IC-Hersteller STMicroelectronics
IC-Hersteller (103)
- Alle Hersteller
Analog Devices
Infineon Technologies
Microchip
Onsemi
Renesas
ROHM
STMicroelectronics
Texas Instruments
- 3peak incorporated (28)
- Ablic (23)
- Acco Semiconductor (1)
- Advanced Power (4)
- Allegro Microsystems (100)
- Alpha & Omega Semiconductor (37)
- AnalogySemi (3)
- AnDAPT Inc (204)
- Anpec (13)
- AXElite (2)
- Backward (6)
- Bright Power Semiconductor (1)
- Broadcom (46)
- Cambridge GaN Devices (18)
- Chipanalog Micro (10)
- Cologne Chips (1)
- Convenient Power (1)
- Dialog Semiconductor (12)
- Diodes Incorporated (259)
- Divimath (8)
- Elmos AG (1)
- EPC (136)
- e-Peas Semiconductors (1)
- Eta Solutions Co. Ltd. (9)
- GaN Systems (8)
- GaNPower (3)
- Giantec (1)
- Gstek Wuxi (1)
- Helix Semiconductor (7)
- IKON (1)
- Indie Semiconductor (8)
- Innovision Semiconductor Inc (2)
- Intel (68)
- Inventchip Technology (3)
- ISSI (51)
- JoulWatt (20)
- KDPOF (3)
- Kinetic Technology (8)
- Lattice semiconductor Corporation (38)
- Littelfuse (1)
- Lumissil Microsystems (8)
- M3 Technology (M3Tek) (7)
- Macnica (22)
- Marvell Semiconductor (1)
- MaxLinear (181)
- Menlo Micro (1)
- MikroE (25)
- MindCet (2)
- Monolithic Power Systems (980)
- Navitas Semiconductor Inc (6)
- NewEdge Technologies, Inc. (1)
- Nexperia (266)
- Nisshinbo Micro Device Inc. (10)
- Novosense Micro (1)
- NXP (333)
- O2 Micro International Ltd (10)
- On Bright (7)
- Panasonic (2)
- PN Junction Semiconductor (2)
- Power Integrations (117)
- Powermat (1)
- Pulsiv (19)
- Qorvo (96)
- Realsil SuRealsil(tek) Microelectronics (1)
- Richtek (297)
- Sanken Electric Co., Ltd. (16)
- Sckipio (6)
- Semtech (86)
- SG-Micro (54)
- SiFive (2)
- Silanna Semiconductor (9)
- Silergy Corporation (33)
- Silicon Laboratory Inc. (108)
- Silicontent Technology (59)
- Silvertel (59)
- Skycore Semiconductors (1)
- Skyworks (33)
- Southchip (14)
- Summit Wireless (1)
- Tagore Tech (7)
- Taiwan Semiconductor (1)
- TDK Corporation (1)
- Tempo Semiconductor (1)
- Torex (37)
- Toshiba (25)
- Transphorm (21)
- TransSIP (2)
- Union (21)
- uPI Semiconductor (2)
- Valens Semiconductor (31)
- Wise Integration (3)
- Wolfspeed (23)
- Xilinx (22)
- XL Semiconductor (3)
- XYSemi (62)
STMicroelectronics STUSB4500 | Demoboard STREF-SCS001V1
Stand-alone USB PD controller (with sink Auto-run mode)
Details
| Topologie | Sonstige Topologie |
| Eingangsspannung | 5 V |
| Schaltfrequenz | 400 kHz |
| Ausgang 1 | 20 V / 5 A |
| IC-Revision | Rev1 |
Beschreibung
The STUSB4500 is a USB power delivery controller that addresses sink devices. It implements a proprietary algorithm to allow the negotiation of a power delivery contract with a source without MCU support (auto-run mode). PDO profiles are configured in an integrated non-volatile memory.The device supports dead battery mode and is suited for sink devices powered from dead battery state and requiring high power charging profile to be fully operational.Thanks to its 20 V technology, it implements high voltage features to protect the CC pins against short-circuits to VBUS up to 22 V and to support high voltage on the VBUS pins directly connected to the VBUS power path up to 28 V.
