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Texas Instruments TPS61178RNWR | Demoboard TIDA-010057
Ultrasound smart probe power supply reference design
Details
| Topologie | Sonstige Topologie |
Beschreibung
Significant technological advancements and high degree of integration in Medical imaging, especially hand-held ultrasound smart probes, are pushing engineers to come up with highly-efficient, noise immune power solutions in a small size. This reference design documents end to end power and data solution for our high performance 128-channel Tx/64-channel Rx ultrasound smart probe solution with TX7332 transmit chip and AFE5832LP receive chip. The power tree includes a single-stage transformer-less HV generation (up to +/- 80V & height <5mm) for transmit and the point-of-load LV for the AFEs & FPGA from a 5V USB Type-C™ input. This design enables low-noise (<10mV ripple) efficient rails and better thermal performance (< 10°C temp rise) achieving system efficiency ~80%, receive data SNR > 55dB and ultra-compact size (90mm x 45mm x 20mm). All power rails can be synchronized to an external clock using our integrated buffer-divider CDCE949. This design also supports 1S battery input with a normal ultrasound operation of up to 2 hours.
Eigenschaften
- Transformer less dual rail HV (±80V @ 25 mA) generation from 5V USB in single stage implementation to meet component height requirement of < 5mm
- Low ripple and LV supply for the front end and FPGA from a 5V USB Type-C input
- Compact board size (< 90mm x 45 mm x 20mm)
- End to End System Efficiency ~80% running at full load
- SNR > 55dB (Noise Floor below -90dB)
- EN/DISABLE supplies for power optimization and all rails can be synchronized to external clock
- Accurate real time power consumption measurement using high performance instrumentation amplifiers INA231
- High speed data acquisition over USB Type C up to 4.2 Gbps
Typische Anwendungen
- Ultrasound smart probe
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | IR (mA) | RDC (Ω) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Verpackung | L (µH) | IR 1 (mA) | ISAT (mA) | fres (MHz) | Montageart | Anwendung | Interface typ | Gender | Pins (Value) (pcs) | IR 1 (mA) | Arbeitsspannung (V (DC)) | H (mm) | Betätigungskraft (Value) (g) | Elektrische Lebensdauer (Cycles) | Actuator-Farbe | Dampfphasenprozess | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR 2 (mA) | RDC max. (Ω) | Typ | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 742792609 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-CBF SMT-Ferrit | 2000 | – | – | – | – | 0603 | -55 °C up to +125 °C | – | – | – | – | 1.6 | 0.8 | 0.3 | – | – | 2000 | – | – | SMT | – | – | – | – | 3000 | – | 0.8 | – | – | – | – | 30 | 40 | 1000 MHz | 3000 | 0.04 | High Current | ||
 | 782633601 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-CBA SMT EMI Suppression Ferrite Bead | 1000 | 0.2 | – | – | – | 0603 | -55 °C up to +125 °C | – | – | – | – | 1.6 | 0.8 | 0.3 | – | – | – | – | – | SMT | – | – | – | – | – | – | 0.8 | – | – | – | – | 600 | 660 | 190 MHz | – | – | High Current | ||
 | 74479775233 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-PMI Power-Multilayer-Induktivität | – | 0.2 | – | – | – | 0805 | -40 °C up to +125 °C | 25 | – | – | – | 2 | 1.2 | – | – | 3.3 | 700 | 280 | 30 | SMT | – | – | – | 2 | – | – | 1 | – | – | – | – | – | – | – | 1000 | 0.25 | Low RDC | ||
 | 74404054150 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-LQS SMT-Speicherdrossel | 2000 | 0.086 | – | – | – | 5040 | -40 °C up to +125 °C | – | – | – | – | 5 | 5 | – | – | 15 | – | 2200 | 22 | SMT | – | – | – | – | – | – | 4 | – | – | – | – | – | – | – | – | – | – | ||
