IC-Hersteller Infineon Technologies
IC-Hersteller (99)
- Alle Hersteller
Analog Devices
Infineon Technologies
Microchip
Onsemi
Renesas
ROHM
STMicroelectronics
Texas Instruments
- 3peak incorporated (27)
- Ablic (23)
- Advanced Power (4)
- Allegro Microsystems (84)
- Alpha & Omega Semiconductor (37)
- AnalogySemi (3)
- AnDAPT Inc (163)
- Anpec (13)
- AXElite (2)
- Backward (6)
- Bright Power Semiconductor (1)
- Broadcom (47)
- Cambridge GaN Devices (18)
- Chipanalog Micro (10)
- Cologne Chips (1)
- Convenient Power (1)
- Dialog Semiconductor (12)
- Diodes Incorporated (238)
- Divimath (8)
- Elmos AG (1)
- EPC (99)
- e-Peas Semiconductors (1)
- Eta Solutions Co. Ltd. (9)
- GaN Systems (7)
- GaNPower (3)
- Giantec (1)
- Gstek Wuxi (1)
- Helix Semiconductor (7)
- Ikanos (3)
- IKON (1)
- Indie Semiconductor (5)
- Innovision Semiconductor Inc (2)
- Intel (80)
- Inventchip Technology (3)
- ISSI (51)
- JoulWatt (20)
- KDPOF (2)
- Kinetic Technology (10)
- Lattice semiconductor Corporation (19)
- Littelfuse (1)
- M3 Technology (M3Tek) (7)
- Macnica (16)
- MaxLinear (175)
- MikroE (8)
- MindCet (2)
- Monolithic Power Systems (931)
- Navitas Semiconductor Inc (6)
- NewEdge Technologies, Inc. (1)
- Nexperia (32)
- Nisshinbo Micro Device Inc. (10)
- Nordic Semiconductor (1)
- Novosense Micro (1)
- NXP (314)
- O2 Micro International Ltd (10)
- On Bright (7)
- Panasonic (2)
- PN Junction Semiconductor (2)
- Power Integrations (102)
- Pulsiv (19)
- Qorvo (87)
- Realsil SuRealsil(tek) Microelectronics (1)
- Richtek (296)
- Sanken Electric Co., Ltd. (16)
- Sckipio (6)
- Semtech (90)
- SG-Micro (33)
- Silanna Semiconductor (8)
- Silergy Corporation (29)
- Silicon Laboratory Inc. (104)
- Silicontent Technology (57)
- Silvertel (56)
- Skycore Semiconductors (1)
- Skyworks (31)
- Southchip (8)
- Summit Wireless (1)
- Tagore Tech (7)
- Taiwan Semiconductor (1)
- TDK Corporation (1)
- Tempo Semiconductor (1)
- Torex (37)
- Toshiba (25)
- Transphorm (21)
- TransSIP (2)
- Union (21)
- uPI Semiconductor (2)
- Valens Semiconductor (18)
- Wise Integration (1)
- Wolfspeed (8)
- Xilinx (22)
- XL Semiconductor (3)
- XYSemi (62)
Infineon Technologies 2DIB0410F | Demoboard EVAL_ISO_2DIB0410F
Evaluation board for ISOFACE™ dual-channel digital isolators
Details
| Topologie | Sonstige Topologie |
| Eingangsspannung | 3.3-5.6 V |
| Ausgang 1 | 6.5 V / 10 A |
| IC-Revision | 1.0 |
Beschreibung
This design was developed to evaluate the performance of Infineon’s ISOFACE™ 2-channel digital isolators. It features the 2DIB0410F with 2 forward and 0 reverse channels and a low default output.
Eigenschaften
- High common mode transient immunity
- Accurate timing performance
- TTL/CMOS input thresholds and default fail-safe output state
- Both component and system-level certification
Typische Anwendungen
- Server, Telecom SMPS
- Industrial automation, Motor control
- Solar
Weiterführende Informationen
Artikeldaten
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Anwendung | PCB/Kabel/Panel | Modularity | Wire Section | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Leiterplattendicke (mm) | f | Mittelkontakt | Pins (Value) (pcs) | Reihen | H (mm) | Gender | Typ | IR (A) | Verpackung | Muster | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | 691213510002 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-TBL Serie 2135 - 5.08 mm Horizontal Entry Modular w. Rising Cage Clamp | Rising Cage Clamp | PCB | Ja | 14 to 30 (AWG) 2.08 to 0.0509 (mm²) | – | – | – | – | -30 °C up to +120 °C | – | – | – | – | 10.16 | – | – | – | – | – | 2 | – | – | – | Horizontal | 14 | Karton | |
 | 885012006052 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | 15 pF | ±5% | 50 | 0603 | -55 °C up to +125 °C | 700 | – | 10 GΩ | NP0 Klasse I | 1.6 | 0.8 | 0.4 | – | – | – | – | – | 0.8 | – | – | – | 7" Tape & Reel | ||
| 885012206076 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | 1 µF | ±10% | 25 | 0603 | -55 °C up to +125 °C | – | 10 | 0.5 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.4 | – | – | – | – | – | 0.8 | – | – | – | 7" Tape & Reel | ||
| 885012206095 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 50 V(DC) | – | – | – | – | 100 nF | ±10% | 50 | 0603 | -55 °C up to +125 °C | – | 3 | 5 GΩ | X7R Klasse II | 1.6 | 0.8 | 0.4 | – | – | – | – | – | 0.8 | – | – | – | 7" Tape & Reel | ||
 | 61300311121 | SPEC | – | 6 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-PHD 2.54 mm THT Pin Header | – | – | – | – | – | – | – | – | -40 °C up to +105 °C | – | – | 1000 MΩ | – | 7.62 | – | – | – | – | – | 3 | Single | – | Pin Header | Gerade | 3 | Beutel | |
 | 60312202114514 | SPEC | – | 7 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WR-SMA PCB End Launch | – | PCB | – | – | – | – | – | – | -65 °C up to +165 °C | – | – | 5000 MΩ | – | – | – | – | 1.6 | DC~18 GHz | Ø 0.51 WIDE x 0.25 THK | – | – | – | Jack | – | – | Tray | |
| 885012106031 | SPEC | 8 Dateien | Aktiv i| Produktion ist aktiv. Erwartete Lebenszeit: >10 Jahre. | WCAP-CSGP MLCCs 25 V(DC) | – | – | – | – | 10 µF | ±20% | 25 | 0603 | -55 °C up to +85 °C | – | 20 | 0.01 GΩ | X5R Klasse II | 1.6 | 0.8 | 0.35 | – | – | – | – | – | 0.8 | – | – | – | 7" Tape & Reel |
| Artikel Nr. | Datenblatt | Simulation | |
|---|---|---|---|
| 691213510002 | SPEC | – |
| 885012006052 | SPEC | |
| 885012206076 | SPEC | |
| 885012206095 | SPEC | |
| 61300311121 | SPEC | – |
| 60312202114514 | SPEC | – |
| 885012106031 | SPEC |
| Muster |
|---|
| Artikel Nr. | Datenblatt | Simulation | Downloads | Status | Produktserie | Anwendung | PCB/Kabel/Panel | Modularity | Wire Section | C | Tol. C | VR (V (DC)) | Bauform | Betriebstemperatur | Q | DF (%) | RISO | Keramiktyp | L (mm) | W (mm) | Fl (mm) | Leiterplattendicke (mm) | f | Mittelkontakt | Pins (Value) (pcs) | Reihen | H (mm) | Gender | Typ | IR (A) | Verpackung | Muster |
|---|