  • IoT Edge-Node Applications / Bluetooth Low Energy Technology
  • Energy Harvesting
  • Wearables

Weiterführende Informationen

Artikeldaten

Artikel Nr. Daten­blatt Simu­lation Downloads Status ProduktserieCTol. CVR
(V (DC))
BauformBetriebstemperaturQDF
(%)
RISOKeramiktypL
(mm)
W
(mm)
H
(mm)
Fl
(mm)
VerpackungL
(µH)
IR
(A)
ISAT1
(A)
ISAT2
(A)
RDC max.
(mΩ)
fres
(MHz)
Version Muster
885012005013SPEC
8 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WCAP-CSGP MLCCs 10 V(DC)100 pF ±5% 10 0402 -55 °C up to +125 °C 100010 GΩ NP0 Klasse I 1 0.5 0.5 0.25 7" Tape & Reel
885012205012SPEC
8 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WCAP-CSGP MLCCs 10 V(DC)10 nF ±10% 10 0402 -55 °C up to +125 °C 510 GΩ X7R Klasse II 1 0.5 0.5 0.25 7" Tape & Reel
885012105001SPEC
5 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WCAP-CSGP MLCCs 6.3 V(DC)100 nF ±20% 6.3 0402 -55 °C up to +85 °C 101 GΩ X5R Klasse II 1 0.5 0.5 0.25 7" Tape & Reel
74479275222SPEC
8 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WE-PMCI Power Molded Chip Induktivität 0805 -40 °C up to +125 °C 2 1.25 1 0.5 2.2 2.1 1.2 2.4 190 45 Standard
Muster
Artikel Nr. Daten­blatt Simu­lation Downloads Status ProduktserieCTol. CVR
(V (DC))
BauformBetriebstemperaturQDF
(%)
RISOKeramiktypL
(mm)
W
(mm)
H
(mm)
Fl
(mm)
VerpackungL
(µH)
IR
(A)
ISAT1
(A)
ISAT2
(A)
RDC max.
(mΩ)
fres
(MHz)
Version Muster