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Texas Instruments TIDA-010057 | Demoboard TIDA-010057
Ultrasound smart probe power supply reference design
Details
| Topologie | Abwärts- und Aufwärtswandler |
Beschreibung
Significant technological advancements and high degree of integration in Medical imaging, especially hand-held ultrasound smart probes, are pushing engineers to come up with highly-efficient, noise immune power solutions in a small size. This reference design documents end to end power and data solution for our high performance 128-channel Tx/64-channel Rx ultrasound smart probe solution with TX7332 transmit chip and AFE5832LP receive chip. The power tree includes a single-stage transformer-less HV generation (up to +/- 80V & height <5mm) for transmit and the point-of-load LV for the AFEs & FPGA from a 5V USB Type-C™ input. This design enables low-noise (<10mV ripple) efficient rails and better thermal performance (< 10°C temp rise) achieving system efficiency ~80%, receive data SNR > 55dB and ultra-compact size (90mm x 45mm x 20mm). All power rails can be synchronized to an external clock using our integrated buffer-divider CDCE949. This design also supports 1S battery input with a normal ultrasound operation of up to 2 hours.
Eigenschaften
Transformer less dual rail HV (±80V @ 25 mA) generation from 5V USB in single stage implementation to meet component height requirement of < 5mmLow ripple and LV supply for the front end and FPGA from a 5V USB Type-C inputCompact board size (< 90mm x 45 mm x 20mm)End to End System Efficiency ~80% running at full loadSNR > 55dB (Noise Floor below -90dB)EN/DISABLE supplies for power optimization and all rails can be synchronized to external clockAccurate real time power consumption measurement using high performance instrumentation amplifiers INA231High speed data acquisition over USB Type C up to 4.2 Gbps
Typische Anwendungen
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | IR (mA) | RDC (Ω) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Verpackung | L (µH) | IR 1 (mA) | ISAT (mA) | fres (MHz) | Montageart | Anwendung | Interface typ | Gender | Pins (Value) (pcs) | IR 1 (mA) | Arbeitsspannung (V (DC)) | H (mm) | Betätigungskraft (Value) (g) | Elektrische Lebensdauer (Cycles) | Actuator-Farbe | Dampfphasenprozess | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR 2 (mA) | RDC max. (Ω) | Typ | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 742792609 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-CBF SMT-Ferrit | 2000 | – | – | – | – | 0603 | -55 °C up to +125 °C | – | – | – | – | 1.6 | 0.8 | 0.3 | – | – | 2000 | – | – | SMT | – | – | – | – | 3000 | – | 0.8 | – | – | – | – | 30 | 40 | 1000 MHz | 3000 | 0.04 | High Current | ||
 | 782633601 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-CBA SMT EMI Suppression Ferrite Bead | 1000 | 0.2 | – | – | – | 0603 | -55 °C up to +125 °C | – | – | – | – | 1.6 | 0.8 | 0.3 | – | – | – | – | – | SMT | – | – | – | – | – | – | 0.8 | – | – | – | – | 600 | 660 | 190 MHz | – | – | High Current | ||
 | 74479775233 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-PMI Power-Multilayer-Induktivität | – | 0.2 | – | – | – | 0805 | -40 °C up to +125 °C | 25 | – | – | – | 2 | 1.2 | – | – | 3.3 | 700 | 280 | 30 | SMT | – | – | – | 2 | – | – | 1 | – | – | – | – | – | – | – | 1000 | 0.25 | Low RDC | ||
 | 74404084101 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-LQS SMT-Speicherdrossel | 1200 | 0.29 | – | – | – | 8040 | -40 °C up to +125 °C | – | – | – | – | 8 | 8 | – | – | 100 | – | 1500 | 6.4 | SMT | – | – | – | – | – | – | 4.2 | – | – | – | – | – | – | – | – | – | – | ||
 | 744043102 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-TPC SMT-Speicherdrossel | 140 | – | – | – | – | 4828 | -40 °C up to +125 °C | – | – | – | – | 4.8 | 4.8 | – | – | 1000 | – | 80 | 2.3 | SMT | – | – | – | 2 | – | – | 2.8 | – | – | – | – | – | – | – | – | 7 | – | ||
 | 885012005061 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | 100 pF | ±5% | 50 | 0402 | -55 °C up to +125 °C | 1000 | – | 10 GΩ | NP0 Klasse I | 1 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | 0.5 | – | – | – | – | – | – | – | – | – | – | ||
| 885012205031 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 16 V(DC) | – | – | 10 nF | ±10% | 16 | 0402 | -55 °C up to +125 °C | – | 3.5 | 10 GΩ | X7R Klasse II | 1 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | 0.5 | – | – | – | – | – | – | – | – | – | – | ||
| 885012206048 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 16 V(DC) | – | – | 220 nF | ±10% | 16 | 0603 | -55 °C up to +125 °C | – | 5 | 2.3 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.4 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | 0.8 | – | – | – | – | – | – | – | – | – | – | ||
| 885012206052 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 16 V(DC) | – | – | 1 µF | ±10% | 16 | 0603 | -55 °C up to +125 °C | – | 10 | 0.1 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.4 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | 0.8 | – | – | – | – | – | – | – | – | – | – | ||
| 885012206095 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | 100 nF | ±10% | 50 | 0603 | -55 °C up to +125 °C | – | 3 | 5 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.4 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | 0.8 | – | – | – | – | – | – | – | – | – | – | ||
| 885012207026 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 10 V(DC) | – | – | 10 µF | ±10% | 10 | 0805 | -55 °C up to +125 °C | – | 10 | 0.01 GΩ | X7R Klasse II | 2 | 1.25 | 0.5 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | 1.25 | – | – | – | – | – | – | – | – | – | – | ||
 | 434153017835 | SPEC | – | 5 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WS-TASV J-Bend SMT Tact Switch 3.5x2.9 mm | 50 | – | – | – | 12 | – | -40 °C up to +85 °C | – | – | 100 MΩ | – | – | – | – | Tape and Reel | – | – | – | – | – | – | – | – | – | – | – | 1.7 | 350 | 200000 | Blau | nicht spezifiziert | – | – | – | – | – | – | |
 | 632723300011 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-COM USB 3.1 Type C Receptacle Horizontal THR / SMT | 5000 | – | – | – | – | – | -40 °C up to +105 °C | – | – | 1000 MΩ | – | – | – | – | Tape and Reel | – | – | – | – | THR | USB 3.1 | Type C | Receptacle | 24 | – | 20 | – | – | – | – | – | – | – | – | – | – | Horizontal |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | IR (mA) | RDC (Ω) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Verpackung | L (µH) | IR 1 (mA) | ISAT (mA) | fres (MHz) | Montageart | Anwendung | Interface typ | Gender | Pins (Value) (pcs) | IR 1 (mA) | Arbeitsspannung (V (DC)) | H (mm) | Betätigungskraft (Value) (g) | Elektrische Lebensdauer (Cycles) | Actuator-Farbe | Dampfphasenprozess | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR 2 (mA) | RDC max. (Ω) | Typ | Muster |
|---|