Eigenschaften
- Auto-run Type-C™ and USB PD sink controller
- Dead battery mode support
- Up to 3 sink PDO configurable profiles
- Dual high power charging path support
- Integrated VBUS switch gate drivers (PMOS)
- Integrated VBUS voltage monitoring
- Internal and/or external VBUS discharge paths
- Short-to-VBUS protections on CC pins (22 V)
- High voltage capability on VBUS pins (28 V)
- Dual power supply (VSYS and/or VDD):
- VSYS = [3.0 V; 5.5 V]
- VDD = [4.1 V; 22 V]
- Debug accessory mode support
- Temperature range: -40 °C up to 105 °C
- ESD: 3 kV HBM - 1.5 kV CDM
- Certified:
- USB Type-C™ rev 1.2
- USB PD rev 2.0 (TID #1000133)
- Interoperable with USB PD rev 3.0
Typische Anwendungen
- LED lighting and industrial
- Toys, gaming, POS, scanner
- power any application up to 100W (20 V, 5 A)
- IoT, drones, accessories and battery powered devices
- Healthcare and handheld devices
- Printers, camcorders, cameras / Any Type-C sink device
Weiterführende Informationen
Artikeldaten
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Pins | PCB/Kabel/Panel | Modularity | Typ | Wire Section | Farbe | λPeak B typ.(nm) | λPeak G typ.(nm) | λPeak R typ.(nm) | λDom B typ.(nm) | λDom G typ.(nm) | λDom R typ.(nm) | IV B typ.(mcd) | IV G typ.(mcd) | IV R typ.(mcd) | VF B typ.(V) | VF G typ.(V) | VF R typ.(V) | Chiptechnologie | 2θ50% typ.(°) | C | Tol. C | VR(V (DC)) | Bauform | Betriebstemperatur | DF(%) | RISO | Keramiktyp | L(mm) | B(mm) | H(mm) | Fl(mm) | Verpackung | Interface typ | Gender | Montageart | Leiterplattendicke(mm) | IR(A) | Arbeitsspannung(V (AC)) | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | WR-TBL Series 2109 - 2.54 mm Horiz. Entry, 2, Käfigzugklemme | Simulation– | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWR-TBL Series 2109 - 2.54 mm Horiz. Entry | Pins2 | PCB/Kabel/PanelPCB | ModularityNein | TypHorizontal | Wire Section 30 to 18 (AWG) 0.2 to 0.75 (mm²) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Betriebstemperatur -40 °C up to +105 °C | – | – | – | Länge5.48 mm | – | – | – | VerpackungKarton | – | – | MontageartTHT | – | Nennstrom6 A | Arbeitsspannung150 V (AC) | |||
 | WR-USB Type C Connectors, 24, USB 3.1 | Simulation– | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWR-USB Type C Connectors | Pins24 | – | – | TypHorizontal | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Betriebstemperatur -40 °C up to +105 °C | – | Isolationswiderstand1000 MΩ | – | – | – | – | – | VerpackungTape and Reel | Interface typType C | GenderBuchse | MontageartTHR | Leiterplattendicke1.6 mm | Nennstrom5 A | Arbeitsspannung48 V (AC) | |||
| WCAP-CSGP MLCCs 6.3 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 6.3 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität1 µF | Kapazität±20% | Nennspannung6.3 V (DC) | Bauform0402 | Betriebstemperatur -55 °C up to +85 °C | Verlustfaktor15 % | Isolationswiderstand0.1 GΩ | KeramiktypX5R Klasse II | Länge1 mm | Breite0.5 mm | Höhe0.5 mm | Pad Dimension0.25 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 25 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität100 nF | Kapazität±20% | Nennspannung25 V (DC) | Bauform0402 | Betriebstemperatur -55 °C up to +85 °C | Verlustfaktor10 % | Isolationswiderstand5 GΩ | KeramiktypX5R Klasse II | Länge1 mm | Breite0.5 mm | Höhe0.5 mm | Pad Dimension0.25 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | |||||
| WCAP-CSGP MLCCs 25 V(DC), –, – | Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | Kapazität4.7 µF | Kapazität±20% | Nennspannung25 V (DC) | Bauform0805 | Betriebstemperatur -55 °C up to +85 °C | Verlustfaktor10 % | Isolationswiderstand0.02 GΩ | KeramiktypX5R Klasse II | Länge2 mm | Breite1.25 mm | Höhe1.25 mm | Pad Dimension0.5 mm | Verpackung7" Tape & Reel | – | – | – | – | – | – | |||||
 | WL-SFCD SMT Full-color Chip LED Diffused, –, – | Simulation– | Downloads26 Dateien Strahldaten
| Status Aktivi| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | ProduktserieWL-SFCD SMT Full-color Chip LED Diffused | – | – | – | – | – | FarbeRot & Grün & Blau | Spitzen-Wellenlänge (Blau) [typ.]468 nm | Spitzen-Wellenlänge (Grün) [typ.]520 nm | Spitzen-Wellenlänge (Rot) [typ.]632 nm | dominante Wellenlänge (Blau) [typ.]470 nm | dominante Wellenlänge (Grün) [typ.]525 nm | dominante Wellenlänge (Rot) [typ.]624 nm | Lichtstärke (Blau) [typ.]180 mcd | Lichtstärke (Grün) [typ.]900 mcd | Lichtstärke (Rot) [typ.]285 mcd | Durchlassspannung (Blau) [typ.]3.3 V | Durchlassspannung (Grün) [typ.]3.3 V | Durchlassspannung (Rot) [typ.]2 V | ChiptechnologieAlInGaP + InGaN | Abstrahlwinkel Phi 0° [typ.]120 ° | – | – | – | Bauform0606 | Betriebstemperatur -40 °C up to +85 °C | – | – | – | Länge1.6 mm | Breite1.6 mm | Höhe0.4 mm | – | VerpackungTape and Reel | – | – | MontageartSMT | – | – | – |