Topologie | Sonstige Topologie |
Eingangsspannung | 5 V |
Schaltfrequenz | 400 kHz |
Ausgang 1 | 20 V / 5 A |
IC-Revision | Rev1 |
The STUSB4500 is a USB power delivery controller that addresses sink devices. It implements a proprietary algorithm to allow the negotiation of a power delivery contract with a source without MCU support (auto-run mode). PDO profiles are configured in an integrated non-volatile memory.The device supports dead battery mode and is suited for sink devices powered from dead battery state and requiring high power charging profile to be fully operational.Thanks to its 20 V technology, it implements high voltage features to protect the CC pins against short-circuits to VBUS up to 22 V and to support high voltage on the VBUS pins directly connected to the VBUS power path up to 28 V.
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Pins (Value) (pcs) | Anwendung | PCB/Kabel/Panel | Modularity | Typ | Wire Section | Farbe | λPeak B typ. (nm) | λPeak G typ. (nm) | λPeak R typ. (nm) | λDom B typ. (nm) | λDom G typ. (nm) | λDom R typ. (nm) | IV B typ. (mcd) | IV G typ. (mcd) | IV R typ. (mcd) | VF B typ. (V) | VF G typ. (V) | VF R typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | Interface typ | Gender | Montageart | Arbeitsspannung (V (AC)) | Muster | |
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691210910002 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-TBL Series 2109 - 2.54 mm Horiz. Entry | 2 | Rising Cage Clamp | PCB | Nein | Horizontal | 30 to 18 (AWG) 0.2 to 0.75 (mm²) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | – | – | 5.48 | – | – | – | Karton | – | – | THT | 150 | ||
632723300011 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-COM USB 3.1 Type C Receptacle Horizontal THR / SMT | 24 | USB 3.1 | – | – | Horizontal | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | 1000 MΩ | – | – | – | – | – | Tape and Reel | Type C | Receptacle | THR | 20 | ||
885012105006 | SPEC | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 6.3 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 1 µF | ±20% | 6.3 | 0402 | -55 °C up to +85 °C | 15 | 0.1 GΩ | X5R Klasse II | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | |||
885012105018 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 100 nF | ±20% | 25 | 0402 | -55 °C up to +85 °C | 10 | 5 GΩ | X5R Klasse II | 1 | 0.5 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | |||
885012107018 | SPEC | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 4.7 µF | ±20% | 25 | 0805 | -55 °C up to +85 °C | 10 | 0.02 GΩ | X5R Klasse II | 2 | 1.25 | 1.25 | 0.5 | 7" Tape & Reel | – | – | – | – | |||
150066M153000 | SPEC | – | 25 Dateien Strahldaten
| Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SFCD SMT Full-color Chip LED Diffused | – | – | – | – | – | – | Rot & Grün & Blau | 468 | 520 | 632 | 470 | 525 | 624 | 180 | 900 | 285 | 3.3 | 3.3 | 2 | AlInGaP + InGaN | 120 | – | – | – | 0606 | -40 °C up to +85 °C | – | – | – | 1.6 | 1.6 | 0.4 | – | Tape and Reel | – | – | SMT | – |
Artikel Nr. | Datenblatt | Simulation | |
---|---|---|---|
691210910002 | SPEC | – | |
632723300011 | SPEC | – | |
885012105006 | SPEC | ||
885012105018 | SPEC | ||
885012107018 | SPEC | ||
150066M153000 | SPEC | – |
Muster |
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Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Pins (Value) (pcs) | Anwendung | PCB/Kabel/Panel | Modularity | Typ | Wire Section | Farbe | λPeak B typ. (nm) | λPeak G typ. (nm) | λPeak R typ. (nm) | λDom B typ. (nm) | λDom G typ. (nm) | λDom R typ. (nm) | IV B typ. (mcd) | IV G typ. (mcd) | IV R typ. (mcd) | VF B typ. (V) | VF G typ. (V) | VF R typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | Interface typ | Gender | Montageart | Arbeitsspannung (V (AC)) | Muster |
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