Topologie | Drahtlose Energieübertragung |
Eingangsspannung | 3-5.5 V |
Ausgang 1 | 5 V / 3 A |
IC-Revision | 1 |
The STEVAL-ISB044V1 evaluation kit has been designed for devices, such assmartphones or tablets, requiring high power levels.It supports wireless battery charging up to 15 W.The embedded STWBC-EP digital controller transmitter is based on a cost-effectivehalf-bridge topology providing external interfaces via UART and I²C.The kit also includes STWBC-EP firmware, a graphical interface for debug,schematics, layout files and bill of materials.There are specific tools for the STEVAL-ISB044V1 available on www.st.com whichgive runtime information, such as the power delivered, the regulation error or theprotocol status as well as parameter tuning.
STWBC-EP digital controller
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | ISAT (A) | RDC (mΩ) | IRP,40K (A) | ISAT,30% (A) | RDC typ. (mΩ) | VOP (V) | Montageart | Version | Anwendung | Interface typ | IR 1 (mA) | Arbeitsspannung (V (AC)) | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR 2 (mA) | RDC max. (Ω) | Typ | Compliance | Bauform | L (µH) | IR (mA) | fres (MHz) | Q | P (W) | Pins (Value) (pcs) | Reihen | H (mm) | Gender | Verpackung | Muster | |
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155124VS73200 | SPEC | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMSW SMT Mono-color Side View Waterclear | 573 | Hellgrün | 575 | 50 | 2 | AlInGaP | 120 | – | – | – | -40 °C up to +85 °C | – | – | – | 3.2 | 1.5 | – | – | – | – | – | – | – | SMT | – | – | – | – | – | – | – | – | – | – | – | – | 1204 | – | – | – | – | – | – | – | 1 | – | Tape and Reel | |||
155124RS73200 | SPEC | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMSW SMT Mono-color Side View Waterclear | 624 | Rot | 632 | 130 | 2 | AlInGaP | 120 | – | – | – | -40 °C up to +85 °C | – | – | – | 3.2 | 1.5 | – | – | – | – | – | – | – | SMT | – | – | – | – | – | – | – | – | – | – | – | – | 1204 | – | – | – | – | – | – | – | 1 | – | Tape and Reel | |||
74279262 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-CBF SMT-Ferrit | – | – | – | – | – | – | – | – | – | – | -55 °C up to +125 °C | – | – | – | 1.6 | 0.8 | 0.3 | – | – | – | – | – | – | SMT | SMT | – | – | 500 | – | 120 | 200 | 510 MHz | 1350 | 0.3 | Breitband | – | 0603 | – | 500 | – | – | – | – | – | 0.8 | – | – | |||
74404054022 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-LQS SMT-Speicherdrossel | – | – | – | – | – | – | – | – | – | – | -40 °C up to +125 °C | – | – | – | 5 | 5 | – | 5.3 | 19 | – | – | – | 120 | SMT | – | – | – | – | – | – | – | – | – | – | – | – | 5040 | 2.2 | 3800 | 77 | – | – | – | – | 4 | – | – | |||
7447714047 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-PD SMT-Speicherdrossel | – | – | – | – | – | – | – | – | – | – | -40 °C up to +150 °C | – | – | – | 10 | 10 | – | 8 | – | – | – | 10.4 | 120 | SMT | Performance | – | – | – | – | – | – | – | – | 0.0124 | – | – | 1050 | 4.7 | 7000 | 34 | – | – | 2 | – | 5 | – | – | |||
74438323100 | SPEC | 9 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-MAPI SMT-Speicherdrossel | – | – | – | – | – | – | – | – | – | – | -40 °C up to +125 °C | – | – | – | 2.5 | 2 | – | 1.35 | – | 0.9 | 1.7 | 733 | 80 | SMT | SMT | – | – | – | – | – | – | – | – | 0.843 | – | – | 2510 | 10 | 600 | 25 | – | – | 2 | – | 1 | – | – | |||
760308104113 | SPEC | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-WPCC Wireless Power Transfer Transmitter Spule | – | – | – | – | – | – | – | – | – | – | -20 °C up to +105 °C | – | – | – | 59.5 | 52 | – | 12 | – | – | – | 60 | – | THT | THT | – | – | – | – | – | – | – | – | 0.072 | – | Qi - A13 | 60 x 52 x 4 mm | 12 | 8000 | 16 | 120 | 150 | 2 | – | 6 | – | – | |||
885012108021 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | 10 µF | ±20% | 25 | -55 °C up to +85 °C | 10 | 0.01 GΩ | X5R Klasse II | 3.2 | 1.6 | 0.6 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 1206 | – | – | – | – | – | – | – | 1.6 | – | 7" Tape & Reel | |||
885012109014 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | 22 µF | ±20% | 25 | -55 °C up to +85 °C | 10 | 0.005 GΩ | X5R Klasse II | 3.2 | 2.5 | 0.6 | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 1210 | – | – | – | – | – | – | – | 2.5 | – | 7" Tape & Reel | |||
629105150521 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-COM Micro USB 2.0 SMT Type B Horizontal 5 Contacts High Current | – | – | – | – | – | – | – | – | – | – | -40 °C up to +85 °C | – | 1000 MΩ | – | – | – | – | – | – | – | – | – | – | SMT | – | Micro USB 2.0 | Type B | 3000 | 30 | – | – | – | – | – | Horizontal | – | – | – | 3000 | – | – | – | 5 | – | – | Receptacle | Tape and Reel | ||
61300311121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | 1000 MΩ | – | 7.62 | – | – | – | – | – | – | – | – | THT | – | – | – | – | 250 | – | – | – | – | – | Gerade | – | – | – | 3000 | – | – | – | 3 | Single | – | Pin Header | Beutel | ||
61400416021 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-COM USB 2.0 Type A Horizontal | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | 1000 MΩ | – | – | – | – | – | – | – | – | – | – | THT | – | USB 2.0 | Type A | 1500 | 30 | – | – | – | – | – | Horizontal | – | – | – | 1500 | – | – | – | 4 | – | – | Receptacle | Tray |
Muster |
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Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | ISAT (A) | RDC (mΩ) | IRP,40K (A) | ISAT,30% (A) | RDC typ. (mΩ) | VOP (V) | Montageart | Version | Anwendung | Interface typ | IR 1 (mA) | Arbeitsspannung (V (AC)) | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR 2 (mA) | RDC max. (Ω) | Typ | Compliance | Bauform | L (µH) | IR (mA) | fres (MHz) | Q | P (W) | Pins (Value) (pcs) | Reihen | H (mm) | Gender | Verpackung | Muster |
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