| 74404084101 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-LQS SMT-Speicherdrossel | 1200 | 0.29 | – | – | – | 8040 | -40 °C up to +125 °C | – | – | – | – | 8 | 8 | – | – | 100 | – | 1500 | 6.4 | SMT | – | – | – | – | – | – | 4.2 | – | – | – | – | – | – | – | – | – | – | ||
 | 744043102 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WE-TPC SMT-Speicherdrossel | 140 | – | – | – | – | 4828 | -40 °C up to +125 °C | – | – | – | – | 4.8 | 4.8 | – | – | 1000 | – | 80 | 2.3 | SMT | – | – | – | 2 | – | – | 2.8 | – | – | – | – | – | – | – | – | 7 | – | ||
 | 885012005061 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | 100 pF | ±5% | 50 | 0402 | -55 °C up to +125 °C | 1000 | – | 10 GΩ | NP0 Klasse I | 1 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | 0.5 | – | – | – | – | – | – | – | – | – | – | ||
| 885012205031 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 16 V(DC) | – | – | 10 nF | ±10% | 16 | 0402 | -55 °C up to +125 °C | – | 3.5 | 10 GΩ | X7R Klasse II | 1 | 0.5 | 0.25 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | 0.5 | – | – | – | – | – | – | – | – | – | – | ||
| 885012206048 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 16 V(DC) | – | – | 220 nF | ±10% | 16 | 0603 | -55 °C up to +125 °C | – | 5 | 2.3 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.4 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | 0.8 | – | – | – | – | – | – | – | – | – | – | ||
| 885012206052 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 16 V(DC) | – | – | 1 µF | ±10% | 16 | 0603 | -55 °C up to +125 °C | – | 10 | 0.1 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.4 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | 0.8 | – | – | – | – | – | – | – | – | – | – | ||
| 885012206095 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | 100 nF | ±10% | 50 | 0603 | -55 °C up to +125 °C | – | 3 | 5 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.4 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | 0.8 | – | – | – | – | – | – | – | – | – | – | ||
| 885012207026 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 10 V(DC) | – | – | 10 µF | ±10% | 10 | 0805 | -55 °C up to +125 °C | – | 10 | 0.01 GΩ | X7R Klasse II | 2 | 1.25 | 0.5 | 7" Tape & Reel | – | – | – | – | – | – | – | – | – | – | – | 1.25 | – | – | – | – | – | – | – | – | – | – | ||
 | 434153017835 | SPEC | – | 5 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WS-TASV J-Bend SMT Tact Switch 3.5x2.9 mm | 50 | – | – | – | 12 | – | -40 °C up to +85 °C | – | – | 100 MΩ | – | – | – | – | Tape and Reel | – | – | – | – | – | – | – | – | – | – | – | 1.7 | 350 | 200000 | Blau | nicht spezifiziert | – | – | – | – | – | – | |
 | 632723300011 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-COM USB 3.1 Type C Receptacle Horizontal THR / SMT | 5000 | – | – | – | – | – | -40 °C up to +105 °C | – | – | 1000 MΩ | – | – | – | – | Tape and Reel | – | – | – | – | THR | USB 3.1 | Type C | Receptacle | 24 | – | 20 | – | – | – | – | – | – | – | – | – | – | Horizontal |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | IR (mA) | RDC (Ω) | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Verpackung | L (µH) | IR 1 (mA) | ISAT (mA) | fres (MHz) | Montageart | Anwendung | Interface typ | Gender | Pins (Value) (pcs) | IR 1 (mA) | Arbeitsspannung (V (DC)) | H (mm) | Betätigungskraft (Value) (g) | Elektrische Lebensdauer (Cycles) | Actuator-Farbe | Dampfphasenprozess | Z @ 100 MHz (Ω) | Zmax (Ω) | Testbedingung Zmax | IR 2 (mA) | RDC max. (Ω) | Typ | Muster |
|---|