Topologie | Drahtlose Energieübertragung |
Eingangsspannung | 3-5.5 V |
Ausgang 1 | 5 V / 1 A |
IC-Revision | V1 |
The STWBC digital controller for wireless battery charger (WBC) transmitters from STMicroelectronics offers the most flexible and efficient solution for controlling power transfer from a WBC transmitter (TX) to a receiver (RX) in WBC-enabled phones, wearables, and other battery-powered devices that use electromagnetic induction for re-charge. As a member of the Qi Wireless Power Consortium and the PMA (Power Matters Alliance), ST ensures full compatibility with these leading wireless-charging protocols and is one of the first companies that hold certification for the newest Qi 1.1.2 A11 standard. The STWBC performs all the essential functions for transmitter control: it is able to precisely control the amount of transmitted power to match the requirements of the receiving unit in terms of maximizing the efficiency of the power transfer and minimizing any increase in operating temperature. The digital feedback between TX and RX units also allows the detection of metal objects close to the receiver (foreign object detection FOD) that could result in potential hazards, enabling the STWBC to stop power transmission when such objects are detected.
Uniquely, the STWBC comes with firmware options to offer customers the ability to personalize their end product without the need of external microcontrollers:
The device is offered together with a complete ecosystem to support customers in building their applications, including the Qi 1.1.2 A11-certified reference design board (STEVAL-ISB027V1), API libraries and documentation to develop software customizations, as well as a comprehensive graphical user interface to monitor real-time performance and diagnostics.
Housed in a VFQFPN32 package, the STWBC is available in full production at a price of US$3.00 in 1k volumes.
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | L (µH) | IR (mA) | ISAT (A) | RDC (mΩ) | fres (MHz) | RDC max. (Ω) | Version | Wicklungstyp | Wicklungsanzahl | L1 (µH) | Z (Ω) | IR 1 (mA) | RDC1 max. (Ω) | VR (V) | Compliance | Bauform | L2 (µH) | L3 (µH) | IR DC1 (A) | IR DC2 (A) | IR DC3 (A) | RDC2 max. (mΩ) | RDC3 max. (mΩ) | fres 1 (MHz) | fres 2 (MHz) | fres 3 (MHz) | P (W) | Muster | |
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155124VS73200 | SPEC | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMSW SMT Mono-color Side View Waterclear | 573 | Hellgrün | 575 | 50 | 2 | AlInGaP | 120 | – | – | -40 °C up to +85 °C | – | – | – | 3.2 | 1.5 | 1 | – | Tape and Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 1204 | – | – | – | – | – | – | – | – | – | – | – | |||
155124RS73200 | SPEC | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMSW SMT Mono-color Side View Waterclear | 624 | Rot | 632 | 130 | 2 | AlInGaP | 120 | – | – | -40 °C up to +85 °C | – | – | – | 3.2 | 1.5 | 1 | – | Tape and Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 1204 | – | – | – | – | – | – | – | – | – | – | – | |||
744273222 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-SL5 HC Stromkompensierter SMT Line Filter | – | – | – | – | – | – | – | – | – | -40 °C up to +125 °C | – | – | – | 9.5 | 8.3 | 5 | – | – | 30 | 1400 | – | – | – | 0.06 | SMT | sectional | 2 | 30 | 2200 | 1400 | 0.06 | 80 | – | – | – | – | – | – | – | – | – | – | – | – | – | |||
74404054022 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-LQS SMT-Speicherdrossel | – | – | – | – | – | – | – | – | – | -40 °C up to +125 °C | – | – | – | 5 | 5 | 4 | – | – | 2.2 | 3800 | 5.3 | 19 | 77 | – | – | – | – | – | – | – | – | – | – | 5040 | – | – | – | – | – | – | – | – | – | – | – | |||
7447714033 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-PD SMT-Speicherdrossel | – | – | – | – | – | – | – | – | – | -40 °C up to +150 °C | – | – | – | 10 | 10 | 5 | – | – | 3.3 | 7500 | 9 | – | 42 | 0.0105 | Performance | – | 5.5 | – | – | – | – | – | – | 1050 | – | – | – | – | – | – | – | – | – | – | – | |||
760308106 | SPEC | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-WPCC Wireless Power Array | – | – | – | – | – | – | – | – | – | – | – | – | – | 130 | 54.7 | 8 | – | – | – | – | – | – | – | – | THT | – | – | 12.5 | – | 9000 | 0.065 | – | Qi - A6 | 130 x 55 x 8 mm | 11.5 | 12.5 | 9 | 9 | 9 | 65 | 65 | 14 | 14 | 14 | 150 | |||
885012108021 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | 10 µF | ±20% | -55 °C up to +85 °C | 10 | 0.01 GΩ | X5R Klasse II | 3.2 | 1.6 | 1.6 | 0.6 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | 25 | – | 1206 | – | – | – | – | – | – | – | – | – | – | – | |||
885012109013 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | 10 µF | ±20% | -55 °C up to +85 °C | 10 | 0.01 GΩ | X5R Klasse II | 3.2 | 2.5 | 2 | 0.75 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | 25 | – | 1210 | – | – | – | – | – | – | – | – | – | – | – | |||
885012109014 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | – | – | – | 22 µF | ±20% | -55 °C up to +85 °C | 10 | 0.005 GΩ | X5R Klasse II | 3.2 | 2.5 | 2.5 | 0.6 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | 25 | – | 1210 | – | – | – | – | – | – | – | – | – | – | – | |||
750315121 | SPEC | 5 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | Transformer | – | – | – | – | – | – | – | – | – | -40 °C up to +125 °C | – | – | – | 19.55 | 23.75 | 10.65 | – | Tape and Reel | 5 | – | 8.5 | – | – | – | – | – | – | – | – | – | – | – | – | EPC17 | – | – | – | – | – | – | – | – | – | – | – |
Artikel Nr. | Datenblatt | Simulation | |
---|---|---|---|
155124VS73200 | SPEC | ||
155124RS73200 | SPEC | ||
744273222 | SPEC | ||
74404054022 | SPEC | ||
7447714033 | SPEC | ||
760308106 | SPEC | ||
885012108021 | SPEC | ||
885012109013 | SPEC | ||
885012109014 | SPEC | ||
750315121 | SPEC |
Muster |
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Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | H (mm) | Fl (mm) | Verpackung | L (µH) | IR (mA) | ISAT (A) | RDC (mΩ) | fres (MHz) | RDC max. (Ω) | Version | Wicklungstyp | Wicklungsanzahl | L1 (µH) | Z (Ω) | IR 1 (mA) | RDC1 max. (Ω) | VR (V) | Compliance | Bauform | L2 (µH) | L3 (µH) | IR DC1 (A) | IR DC2 (A) | IR DC3 (A) | RDC2 max. (mΩ) | RDC3 max. (mΩ) | fres 1 (MHz) | fres 2 (MHz) | fres 3 (MHz) | P (W) | Muster |
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