OverviewAll product unitsProduct unitAutomotiveProduct groupREDCUBE TerminalsProduct seriesWP-PFIFUA REDCUBE PRESS-FIT Internal Thread Full Plain

WP-PFIFUA REDCUBE PRESS-FIT Internal Thread Full Plain NEW

WP-PFIFUA REDCUBE PRESS-FIT Internal Thread Full Plain

Applications

  • High current Wire-to-Board connections up to 250 A
  • Mounting of copper bars on PCBs
  • Installation of laminated fuses
  • Installation of IGBT modules
  • Suitable for rough environmental condition

Products

REDCUBE PRESS-FIT

Applications, Perfomance & Press-Fit Process

Applications

The current rating of REDCUBE PRESS-FIT is impressive. With the same ampacity, REDCUBE PRESS-FIT has the lowest heat development compared to other parts that supply power for PCBs.

  • High current Wire-to-Board connections up to 250 A
  • Mounting of copper bars on PCBs
  • Installation of laminated fuses 
  • Installation of IGBT modules
  • Suitable for rough enviromental condition

Remarkable Performance

With the lowest Failure-In-Time value, REDCUBE PRESS-FIT is the most reliable technology on PCB. The FIT value is up to 30 times better than that of a SMD solder joint. REDCUBE PRESS-FIT is suitable for two-side mounting and allows very compact design of modules.

  • Simple & quick processing
  • No cold solder joints
  • High process safety
  • Low self heating
  • Two-sided mounting of PCBs

PRESS-FIT Process

Pressing the pins into the PCB, a high friction between pin and plated through-hole generates a homogeneous cold-welding between materials. No other technology transfers power up to 250 A at this low heat development.

  • Homogeneous material transition between pin and through-hole plating
  • Contact resistance less than 200 μΩ
  • Gastight electrical and mechanical connection
  • Extremely strong mechanical connection