Topologie | Sonstige Topologie |
IC-Revision | E1 |
The TIDA-01602 TIkit reference design features two separate USB C designs on one breakable PCB board. The two designs are a 20-V, 60-W minimum barrel jack to USB Type-C Power Delivery (PD) converter and a USB Type-A to USB Type-C converter. Each design shows how simple, affordable, and small a solution can be using TI's USB Type-C PD and USB Type-C controllers.
USB Type-CTM Rel. 1.3 Compliant Source ControllerSTD/1.5-A Current Capability Advertisement on CC LinesConnector Attach/Detach DetectionSuper Speed Polarity DeterminationVBUS and VCONN (TPS25820) Application and Discharge with Internal Fixed Current Limit
Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Verpackung | L (µH) | IRP,40K (A) | ISAT,30% (A) | RDC typ. (mΩ) | RDC max. (mΩ) | fres (MHz) | Montageart | Anwendung | Interface typ | Gender | Pins (Value) (pcs) | Arbeitsspannung (V (DC)) | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR (mA) | Z @ 1 GHz (Ω) | H (mm) | Typ | Muster | |
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150080GS75000 | SPEC | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WL-SMCW SMT Mono-color Chip LED Waterclear | 525 | Grün | 515 | 450 | 3.2 | InGaN | 140 | – | – | – | 0805 | -40 °C up to +85 °C | – | – | – | 2 | 1.25 | – | Tape and Reel | – | – | – | – | – | – | SMT | – | – | – | – | – | – | – | – | – | – | 0.7 | – | |||
74279226101 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-MPSB EMI Multilayer Power Suppression Bead | – | – | – | – | – | – | – | – | – | – | 1812 | -55 °C up to +125 °C | – | – | – | 4.5 | 3.2 | 0.46 | – | – | – | – | 4.5 | 6 | – | SMT | – | – | – | – | – | 100 | 160 | 1100 MHz | 8000 | 150 | 2.3 | High Current | |||
885012105011 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 10 V(DC) | – | – | – | – | – | – | – | 220 nF | ±20% | 10 | 0402 | -55 °C up to +85 °C | 5 | 2.3 GΩ | X5R Klasse II | 1 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | – | 0.5 | – | |||
632712000011 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-COM USB 3.1 Type C Plug Horizontal SMT 0.8 mm | – | – | – | – | – | – | – | – | – | – | – | -25 °C up to +105 °C | – | 1000 MΩ | – | – | – | – | Tape and Reel with Cap | – | – | – | – | – | – | SMT | USB 3.1 | Type C | Plug | 22 | 20 | – | – | – | 5000 | – | – | Horizontal | ||
632723300011 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-COM USB 3.1 Type C Receptacle Horizontal THR / SMT | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | 1000 MΩ | – | – | – | – | Tape and Reel | – | – | – | – | – | – | THR | USB 3.1 | Type C | Receptacle | 24 | 20 | – | – | – | 5000 | – | – | Horizontal | ||
629004113921 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-COM USB 2.0 Plug Type A SMT w. Clip | – | – | – | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | 1000 MΩ | – | – | – | – | Tube | – | – | – | – | – | – | SMT | USB 2.0 | Type A | Plug | 4 | 30 | – | – | – | 1500 | – | – | Horizontal | ||
74439346100 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-XHMI SMT Speicherdrossel | – | – | – | – | – | – | – | – | – | – | 6060 | -40 °C up to +125 °C | – | – | – | 6.65 | 6.45 | – | – | 10 | 6.4 | 9.7 | 26.5 | 29.15 | 18 | SMT | – | – | – | 2 | – | – | – | – | 5000 | – | 6.1 | – |
Artikel Nr. | Datenblatt | Simulation | |
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150080GS75000 | SPEC | ||
74279226101 | SPEC | ||
885012105011 | SPEC | ||
632712000011 | SPEC | – | |
632723300011 | SPEC | – | |
629004113921 | SPEC | – | |
74439346100 | SPEC |
Muster |
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Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | λDom typ. (nm) | Farbe | λPeak typ. (nm) | IV typ. (mcd) | VF typ. (V) | Chiptechnologie | 2θ50% typ. (°) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Verpackung | L (µH) | IRP,40K (A) | ISAT,30% (A) | RDC typ. (mΩ) | RDC max. (mΩ) | fres (MHz) | Montageart | Anwendung | Interface typ | Gender | Pins (Value) (pcs) | Arbeitsspannung (V (DC)) | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR (mA) | Z @ 1 GHz (Ω) | H (mm) | Typ | Muster |
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