IC manufacturers Texas Instruments

IC manufacturers (103)

Texas Instruments TPS74201RGRT | Demoboard TIDA-010057

Ultrasound smart probe power supply reference design

Overview

TopologyOther Topology
IC revisionE2

Description

Significant technological advancements and high degree of integration in Medical imaging, especially hand-held ultrasound smart probes, are pushing engineers to come up with highly-efficient, noise immune power solutions in a small size. This reference design documents end to end power and data solution for our high performance 128-channel Tx/64-channel Rx ultrasound smart probe solution with TX7332 transmit chip and AFE5832LP receive chip. The power tree includes a single-stage transformer-less HV generation (up to +/- 80V & height <5mm) for transmit and the point-of-load LV for the AFEs & FPGA from a 5V USB Type-C™ input. This design enables low-noise (<10mV ripple) efficient rails and better thermal performance (< 10°C temp rise) achieving system efficiency ~80%, receive data SNR > 55dB and ultra-compact size (90mm x 45mm x 20mm). All power rails can be synchronized to an external clock using our integrated buffer-divider CDCE949. This design also supports 1S battery input with a normal ultrasound operation of up to 2 hours.

Features

  • Transformer less dual rail HV (±80V @ 25 mA) generation from 5V USB in single stage implementation to meet component height requirement of < 5mm
  • Low ripple and LV supply for the front end and FPGA from a 5V USB Type-C input
  • Compact board size (< 90mm x 45 mm x 20mm)
  • End to End System Efficiency ~80% running at full load
  • SNR > 55dB (Noise Floor below -90dB)
  • EN/DISABLE supplies for power optimization and all rails can be synchronized to external clock
  • Accurate real time power consumption measurement using high performance instrumentation amplifiers INA231
  • High speed data acquisition over USB Type C up to 4.2 Gbps

Typical applications

  • Ultrasound smart probe

Products

Order Code
Data­sheet
Simu­lation
Downloads
Status
Product series
C
Tol. C
VR(V (DC))
Size
Operating Temperature
DF(%)
RISO
Ceramic Type
L(mm)
W(mm)
H(mm)
Fl(mm)
Packaging
Z @ 100 MHz(Ω)
Zmax(Ω)
Test Condition Zmax
IR 2(mA)
RDC max.(Ω)
Type
Samples
WCAP-CSGP MLCCs 16 V(DC), 1 µF, ±10%
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Capacitance1 µF
Capacitance±10% 
Rated Voltage16 V (DC)
Size0603 
Operating Temperature -55 °C up to +125 °C
Dissipation Factor10 %
Insulation Resistance0.1 GΩ
Ceramic TypeX7R Class II 
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.4 mm
Packaging7" Tape & Reel 
WE-CBF SMT EMI Suppression Ferrite Bead, –, –
Simu­lation
Status Activei| Production is active. Expected lifetime: >10 years.
Size0603 
Operating Temperature -55 °C up to +125 °C
Length1.6 mm
Width0.8 mm
Height0.8 mm
Pad Dimension0.3 mm
Impedance @ 100 MHz30 Ω
Maximum Impedance40 Ω
Maximum Impedance1000 MHz 
Rated Current 23000 mA
DC Resistance0.04 Ω
TypeHigh Current