IC-Hersteller Texas Instruments

IC-Hersteller (99)

Texas Instruments TPS74201RGRT | Demoboard TIDA-010057

Ultrasound smart probe power supply reference design

Details

TopologieSonstige Topologie
IC-RevisionE2

Beschreibung

Significant technological advancements and high degree of integration in Medical imaging, especially hand-held ultrasound smart probes, are pushing engineers to come up with highly-efficient, noise immune power solutions in a small size. This reference design documents end to end power and data solution for our high performance 128-channel Tx/64-channel Rx ultrasound smart probe solution with TX7332 transmit chip and AFE5832LP receive chip. The power tree includes a single-stage transformer-less HV generation (up to +/- 80V & height <5mm) for transmit and the point-of-load LV for the AFEs & FPGA from a 5V USB Type-C™ input. This design enables low-noise (<10mV ripple) efficient rails and better thermal performance (< 10°C temp rise) achieving system efficiency ~80%, receive data SNR > 55dB and ultra-compact size (90mm x 45mm x 20mm). All power rails can be synchronized to an external clock using our integrated buffer-divider CDCE949. This design also supports 1S battery input with a normal ultrasound operation of up to 2 hours.

Eigenschaften

  • Transformer less dual rail HV (±80V @ 25 mA) generation from 5V USB in single stage implementation to meet component height requirement of < 5mm
  • Low ripple and LV supply for the front end and FPGA from a 5V USB Type-C input
  • Compact board size (< 90mm x 45 mm x 20mm)
  • End to End System Efficiency ~80% running at full load
  • SNR > 55dB (Noise Floor below -90dB)
  • EN/DISABLE supplies for power optimization and all rails can be synchronized to external clock
  • Accurate real time power consumption measurement using high performance instrumentation amplifiers INA231
  • High speed data acquisition over USB Type C up to 4.2 Gbps

Typische Anwendungen

  • Ultrasound smart probe

Weiterführende Informationen

Artikeldaten

Artikel Nr. Daten­blatt Simu­lation Downloads Status ProduktserieCTol. CVR
(V (DC))
BauformBetriebstemperaturDF
(%)
RISOKeramiktypL
(mm)
W
(mm)
H
(mm)
Fl
(mm)
VerpackungZ @ 100 MHz
(Ω)
Zmax
(Ω)
Testbedingung ZmaxIR 2
(mA)
RDC max.
(Ω)
Typ Muster
885012206052SPEC
8 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WCAP-CSGP MLCCs 16 V(DC)1 µF ±10% 16 0603 -55 °C up to +125 °C 100.1 GΩ X7R Klasse II 1.6 0.8 0.8 0.4 7" Tape & Reel
742792609SPEC
8 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WE-CBF SMT-Ferrit 0603 -55 °C up to +125 °C 1.6 0.8 0.8 0.3 30 40 1000 MHz 3000 0.04 High Current
Artikel Nr. Daten­blatt Simu­lation
885012206052SPEC
742792609SPEC
Muster
Artikel Nr. Daten­blatt Simu­lation Downloads Status ProduktserieCTol. CVR
(V (DC))
BauformBetriebstemperaturDF
(%)
RISOKeramiktypL
(mm)
W
(mm)
H
(mm)
Fl
(mm)
VerpackungZ @ 100 MHz
(Ω)
Zmax
(Ω)
Testbedingung ZmaxIR 2
(mA)
RDC max.
(Ω)
Typ Muster