Topologie | Drahtlose Energieübertragung |
The STEVAL-ISB044V1 evaluation kit has been designed for devices, such as smartphones or tablets, requiring high power levels. It supports wireless battery charging up to 15 W. The embedded STWBC-EP digital controller transmitter is based on a cost-effective half-bridge topology providing external interfaces via UART and I²C. The kit also includes STWBC-EP firmware, a graphical interface for debug, schematics, layout files and bill of materials. There are specific tools for the STEVALISB044V1 available on www.st.com which give runtime information, such as the power delivered, the regulation error or the protocol status as well as parameter tuning.
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | ISAT (A) | RDC (mΩ) | IRP,40K (A) | ISAT,30% (A) | RDC typ. (mΩ) | VOP (V) | Montageart | Version | Anwendung | Interface typ | IR 1 (mA) | Arbeitsspannung (V (AC)) | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR 2 (mA) | RDC max. (Ω) | Typ | Compliance | Bauform | L (µH) | IR (mA) | fres (MHz) | Q | P (W) | Pins (Value) (pcs) | Reihen | H (mm) | Gender | Verpackung | Muster | |
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155124VS73200 | SPEC | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMSW SMT Mono-color Side View Waterclear | 573 | Hellgrün | 575 | 50 | 2 | AlInGaP | 120 | – | – | – | -40 °C up to +85 °C | – | – | – | 3.2 | 1.5 | – | – | – | – | – | – | – | SMT | – | – | – | – | – | – | – | – | – | – | – | – | 1204 | – | – | – | – | – | – | – | 1 | – | Tape and Reel | |||
155124RS73200 | SPEC | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMSW SMT Mono-color Side View Waterclear | 624 | Rot | 632 | 130 | 2 | AlInGaP | 120 | – | – | – | -40 °C up to +85 °C | – | – | – | 3.2 | 1.5 | – | – | – | – | – | – | – | SMT | – | – | – | – | – | – | – | – | – | – | – | – | 1204 | – | – | – | – | – | – | – | 1 | – | Tape and Reel | |||
74279262 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-CBF SMT-Ferrit | – | – | – | – | – | – | – | – | – | – | -55 °C up to +125 °C | – | – | – | 1.6 | 0.8 | 0.3 | – | – | – | – | – | – | SMT | SMT | – | – | 500 | – | 120 | 200 | 510 MHz | 1350 | 0.3 | Breitband | – | 0603 | – | 500 | – | – | – | – | – | 0.8 | – | – | |||
74404054022 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-LQS SMT-Speicherdrossel | – | – | – | – | – | – | – | – | – | – | -40 °C up to +125 °C | – | – | – | 5 | 5 | – | 5.3 | 19 | – | – | – | 120 | SMT | – | – | – | – | – | – | – | – | – | – | – | – | 5040 | 2.2 | 3800 | 77 | – | – | – | – | 4 | – | – | |||
7447714047 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-PD SMT-Speicherdrossel | – | – | – | – | – | – | – | – | – | – | -40 °C up to +150 °C | – | – | – | 10 | 10 | – | 8 | – | – | – | 10.4 | 120 | SMT | Performance | – | – | – | – | – | – | – | – | 0.0124 | – | – | 1050 | 4.7 | 7000 | 34 | – | – | 2 | – | 5 | – | – | |||
74438323100 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-MAPI SMT-Speicherdrossel | – | – | – | – | – | – | – | – | – | – | -40 °C up to +125 °C | – | – | – | 2.5 | 2 | – | 1.35 | – | 0.9 | 1.7 | 733 | 80 | SMT | SMT | – | – | – | – | – | – | – | – | 0.843 | – | – | 2510 | 10 | 600 | 25 | – | – | 2 | – | 1 | – | – | |||
760308104113 | SPEC | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-WPCC Wireless Power Transfer Transmitter Spule | – | – | – | – | – | – | – | – | – | – | -20 °C up to +105 °C | – | – | – | 59.5 | 52 | – | 12 | – | – | – | 60 | – | THT | THT | – | – | – | – | – | – | – | – | 0.072 | – | Qi - A13 | 60 x 52 x 4 mm | 12 | 8000 | 16 | 120 | 150 | 2 | – | 6 | – | – | |||
885012108021 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | 10 µF | ±20% | 25 | -55 °C up to +85 °C | 10 | 0.01 GΩ | X5R Klasse II | 3.2 | 1.6 | 0.6 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 1206 | – | – | – | – | – | – | – | 1.6 | – | 7" Tape & Reel | |||
885012109014 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | 22 µF | ±20% | 25 | -55 °C up to +85 °C | 10 | 0.005 GΩ | X5R Klasse II | 3.2 | 2.5 | 0.6 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 1210 | – | – | – | – | – | – | – | 2.5 | – | 7" Tape & Reel | |||
629105150521 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-COM Micro USB 2.0 SMT Type B Horizontal 5 Contacts High Current | – | – | – | – | – | – | – | – | – | – | -40 °C up to +85 °C | – | 1000 MΩ | – | – | – | – | – | – | – | – | – | – | SMT | – | Micro USB 2.0 | Type B | 3000 | 30 | – | – | – | – | – | Horizontal | – | – | – | 3000 | – | – | – | 5 | – | – | Receptacle | Tape and Reel | ||
61300311121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | 1000 MΩ | – | 7.62 | – | – | – | – | – | – | – | – | THT | – | – | – | – | 250 | – | – | – | – | – | Gerade | – | – | – | 3000 | – | – | – | 3 | Single | – | Pin Header | Beutel | ||
61400416021 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-COM USB 2.0 Type A Horizontal | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | 1000 MΩ | – | – | – | – | – | – | – | – | – | – | THT | – | USB 2.0 | Type A | 1500 | 30 | – | – | – | – | – | Horizontal | – | – | – | 1500 | – | – | – | 4 | – | – | Receptacle | Tray |
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Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | ISAT (A) | RDC (mΩ) | IRP,40K (A) | ISAT,30% (A) | RDC typ. (mΩ) | VOP (V) | Montageart | Version | Anwendung | Interface typ | IR 1 (mA) | Arbeitsspannung (V (AC)) | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR 2 (mA) | RDC max. (Ω) | Typ | Compliance | Bauform | L (µH) | IR (mA) | fres (MHz) | Q | P (W) | Pins (Value) (pcs) | Reihen | H (mm) | Gender | Verpackung | Muster |
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