IC-Hersteller Infineon Technologies

IC-Hersteller (99)

Infineon Technologies 1EDC20I12MH

1200 V CoolSiCTM MOSFET in D2Pak with coreless isolated gate driver reference board

Details

TopologieSonstige Topologie
IC-Revision2.0

Beschreibung

The two reference boards are designed as daughter boards to fit the 1200 V CoolSiCTM MOSFET in TO-247 3-/4-pin evaluation platform. By installing the reference daughter board (hereafter called ‘daughter board’) on the evaluation platform (hereafter called ‘main board’), the user can do a double pulse test to evaluate the performance of the CoolSiCTM MOSFET and coreless isolated gate drivers.

Eigenschaften

  • Both daughter boards utilize insulated metal substrate (IMS), which provides an excellent thermalconduction capability.
  • All the components are surface mounted devices (SMD) due to the IMS board type.
  • Creepage is at least 4 mm to ensure the safe operation under 800 VDC bus voltage.

Typische Anwendungen

  • ndustrial heating and welding
  • Power Management (SMPS)-Reference Design
  • Solutions for solar energy systems

Weiterführende Informationen

Artikeldaten

Artikel Nr. Daten­blatt Downloads Status ProduktseriePins (Value)
(pcs)
ReihenGenderTypIR
(A)
Verpackung Muster
61000418321SPEC
6 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WR-PHD 2.54 mm SMT Pin Header 4 Single Pin Header Straight Type 2 3 Tube
61000421121SPEC
6 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WR-PHD 2.54 mm SMT Dual Pin Header 4 Dual Pin Header Gerade 3 Tube
61000621121SPEC
6 Dateien Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre.WR-PHD 2.54 mm SMT Dual Pin Header 6 Dual Pin Header Gerade 3 Tube
Muster
Artikel Nr. Daten­blatt Downloads Status ProduktseriePins (Value)
(pcs)
ReihenGenderTypIR
(A)
Verpackung Muster